ATSAMA5D24C-CUR - ARM Cortex-A5 MPU 500MHz 256-TFBGA | Microchip
부품 번호: ATSAMA5D24C-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.95 | $169.50 |
| 100 | $14.8 | $1,480.00 |
| 500 | $12.45 | $6,225.00 |
| 1,000 | $10.2 | $10,200.00 |
ATSAMA5D24C-CUR 개요
An ARM Cortex-A5 microprocessor is a 32-bit application processor based on the ARMv7-A architecture, designed for embedded systems requiring rich operating system support such as Linux. The Cortex-A5 core within the SAMA5D2 family delivers performance comparable to older ARM9 designs while consuming significantly less power, making it ideal for battery-powered or energy-constrained industrial products. The SAMA5D2 sits within the broader category hierarchy of microprocessor (MPU) -> application processor -> SoC -> integrated circuit.
Key features include 5 µA backup current with full state retention, hardware cryptography accelerators (AES, SHA, TRNG), a peripheral touch controller, an embedded audio subsystem with I2S, and up to 1 Gbit DDR2/DDR3L support. The integrated power management unit supports multiple low-power modes including ULP0 (3.5 mA), ULP1-fast, ULP1-slow, and backup, enabling years of battery life in typical IoT edge-node use cases.
From an architectural perspective, the SAMA5D24 uses a multi-layer AHB/AXI bus matrix, L1 caches (32 KB I-cache and 32 KB D-cache), and dedicated peripheral DMA controllers for low-latency I/O. The 256-ball TFBGA at 8x8 mm represents an ultra-small footprint that simplifies PCB layout for space-constrained designs while still providing 256 pins for memory and peripheral connectivity.
Typical applications include industrial IoT gateways, HMI panels with MIPI displays, smart energy meters, building automation controllers, and connected medical devices. The combination of Cortex-A5 performance and low-power states also suits wearable health monitors and battery-backed remote sensors.
Designers should plan for a dedicated 1.2V core supply, a separate 1.8V/3.3V I/O rail, and proper DDR power sequencing. DDR layout requires matched-length traces and 100-ohm differential impedance; refer to Microchip application notes for the SAMA5D2 board design guidelines.
This page synthesizes current distributor pricing, drop-in same-package alternatives, and design notes specific to ATSAMA5D24C-CUR implementation, complementing the manufacturer datasheet with engineering context for rapid board bring-up.
드롭인 대체품: ATSAMA5D24C-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D24C-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, USB, Package, Operating Temperature, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D24B-CU
✅ 드롭인✓ 재고 있음
$10.42 / 개
데이터시트 보기 →ATSAMA5D24A-CU
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →ATSAMA5D23A-CU
✅ 드롭인✓ 재고 있음
$7.2 / 개
데이터시트 보기 →ATSAMA5D22C-CU
✅ 드롭인✓ 재고 있음
$7.14 / 개
데이터시트 보기 →ATSAMA5D225C-D1M-CU
✅ 드롭인✓ 재고 있음
$12.6 / 개
데이터시트 보기 →ATSAMA5D24C-CUR 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-A5 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 500 MHz |
| 패키지 | 256-TFBGA (8x8 mm) |
| Memory Type Supported | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Backup Current | 5 µA (state retention) |
| 동작 온도 | -40 °C to +85 °C (Industrial) |
| Graphics | 2D GPU (no 3D) |
| Display Interface | MIPI DSI LCD controller |
| Ethernet | 10/100 MAC (GMII/RGMII) |
| CAN | CAN-FD |
| Security | AES, SHA, secure key storage, TRNG |
| Audio | Embedded I2S audio subsystem |
| Touch | Peripheral touch controller (PTC) |
| Supply Voltage Core | 1.2 V |
| Supply Voltage I/O | 1.8 V / 3.3 V |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Product Family | SAMA5D2 Series |
ATSAMA5D24C-CUR 256-tfbga (8x8 mm) 핀 구성 가이드
ATSAMA5D24C-CUR(256-tfbga (8x8 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D24C-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D24C-CUR 적합 용도: 7 애플리케이션s: Industrial IoT Gateway, HMI Panel with MIPI Display, Smart Energy Meter, Building Automation Controller, Connected Medical Device, Wearable Health Monitor, Industrial Printer / Label Maker.
Industrial IoT Gateway
The ATSAMA5D24C-CUR suits industrial IoT gateways because its 500 MHz ARM Cortex-A5 core runs Linux with rich protocol stacks (MQTT, CoAP, OPC UA) while consuming only 5 µA in backup mode for battery-backed deployments. Its 10/100 Ethernet MAC plus CAN-FD enables bridged connectivity between legacy industrial buses and modern IP networks, while the hardware AES/SHA accelerators handle TLS/DTLS without CPU overhead. Compared to a Cortex-M4 gateway MCU, the A5 core delivers 5-10x the throughput for JSON parsing and MQTT pub/sub, making it a drop-in choice for predictive-maintenance edge nodes requiring both deterministic networking and OS-level security.
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HMI Panel with MIPI Display
The ATSAMA5D24C-CUR drives HMI panels through its integrated MIPI DSI LCD controller, supporting displays up to WXGA resolution with a 2D GPU acceleration layer for Qt or LVGL graphics. The 256-TFBGA package fits within the slim mechanical envelope of a 5-7 inch panel, and the Cortex-A5 500 MHz delivers smooth rendering of vector animations without offloading to a separate MCU. The peripheral touch controller (PTC) interfaces directly with projected-capacitive touch sensors, reducing BOM cost versus discrete touch ICs. This combination suits industrial control panels, medical device UIs, and smart-home control surfaces.
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Smart Energy Meter
Smart meters leverage the ATSAMA5D24C-CUR's industrial -40°C to +85°C operating range, hardware crypto for signed firmware updates, and 5 µA backup current that lets meters ride out power-line disturbances while preserving time-of-use data. The 32-bit Cortex-A5 core handles DLMS/COSEM or ANSI C12 protocols with sufficient headroom for OTA upgrade logic, while the integrated 2D GPU is available for local LCD displays showing consumption graphs. Compared to discrete MCU+ASIC meter designs, the integrated approach reduces the BOM by 2-3 components and simplifies EMC compliance testing across PLC and RF communication paths.
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Building Automation Controller
Building automation systems use the ATSAMA5D24C-CUR to consolidate HVAC, lighting, and security subsystems on a single Linux-capable processor. Its CAN-FD interfaces with HVAC controllers and BACnet MS/TP networks, while the I2S audio subsystem supports intercom or voice-announcement features. The 5 µA backup state allows the controller to retain scheduling data across power outages, and the 256-TFBGA footprint fits in flush-mount wall enclosures. Multiple Ethernet instances (via external PHYs) enable daisy-chained topology for retrofit installations where star wiring is impractical.
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Connected Medical Device
Medical devices such as patient monitors, infusion pumps, and diagnostic readers use the ATSAMA5D24C-CUR's hardware cryptography to meet FDA cybersecurity premarket guidance. The Cortex-A5 500 MHz core runs secure Linux with SELinux policies, while the integrated TRNG supplies entropy for TLS key exchange. The audio subsystem enables digital stethoscope and auscultation features through I2S codecs, and the peripheral touch controller simplifies antiseptic-wipeable touchscreen designs. Compared to x86-based medical SBCs, the A5 solution reduces power by 70%, enabling battery-backed portable operation for bedside or field-deployment scenarios.
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Wearable Health Monitor
Wearable health monitors depend on the ATSAMA5D24C-CUR's ULP0 (3.5 mA) and backup (5 µA) power modes to achieve multi-day battery life while running BLE-paired health algorithms. The Cortex-A5 executes low-power DSP-style signal processing for heart-rate and SpO2 calculation, and the I2S port interfaces with digital MEMS microphones for respiratory monitoring. The 256-TFBGA 8x8 mm package fits wrist-form-factor enclosures, and the industrial temperature grade supports fitness and clinical-grade wearable deployments. The hardware AES block accelerates BLE pairing and HIPAA-compliant data-at-rest encryption without taxing the CPU.
추천
Industrial Printer / Label Maker
Industrial label printers and small-format printers leverage the ATSAMA5D24C-CUR's combination of ARM Cortex-A5 throughput, USB host, and CAN-FD interfaces for motor-control feedback loops. The Linux-capable core renders ZPL/EPL replacement firmware stacks or bitmap fonts at line speed, while the integrated 2D GPU offloads anti-aliased rendering from the CPU. The 5 µA backup state preserves print-job queues during power loss, and the industrial temperature range supports factory-floor deployments. The 256-TFBGA 8x8 mm package fits within the slim chassis of portable label applicators used in warehouse logistics.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D24C-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D24B-CU | ATSAMA5D24A-CU | ATSAMA5D23A-CU | ATSAMA5D22C-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-TFBGA (8x8 mm) | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same |
| Core | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz |
| Silicon Revision | C | B | A | A (D23 family) | C (D22 family) | C (D225 family) |
| Backup Current | 5 µA | 5 µA | 5 µA | 5 µA | 5 µA | 5 µA |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3 up to 1 Gbit | Same as D24C | Same as D24C | Same as D24C | Same as D24C | Same as D24C |
| Approx Unit Price (qty 1) | $18.50 | $17.95 | $17.20 | $15.40 | $13.80 | $19.10 |
주요 차별점
- Lowest power Cortex-A5 MPU with 5 µA backup retention (vs ATSAMA5D24B-CU)
- Extended peripheral integration vs lower-tier SAMA5D22/23 (vs ATSAMA5D23A-CU)
- Industrial temperature grade with full SAMA5D2 feature set (vs ATSAMA5D22C-CU)
설계 노트
ATSAMA5D24C-CUR requires a tightly regulated 1.2 V core supply capable of delivering at least 800 mA peak during CPU + DDR burst, plus separate 1.8 V and 3.3 V rails for I/O domains. Power-up sequencing requires VDDBU first, then VDDANA/VDDPLL, then VDDIO, and finally VDD_CORE per the SAMA5D2 datasheet. Use Microchip's recommended PMIC such as the MIC2800 or ACT8865 to satisfy the sequencing requirements. Decoupling: place 100 nF X7R capacitors within 2 mm of every VDD pin and bulk 22 µF ceramic on each rail.
The 256-TFBGA 8x8 mm package demands a 4-layer PCB minimum with 0.4 mm ball pitch. Use Microchip's published footprint with NSMD pads and microvia-in-pad for inner-row balls. DDR traces must be length-matched within ±25 mil (data group vs DQS) and routed over a continuous ground plane; refer to SAMA5D2 Board Design Package for impedance targets (50 Ω single-ended, 100 Ω differential). Exposed balls in the center row should be tied to GND with multiple vias for thermal dissipation and return-path integrity.
Estimated: at maximum CPU load (500 MHz, all peripherals active), the ATSAMA5D24C-CUR dissipates approximately 1.2 W from a 1.2 V core supply. The 256-TFBGA package typically exhibits theta-JA of 25-30 °C/W on a 4-layer JEDEC board. Maximum junction temperature 125 °C requires ambient below ~85 °C for un-throttled operation; design thermal copper under the package and consider thermal vias beneath the center GND balls for sustained high-temperature industrial operation.
Common mistakes: (1) omitting the 32.768 kHz crystal on the slow-clock oscillator forces fallback to internal RC and increases backup current tenfold. (2) Failing to configure the boot pins (BMS, JTAG_SEL) before reset latches into QSPI mode can brick the board. (3) Routing DDR signals over a split power plane creates SI failures - keep GND continuous under the DDR region. (4) Neglecting the 1 µF cap on VDDBU during power-down can cause RTC data corruption. Reference SAMA5D2 errata sheets before final layout.
MIPI DSI lanes must be routed as 100 Ω differential pairs with intra-pair skew under 5 ps and length-matched to ±0.5 mm; keep them on inner layers with continuous ground beneath. Isolate the 24 MHz main crystal within 5 mm of the XIN/XOUT pins, surrounded by a GND keep-out and stitched guard ring. Place the QSPI flash within 25 mm of the QSPI pins and route CLK/DQ as length-matched ±2 mm. Keep high-speed digital traces (DDR, MIPI) away from the audio codec I2S lines to avoid coupling noise into DAC outputs.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade, not automotive). Halogen-free per Microchip material declaration.
