ATSAMA5D27C-LD1G-CU - 500MHz Cortex-A5 MPU + 1Gb LPDDR2 SiP
부품 번호: ATSAMA5D27C-LD1G-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $24.584 | $24.58 |
| 10 | $23.2 | $232.00 |
| 100 | $21.5 | $2,150.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $18.4 | $18,400.00 |
ATSAMA5D27C-LD1G-CU 개요
A microprocessor (MPU) is an integrated circuit that contains a full CPU core, cache, memory management unit, and a broad peripheral set, intended to run a rich operating system such as Linux or Android. Within the embedded hierarchy, an MPU sits above a microcontroller (MCU) and below an application processor (AP); the SAMA5D2 family targets the middle ground, providing GHz-class application performance at MCU-style power budgets.
Key features include the ARM Cortex-A5 core with NEON media engine, an LCD controller with TFT/STN support up to WXGA resolution, a 720p hardware video decoder, a Peripheral Touch Controller (PTC), an embedded audio subsystem with I2S and Class D amplifier support, and advanced security through ARM TrustZone. The 1 Gbit LPDDR2 memory delivers a 32-bit data bus while keeping external pin count and power low.
The architecture integrates a 32 kHz real-time clock, multiple high-speed USB 2.0 interfaces (Host + Device), HSIC, EMAC with 1588 PTP support, CAN-FD, multiple UART/SPI/I2C instances, QSPI, and SD/eMMC interfaces. Power management is handled by an internal active/standby scheme that, combined with LPDDR2 retention, enables sub-mW standby power for battery-backed designs.
Typical applications include industrial HMI panels, smart-home gateways, point-of-sale terminals, building-automation controllers, portable medical data loggers, and connected IoT edge nodes with display. The wide peripheral mix also suits wearables with audio feedback and ruggedized field tablets.
When designing with this MPU, ensure the 0.8 mm BGA has properly designed escape routing on at least 4 PCB layers and provide adequate thermal relief; the SiP memory shares the substrate, so consult the SAMA5D2 hardware design checklist for stack-up and decoupling recommendations.
This page synthesizes distributor pricing, drop-in same-family alternatives, and design guidance not found in the manufacturer datasheet, providing engineers with a single reference for sourcing and selection.
드롭인 대체품: ATSAMA5D27C-LD1G-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D27C-LD1G-CU (동일 폼 팩터 및 풋프린트) — 차이점: Package, USB, Ethernet, Security, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D27C-LD1G-CUR
✅ 드롭인✓ 재고 있음
$14.95 / 개
데이터시트 보기 →ATSAMA5D27C-LD2G-CUR
✅ 드롭인✓ 재고 있음
$10.2 / 개
데이터시트 보기 →ATSAMA5D27C-LD2G-CU
✅ 드롭인✓ 재고 있음
$25.6 / 개
데이터시트 보기 →ATSAMA5D27C-CNVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAMA5D28C-LD1G-CUR
✅ 드롭인✓ 재고 있음
$19.4 / 개
데이터시트 보기 →ATSAMA5D27C-LD1G-CU 최대 정격 & 전기적 특성
| Manufacturer | Microchip Technology |
| Series | SAMA5D2 |
| Core Processor | ARM Cortex-A5 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 500 MHz |
| On-package Memory | 1 Gbit LPDDR2 SDRAM |
| 메모리 유형 | LPDDR2 (32-bit data bus) |
| 패키지 | 361-TFBGA, 16x16 mm, 0.8 mm ball pitch |
| 동작 온도 | -40C to +85C (Industrial) |
| LCD Controller | Yes, up to WXGA |
| Video Decoder | 720p hardware H.264/MPEG-4 |
| Touch Controller | Peripheral Touch Controller (PTC) |
| Security | ARM TrustZone, tamper detection |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
ATSAMA5D27C-LD1G-CU 361-tfbga, 16x16 mm, 0.8 mm ball pitch 핀 구성 가이드
ATSAMA5D27C-LD1G-CU(361-tfbga, 16x16 mm, 0.8 mm ball pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D27C-LD1G-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D27C-LD1G-CU 적합 용도: 7 애플리케이션s: Industrial HMI and Touch Panels, Smart Home and Building Automation Gateways, Point-of-Sale (POS) Terminals, Portable Medical Data Loggers, Connected IoT Edge Nodes with Display, Audio-Enabled Wearable Devices, Ruggedized Field Tablets.
Industrial HMI and Touch Panels
The ATSAMA5D27C-LD1G-CU is purpose-built for industrial HMI panels with its integrated LCD controller supporting up to WXGA (1366x768) resolution and built-in Peripheral Touch Controller that eliminates external touch ICs. The 500 MHz Cortex-A5 plus NEON media engine provides fluid Qt/Linux graphical interfaces, while 1 Gbit of LPDDR2 supports full-screen graphical assets. Its -40C to +85C industrial rating ensures reliability in factory-floor enclosures, and ARM TrustZone enables secure boot for protected HMI environments.
추천
Smart Home and Building Automation Gateways
The ATSAMA5D27C-LD1G-CU delivers the right balance for connected gateways with its Cortex-A5 CPU capable of running Linux-based protocol stacks (Zigbee/IP bridges, Thread, Matter), 1 Gbit LPDDR2 for room-sized routing tables, and low standby power from LPDDR2 retention. Dual USB 2.0 ports and 10/100 EMAC with 1588 PTP enable multi-radio gateway architectures. The embedded audio subsystem with I2S and Class D amplifier allows voice-prompt feedback in wall-mounted smart speakers and intercom panels.
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Point-of-Sale (POS) Terminals
For retail POS terminals, the ATSAMA5D27C-LD1G-CU offers Cortex-A5 class performance to drive the touchscreen UI and run encryption for payment transactions. The 1 Gbit LPDDR2 memory supports full Linux desktop environments with Chromium-based browser POS software, while the 720p video decoder handles promotional content playback. Integrated EMAC with PTP ensures synchronized transactions, and CAN-FD enables communication with attached peripherals such as barcode scanners, receipt printers, and cash drawers.
추천
Portable Medical Data Loggers
The ATSAMA5D27C-LD1G-CU suits portable medical data loggers through its ultra-low standby power from LPDDR2 retention (sub-mW idle), 500 MHz processing headroom for compressing sensor streams, and ARM TrustZone for HIPAA-compliant data protection. The integrated audio subsystem enables voice annotation of patient events, while the LCD controller supports direct TFT display of waveforms. Industrial temperature rating supports disinfection-storage environments and field-medical deployments in challenging climates.
추천
Connected IoT Edge Nodes with Display
For edge IoT nodes with local displays, the ATSAMA5D27C-LD1G-CU combines edge-compute capability (Cortex-A5 with NEON) with on-package LPDDR2 to handle sensor fusion, on-device analytics, and TFT graphics. Multiple UART/SPI/I2C interfaces allow direct attachment of sensor arrays without external bridges. CAN-FD supports industrial IoT protocols, and the 32 kHz RTC with retention RAM enables wake-on-event operation with months of battery life in periodic-sampling applications.
추천
Audio-Enabled Wearable Devices
The ATSAMA5D27C-LD1G-CU enables audio-rich wearables with its embedded audio subsystem including I2S ports and a Class D amplifier interface that drives speakers directly. The 1 Gbit LPDDR2 memory stores large audio buffers for low-latency playback, while the Cortex-A5 + NEON engine handles real-time codec processing (MP3, AAC, Opus). Low standby power from LPDDR2 retention extends battery life, and the small 16x16 mm BGA footprint fits into wrist-mounted form factors for fitness bands and smartwatches.
추천
Ruggedized Field Tablets
The ATSAMA5D27C-LD1G-CU is well suited to ruggedized field tablets used in construction, agriculture, and utilities. Its industrial -40C to +85C temperature range survives outdoor deployment, and the integrated LCD controller drives sunlight-readable TFTs up to WXGA. The 720p hardware video decoder enables playback of training and inspection videos in the field. With dual USB 2.0 ports, EMAC, and CAN-FD, the tablet can attach to instruments, drones, and vehicle diagnostics systems without additional interface chips.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D27C-LD1G-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D27C-LD1G-CUR | ATSAMA5D27C-LD2G-CUR | ATSAMA5D27C-LD2G-CU | ATSAMA5D27C-CNVAO | ATSAMA5D28C-LD1G-CUR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) |
| Core Architecture | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz |
| On-package Memory | 1 Gbit LPDDR2 | 1 Gbit LPDDR2 | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 | 1 Gbit LPDDR2 | 1 Gbit LPDDR2 |
| Memory Type | LPDDR2 (32-bit bus) | LPDDR2 (32-bit bus) | LPDDR2 (32-bit bus) | LPDDR2 (32-bit bus) | LPDDR2 (32-bit bus) | LPDDR2 (32-bit bus) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Automotive AEC-Q100) | -40C to +85C (Industrial) |
| Series / Sub-family | SAMA5D27 | SAMA5D27 | SAMA5D27 | SAMA5D27 | SAMA5D27 | SAMA5D28 |
주요 차별점
- On-package 1 Gbit LPDDR2 memory (vs ATSAMA5D27C-D1G-CU)
- Rich peripheral mix including dual USB 2.0 + EMAC + CAN-FD (vs ATSAMA5D22C-CU)
- Industrial -40C to +85C qualification standard (vs ATSAMA5D27C-CNVAO)
설계 노트
The 361-ball TFBGA at 0.8 mm pitch requires at least a 4-layer PCB with microvia stack-ups (laser-drilled or 0.1 mm mechanical vias). Use 0.8 mm-pitch escape routing in a dog-bone or via-in-pad fan-out pattern. Place 0.1 uF decoupling capacitors directly under each BGA ball on the bottom side, and follow the SAMA5D2 hardware design guide for power-plane splitting. Confirm your PCB fabricator supports 0.8 mm BGA assembly with adequate yield before committing to layout.
Estimated: at maximum CPU activity (500 MHz, NEON active, LCD + USB operating), the SoC die may dissipate up to approximately 1 W. The 361-TFBGA has limited heat dissipation through the balls alone; provide at least 4 thermal vias in a 3x3 array under the central die region to conduct heat to an internal copper plane or bottom-side copper pour. For high-temperature environments approaching +85C, consider adding a small thermal pad on the package top connected to a heatsink.
Do not confuse the LD1G (1 Gbit LPDDR2, 361-TFBGA 16x16) SiP with the D1G (1 Gbit DDR2, 289-TFBGA 14x14) variant - the packages and pinouts are not compatible. Ensure your boot firmware selects the correct RAM type during low-level initialization. Also verify that the LPDDR2 retention mode is properly enabled in your power-management firmware to achieve the rated sub-mW standby current.
The SAMA5D27 SiP requires multiple supply rails: VDDCORE for the CPU, VDDIO for I/O, VDDBU for backup, and a separate LPDDR2 rail generated by the integrated regulator. Use a power- sequencer or follow the SAMA5D2 power-up sequence exactly to avoid latch-up. Place bulk capacitors (22 uF X5R) close to each supply pin pair, and provide 4.7 uF + 0.1 uF local decoupling on every supply pin of the SiP.
규정 준수 정보
Standard LD1G-CU is industrial-grade; the CNVAO suffix is required for AEC-Q100 automotive qualification. RoHS and lead-free compliance confirmed per Microchip product page.
