A3PE600-2PQG208I - 600K Gate ProASIC3E FPGA 208-PQFP | Microsemi
부품 번호: A3PE600-2PQG208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.4 | $5,540.00 |
| 500 | $49.9 | $24,950.00 |
| 1,000 | $45.2 | $45,200.00 |
A3PE600-2PQG208I 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through configurable logic blocks and programmable interconnects. Within the programmable logic hierarchy, the ProASIC3E family sits in the low-density, flash-based, non-volatile FPGA segment, positioned between CPLDs and high-end SRAM FPGAs. Because configuration data is stored on-chip in flash cells, ProASIC3E devices are single-chip solutions that do not require an external configuration PROM, reducing bill-of-materials cost and improving security against bitstream theft.
Key features include a 1.5V core supply (1.425V to 1.575V operating range), system performance up to 310 MHz, 130nm flash-based CMOS technology, and industrial temperature operation from -40C to +100C junction temperature (indicated by the I suffix). The -2 speed grade balances performance and cost within the family. Embedded RAM blocks support FIFOs, dual-port memories, and bus interfacing, while abundant user I/O supports common I/O standards for glue logic, bus bridging, and control applications.
Technically, the ProASIC3E architecture uses a sea-of-gates fabric with VersTiles logic elements and flash-based switching, giving instant-on behavior at power-up with no configuration time. The 600K-gate density suits mid-complexity designs such as protocol bridging, motor control, display interfaces, and avionics subsystems. Microchip datasheets position the family as a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets.
Typical applications include industrial automation control, communications line-card glue logic, and aerospace/avionics subsystems where single-chip, instant-on, radiation-tolerant-heritage flash FPGAs are preferred.
Design consideration: use Libero SoC from Microchip for synthesis and place-and-route; power the 1.5V core with a regulator rated for inrush during flash read at power-up.
This page synthesizes distributor stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE600-2PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE600-2PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Configuration Memory, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE1500-1PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$29.4 / 개
데이터시트 보기 →A3PE1500-2PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$59.9 / 개
데이터시트 보기 →A3PE3000-1PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$59.9 / 개
데이터시트 보기 →A3PE3000L-PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$48.9 / 개
데이터시트 보기 →A3P600-PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$68.08 / 개
데이터시트 보기 →A3P600-2PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$71.3 / 개
데이터시트 보기 →A3PE600-2PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 600,000 |
| User I/O | 147 |
| Total RAM Bits | 110592 |
| 공급 전압 | 1.425 V to 1.575 V (1.5 V core) |
| Maximum System Frequency | 310 MHz |
| Technology | 130 nm flash-based CMOS |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40C to +100C junction) |
| 패키지 | 208-BFQFP (208-PQFP, 28x28 mm) |
| 실장 유형 | Surface Mount |
| Configuration Memory | On-chip flash (single-chip, non-volatile) |
| Programming Technology | Flash (reprogrammable, instant-on) |
| 카테고리 | FPGA - Field Programmable Gate Array |
| 동작 온도 범위 | -40C to +100C (junction) |
A3PE600-2PQG208I 208-bfqfp (208-pqfp, 28x28 mm) 핀 구성 가이드
A3PE600-2PQG208I(208-bfqfp (208-pqfp, 28x28 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE600-2PQG208I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE600-2PQG208I 적합 용도: 6 애플리케이션s: Industrial Automation Control, Communications and Networking Line Cards, Avionics and Aerospace Subsystems, ASIC Prototyping and Replacement, Display and Video Interface Control, Test and Measurement Instrument Logic.
Industrial Automation Control
The A3PE600-2PQG208I fits industrial automation controllers that need deterministic, instant-on logic without a configuration PROM. Its 600K gates and 147 user I/O absorb sensor-interface glue logic, PWM generation, and fieldbus bridging, while 110,592 RAM bits hold FIFOs between a host CPU and I/O modules. The industrial -40C to +100C junction rating covers cabinet-mounted environments, and flash-based configuration keeps outputs valid within microseconds of power-up - a key advantage over SRAM FPGAs that sit idle while loading bitstreams. Place the 1.5V core rail on a dedicated buck regulator with soft-start to manage flash read inrush; the 208-PQFP 0.5mm pitch suits standard SMT assembly lines.
추천
Communications and Networking Line Cards
In networking equipment, the A3PE600-2PQG208I bridges legacy bus protocols, handles framing and deskew, and implements status aggregation between a backplane and line-card processors. The -2 speed grade supports system clocks up to 310 MHz, adequate for parallel data paths at 100 MHz class rates, and the embedded 110,592-bit RAM implements elastic buffers and small FIFOs without external memory. Because the fabric is flash-based, data path logic is active immediately on hot-swap power application, simplifying reset sequencing. Microchip positions ProASIC3E explicitly as a cost-effective ASIC replacement for the networking/communications market, making this device a natural fit for mid-volume line-card designs.
추천
Avionics and Aerospace Subsystems
The ProASIC3E family is marketed by Microchip for avionics applications, and the A3PE600-2PQG208I suits non-flight-critical avionics functions such as ARINC-style bus interfacing, sensor conditioning, and built-in-test logic. Single-chip flash configuration eliminates the external configuration device that adds failure modes and bitstream-intercept risk, and instant-on behavior meets tight power-up readiness windows. The industrial -40C to +100C junction range covers unpressurized equipment bays, though designers must apply their own derating and qualification flow since this is the commercial/industrial part rather than a space-grade variant. Use Libero SoC with strict timing constraints and simulate power-up sequencing against the 1.425V to 1.575V core window.
추천
ASIC Prototyping and Replacement
The A3PE600-2PQG208I serves both as an ASIC prototyping vehicle and as an ASIC-replacement in production, a use case Microchip highlights for ProASIC3E. A 600K-gate capacity accommodates mid-size controllers, interface state machines, and datapath blocks synthesized from Verilog/VHDL via Libero SoC. Unlike masked ASICs, flash FPGA NRE is zero and design changes require only reprogramming; unlike SRAM FPGAs, there is no boot configuration delay or external PROM. The 208-PQFP package uses commodity 0.5mm-pitch land patterns, so prototype boards transfer directly to production. Budget for roughly 1.5V core regulation and verify utilization below about 70% to preserve routability for post-tapeout changes.
추천
Display and Video Interface Control
Display subsystems use the A3PE600-2PQG208I for panel timing generation, LVDS-style parallel data mapping, backlight PWM, and scan-rate conversion glue logic. The 147 user I/O provide enough pins for wide parallel video buses plus control signals in the 208-PQFP package, and the 110,592 RAM bits implement line buffers for simple scaling or format conversion at moderate resolutions. Instant-on flash configuration means the panel sequencing logic is alive before a host CPU completes boot, preventing visible power-up artifacts. Keep I/O bank voltages matched to the panel interface standard and route video buses with length matching; the 0.5mm PQFP pitch supports fanout on a four-layer board.
추천
Test and Measurement Instrument Logic
Bench and rack instruments use the A3PE600-2PQG208I for trigger engines, counter/timer blocks, relay-sequencing control, and host-interface glue logic. The 600K-gate fabric integrates counters and comparators with deterministic timing, and the -2 speed grade clocks state machines up to the 310 MHz system class for sub-10ns resolution work. Flash configuration ensures measurement logic is ready before calibration software loads, and the industrial temperature rating keeps bench-to-field deployments consistent. With 110,592 RAM bits, capture FIFOs buffer event streams toward a USB or Ethernet bridge. Plan decoupling with bulk and 0.1uF ceramics at the four corner VCC pin groups typical of the PQFP layout.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE600-2PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE1500-1PQG208I | A3PE3000-1PQG208I | A3PE3000L-PQG208I | A3P600-PQG208I | A3P600-2PQG208I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQG208, 28x28 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| System Gates | 600,000 | 1,500,000 | 3,000,000 | 3,000,000 | 600,000 | 600,000 |
| Family | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E (low power) | ProASIC3 | ProASIC3 |
| Speed Grade | -2 | -1 | -1 | standard | standard | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial | Industrial |
| Configuration | On-chip flash, instant-on, single-chip | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
주요 차별점
- Lowest-cost density point with pin-compatible upgrade path (vs A3PE1500-1PQG208I)
- ProASIC3E enhanced features over base ProASIC3 (vs A3P600-PQG208I)
- -2 speed grade performance (vs A3PE3000-1PQG208I)
설계 노트
Power the 1.5V core (1.425V to 1.575V window) from a dedicated buck or LDO with soft-start; flash-based ProASIC3E devices draw a configuration-related inrush at power-up that an undersized regulator can droop out of spec. Decouple the PQFP VCC pin groups with bulk 10uF plus 0.1uF ceramics placed within 2 mm of each group. Verify I/O bank voltages against your chosen standards before routing, since bank supply pins are fixed by the datasheet pinout.
The 208-PQFP uses a 0.5 mm pitch requiring careful fanout - use 4-mil traces with solder-mask-defined pads and specify an OSP or ENIG finish to avoid bridging in wave/reflow. A four-layer board (signal-ground-power-signal) gives clean return paths for 100 MHz class parallel buses. Keep the 28x28 mm body thermal relief generous: estimated thermal performance relies on copper pour under the package; consult the Microchip packaging appendix for exact theta-JA values rather than estimating.
Three frequent mistakes with this part: (1) assuming SRAM-FPGA-style external configuration - ProASIC3E is single-chip flash, so remove the config PROM footprint; (2) using the commercial-temperature A3PE600-2PQG208 in an industrial design when the -40C to +100C junction-rated PQG208I variant is required - check the I suffix; (3) exceeding roughly 70% gate utilization at 600K, which causes route congestion and forces a density migration - plan the A3PE1500/A3PE3000 PQG208 pin-compatible upgrade path from day one.
규정 준수 정보
Compliance status not stated in the provided verified web data; verify on the Microchip product page or datasheet before procurement.
