ATSAMA5D28C-LD1G-CU - 500MHz Cortex-A5 MPU, 2Gb LPDDR2 SiP
부품 번호: ATSAMA5D28C-LD1G-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $30.1 | $301.00 |
| 100 | $27.85 | $2,785.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $23.2 | $23,200.00 |
ATSAMA5D28C-LD1G-CU 개요
An Arm Cortex-A5 MPU (microprocessor unit) is a 32-bit application processor core that runs a full operating system such as Linux or Android. It sits higher in the embedded hierarchy than a microcontroller (MCU): an MCU integrates flash/RAM and peripherals with the core for bare-metal or RTOS workloads, while an MPU requires external memory and is optimized for richer software stacks. The SAMA5D2 family positions itself as an MPU bridge product - powerful enough for graphical HMI, network protocol stacks, and edge analytics, yet power-efficient enough to compete with high-end MCUs in battery-influenced designs.
Key differentiating specifications include the integrated 2 Gbit LPDDR2 memory (versus 1 Gbit DDR2 in the ATSAMA5D28C-D1G variant), the high-speed USB 2.0 with HSIC interface, ARM TrustZone technology with boot security and hardware cryptography, and a wide peripheral set including EMAC, CAN-FD, and TFT LCD controller. The integrated LPDDR2 reduces PCB footprint, BOM cost, and design complexity by eliminating external SDRAM routing.
The architecture combines a single Cortex-A5 core with Neon SIMD/DSP extensions, an L1 cache subsystem, and an L2 cache controller. The advanced peripheral touch controller, image sensor interface, and 12-bit ADC make it well-suited for human-machine interface and IoT edge nodes. Cryptographic acceleration for AES, SHA, and TRNG offloads security workloads from the CPU.
Typical applications include industrial HMI panels, IoT edge gateways, smart energy meters, building automation controllers, and connected medical devices. The wide industrial temperature range and Linux-friendly architecture make it a popular choice for industrial IoT product lines.
When designing with this part, pay attention to PCB layout for the LFBGA-289 (14x14) footprint - via-in-pad and microvia stack-up are commonly required. The integrated LPDDR2 still requires careful power-rail decoupling and length-matched routing to the MPU balls per the SAMA5D2 hardware design guidelines.
This page synthesizes distributor pricing, drop-in SAMA5D2 family alternatives, and practical design considerations not collated on a single manufacturer page, supporting faster component selection and BOM risk analysis for embedded engineering teams.
드롭인 대체품: ATSAMA5D28C-LD1G-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D28C-LD1G-CU (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, USB, Ethernet, Security.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D28C-D1G-CU
✅ 드롭인✓ 재고 있음
$23.5 / 개
데이터시트 보기 →ATSAMA5D27C-LD1G-CU
✅ 드롭인✓ 재고 있음
$18.4 / 개
데이터시트 보기 →ATSAMA5D28B-CUR
✅ 드롭인✓ 재고 있음
$12.6 / 개
데이터시트 보기 →ATSAMA5D28B-CNR
✅ 드롭인✓ 재고 있음
$17.9 / 개
데이터시트 보기 →ATSAMA5D26C-CU
✅ 드롭인✓ 재고 있음
$11.8 / 개
데이터시트 보기 →ATSAMA5D225C-D1M-CU
✅ 드롭인✓ 재고 있음
$12.6 / 개
데이터시트 보기 →ATSAMA5D28C-LD1G-CU 최대 정격 & 전기적 특성
| Core Architecture | Arm Cortex-A5 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 500 MHz |
| Integrated Memory (SiP) | 2 Gbit LPDDR2 SDRAM |
| 메모리 유형 | LPDDR2 (SiP) |
| 패키지 | 289-LFBGA (14x14 mm) |
| 동작 온도 | -40C to +85C (industrial) |
| I/O Voltage | 3.3 V |
| USB | USB 2.0 + HSIC |
| Security | ARM TrustZone, Boot Security, Cryptography (AES/SHA/TRNG) |
| Peripherals | EMAC, CAN-FD, TFT LCD controller, 12-bit ADC, image sensor interface, advanced touch controller |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| Family | SAMA5D2 |
| Grade | Industrial temperature |
ATSAMA5D28C-LD1G-CU 289-lfbga (14x14 mm) 핀 구성 가이드
ATSAMA5D28C-LD1G-CU(289-lfbga (14x14 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D28C-LD1G-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D28C-LD1G-CU 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI), IoT Edge Gateways and Protocol Bridges, Smart Energy Meters and Grid Edge Devices, Building Automation Controllers, Connected Medical Devices (Non-Life-Critical), Linux-Based Industrial IoT Sensor Hubs.
Industrial Human-Machine Interface (HMI)
The ATSAMA5D28C-LD1G-CU is a strong fit for industrial HMI panels because the 500 MHz Cortex-A5 core runs Linux with Qt or LVGL graphic stacks smoothly, while the integrated TFT LCD controller and advanced touch controller directly drive capacitive touchscreens without external bridge ICs. The integrated 2 Gbit LPDDR2 supplies the framebuffer bandwidth that 800x480 to 1280x800 WVGA panels require, with low standby current suitable for always-on industrial displays. The -40C to +85C industrial temperature rating and ARM TrustZone boot security allow it to be deployed in factory-floor operator panels without active cooling. Place decoupling capacitors within 5 mm of each power-pin ball cluster and use a 4-layer PCB stack-up with internal power planes.
추천
IoT Edge Gateways and Protocol Bridges
For IoT edge gateways, the ATSAMA5D28C-LD1G-CU offers the right balance of processing headroom and peripheral connectivity: dual EMAC for wired Ethernet, CAN-FD for industrial bus bridging, USB 2.0 with HSIC for Wi-Fi/Bluetooth module attachment, and TFT/display support for local status indication. The 500 MHz Cortex-A5 runs lightweight container runtimes (Docker, balenaOS) and protocol stacks (MQTT, OPC-UA, Modbus) concurrently. The integrated LPDDR2 SiP reduces BOM count by approximately 4 to 6 parts versus discrete SDRAM designs, which matters for cost-driven gateway SKUs. Add an external RTC and supercapacitor backup for timestamping across power events.
추천
Smart Energy Meters and Grid Edge Devices
The ATSAMA5D28C-LD1G-CU suits smart energy meters because the 12-bit ADC (with PRBS support) accurately samples current/voltage CT outputs, while the EMAC and CAN-FD interfaces connect to grid communication modules and home area network (HAN) transceivers. ARM TrustZone with hardware AES/SHA/TRNG accelerators secures over-the-air firmware updates and tamper detection. The integrated LPDDR2 keeps metrology calibration tables resident in memory, and the -40C to +85C rating covers outdoor meter enclosures. Design with TVS diodes on the AC sense inputs and a watchdog timer for IEC 62054 compliance class.
추천
Building Automation Controllers
For HVAC and building automation controllers, the ATSAMA5D28C-LD1G-CU integrates all the connectivity required: RS-485 (via UART), CAN-FD for BACnet/IP or KNX gateways, USB for service technician interfaces, and EMAC for building Ethernet backhaul. The Cortex-A5 with Neon extensions runs complex scheduling algorithms (fuzzy logic, PID, optimization routines) for multi-zone climate control. The image sensor interface accepts a low-cost CMOS camera for occupancy detection and the touchscreen controller supports in-wall control panels. Its wide industrial temperature range and 10+ year longevity commitment from Microchip make it ideal for installed-base building equipment.
추천
Connected Medical Devices (Non-Life-Critical)
In connected medical peripherals such as patient monitors, infusion pump controllers, and diagnostic analyzers, the ATSAMA5D28C-LD1G-CU provides deterministic Linux performance with ARM TrustZone isolation between safety-critical and network-facing software partitions. The TFT LCD controller drives bedside displays, the 12-bit ADC reads sensor arrays, and the EMAC/CAN-FD connect to hospital networks. The integrated LPDDR2 supports the larger framebuffers needed for waveform displays. Note: this is NOT a fit for life-support equipment - those require IEC 61508 SIL-certified processors. Add isolation barriers on patient-connected interfaces per IEC 60601-1.
추천
Linux-Based Industrial IoT Sensor Hubs
The ATSAMA5D28C-LD1G-CU is well-suited to multi-sensor industrial IoT hubs that aggregate data from MODBUS, IO-Link, and wireless sensor networks. The Cortex-A5 with Neon DSP extensions accelerates on-device analytics such as FFT vibration analysis and anomaly detection at the edge. The integrated LPDDR2 holds time-series buffers before cloud upload, and the cryptographic accelerator secures TLS 1.3 connections with negligible CPU overhead. The HSIC interface attaches a Wi-Fi 6 companion module without consuming a USB port, freeing the USB 2.0 interface for local diagnostics. Recommend using the SAMA5D2 Linux distribution from Microchip for BSP integration.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D28C-LD1G-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D28C-D1G-CU | ATSAMA5D27C-LD1G-CU | ATSAMA5D28B-CUR | ATSAMA5D28B-CNR | ATSAMA5D26C-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same |
| Core | Cortex-A5, 1 core, 500 MHz | Cortex-A5, 1 core, 500 MHz | Cortex-A5, 1 core, 500 MHz | Cortex-A5, 1 core, 500 MHz | Cortex-A5, 1 core, 500 MHz | Cortex-A5, 1 core, 500 MHz | Cortex-A5, 2 cores, 500 MHz |
| Integrated Memory | 2 Gbit LPDDR2 SiP | 1 Gbit DDR2 SiP | 2 Gbit LPDDR2 SiP | 2 Gbit LPDDR2 SiP | None (external SDRAM required) | None (external SDRAM required) | 1 Gbit DDR2 SiP |
| Family / Sub-family | SAMA5D2 / SAMA5D28 | SAMA5D2 / SAMA5D28 | SAMA5D2 / SAMA5D27 | SAMA5D2 / SAMA5D28 (B rev) | SAMA5D2 / SAMA5D28 (B rev) | SAMA5D2 / SAMA5D26 | SAMA5D2 / SAMA5D22 (dual-core) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| USB | USB 2.0 + HSIC | USB 2.0 + HSIC | USB 2.0 + HSIC | USB 2.0 + HSIC | USB 2.0 + HSIC | USB 2.0 + HSIC | USB 2.0 + HSIC |
| Security | TrustZone + AES/SHA/TRNG | TrustZone + AES/SHA/TRNG | TrustZone + AES/SHA/TRNG | TrustZone + AES/SHA/TRNG | TrustZone + AES/SHA/TRNG | TrustZone + AES/SHA/TRNG | TrustZone + AES/SHA/TRNG |
주요 차별점
- Integrated 2 Gbit LPDDR2 SiP eliminates external SDRAM (vs ATSAMA5D28B-CNR (non-SiP variant))
- LPDDR2 type for lower standby current than DDR2 (vs ATSAMA5D28C-D1G-CU (1 Gbit DDR2 SiP))
- SAMA5D28 sub-family maximizes peripheral count (vs ATSAMA5D27C-LD1G-CU (SAMA5D27 sub-family))
- Latest 'C' silicon revision with errata fixes (vs ATSAMA5D28B-CUR (B revision))
설계 노트
The ATSAMA5D28C-LD1G-CU uses a 289-LFBGA (14x14 mm) package with 0.8 mm pitch BGA balls. Use a 4-layer or 6-layer PCB stack-up with microvias on the BGA breakout layer; via-in-pad (VIPPO) is strongly recommended for the inner-row balls. Match DDR trace lengths to within +/- 25 mil (0.635 mm) for the integrated LPDDR2 interface per the SAMA5D2 hardware design guidelines, and provide a continuous ground plane beneath the BGA to control return paths. Decoupling capacitors must be placed within 2 mm of their respective power-pin balls.
Estimated: at 500 MHz full-load CPU activity with peripherals active, the ATSAMA5D28C-LD1G-CU dissipates approximately 1.0 to 1.5 W. The 289-LFBGA thermal resistance theta_JA is approximately 25 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 25 to 40 C above ambient. Within the -40C to +85C industrial envelope this is normally acceptable without a heatsink, but enclosed plastic housings should be validated with a thermocouple at the top-center of the BGA. Reduce CPU clock or use sleep states if thermal headroom is limited.
Common pitfalls with the ATSAMA5D28C-LD1G-CU include: (1) forgetting to configure the boot mode straps (BMS) before power-up - the part will not boot from the correct source without correct strap resistors; (2) leaving the JTAG pins floating rather than pulling them to a defined logic level - this can cause unintended debug entry; (3) supplying the LPDDR2 balls out of sequence during power-up, which can cause latch-up; (4) using the wrong BSP version - always use the matching SAMA5D2 Linux BSP from Microchip. Verify boot from NAND, SD card, or QSPI flash per the hardware design checklist before connecting peripherals.
Provide a low-noise LDO or DC-DC converter for the VDDCORE rail (typically 1.0 to 1.2 V) capable of at least 600 mA peak, and a separate regulator for the VDDBU backup domain (typically 1.8 V). The integrated LPDDR2 SiP requires its own VDDSDRAM rail at 1.2 V with tight load-line regulation; bypass with 10 uF X7R ceramic plus 100 nF high-frequency decoupling per power pin. Add bulk capacitance of 47 uF or more at the MPU supply input. Power-rail sequencing must follow the SAMA5D2 datasheet sequence to avoid in-rush damage to the integrated memory.
Route the EMAC signals (RGMII) with 50 ohm controlled impedance and length-matched within 50 mil; route USB differential pairs (D+/D-) at 90 ohm differential impedance with no splits in the reference ground plane. Keep the TFT LCD data bus away from the high-speed USB 2.0 lines to avoid EMI coupling. If using CAN-FD, add a common-mode choke and TVS diode at the connector. The image sensor interface (ISI) clock and data lines should be length-matched and shielded by ground on both sides for EMI immunity.
규정 준수 정보
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is a commercial/industrial MPU, not an automotive grade part. Industrial temperature grade -40C to +85C per Mouser listing.