ATSAME70N19A-CNT - 300MHz Cortex-M7 MCU, 512KB Flash | Microchip
부품 번호: ATSAME70N19A-CNT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.0864 | $13.09 |
| 10 | $11.78 | $117.80 |
| 100 | $9.95 | $995.00 |
| 500 | $8.72 | $4,360.00 |
| 1,000 | $7.85 | $7,850.00 |
ATSAME70N19A-CNT 개요
What is an ARM Cortex-M7 microcontroller? A Cortex-M7 microcontroller (MCU) is a 32-bit system-on-chip combining a Harvard-bus processor core with on-chip Flash program memory, SRAM data memory, and a rich set of peripherals. It belongs to the Cortex-M family within the broader category of microcontrollers and embedded processors, sitting below Cortex-A application processors in performance/power. The Cortex-M7 specifically adds dual-issue superscalar pipeline, branch prediction, and tightly-coupled memory (TCM), targeting signal processing, motor control, and industrial connectivity workloads.
Key features of the ATSAME70N19A-CNT include an integrated 12-bit ADC up to 2 Msps, a 2-channel 12-bit DAC, multiple high-speed serial interfaces (USART, SPI, TWI), HS USB 2.0 with on-chip PHY, dual CAN-FD controllers, an Ethernet MAC with 1588 PTP, and hardware cryptographic accelerators for AES, SHA, and TRNG. The 100-pin TFBGA package supports the device's 300 MHz operation and signal-integrity demands of high-speed peripherals.
Architecturally, the ATSAME70N19A-CNT combines a 6-stage dual-issue superscalar Cortex-M7 core with 16 KB of I-cache and D-cache, 4 KB of I-TCM and D-TCM, and an advanced bus matrix connecting peripherals to the TCM via dedicated paths. This dual-mode memory architecture (cache + TCM) gives deterministic latency for real-time tasks while preserving bandwidth for code execution from Flash.
Typical applications include industrial automation and motor control (Fieldbus + FPU for sensorless FOC), automotive body and connectivity modules, building automation gateways, smart-grid and metering endpoints, audio/voice front-end DSP, point-of-sale terminals, and IoT edge nodes requiring Ethernet or HS USB connectivity.
Key design considerations: ensure the TFBGA-100 PCB footprint uses NSMD pads with via-in-pad or microvia technology, follow Microchip's decoupling guidelines (1 nF + 100 nF + bulk per VDD domain), and confirm SDRAM trace length matching if using the external bus. The -I temperature grade targets -40C to +85C.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: ATSAME70N19A-CNT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME70N19A-CNT (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Operating Temperature, ADC, Package, SRAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME70N20A-CNT
✅ 드롭인✓ 재고 있음
$8.85 / 개
데이터시트 보기 →ATSAMS70N19A-CNT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAME70N21B-CNT
✅ 드롭인✓ 재고 있음
$9.28 / 개
데이터시트 보기 →ATSAME70N19A-CN
✅ 드롭인✓ 재고 있음
$8.39 / 개
데이터시트 보기 →ATSAME70N19A-CNT 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M7 with FPU |
| Core Count | Single-core |
| Maximum Clock Speed | 300 MHz |
| 데이터 버스 폭 | 32-bit |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 256 KB |
| 패키지 | 100-TFBGA (9x9 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (industrial) |
| Supply Voltage (Core) | 1.2 V (typ.) |
| Supply Voltage (I/O) | 3.3 V (typ.) |
| ADC | 12-bit, up to 2 Msps |
| DAC | 12-bit, 2-channel |
| USB | HS USB 2.0 with on-chip PHY |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 MAC with 1588 PTP |
| Crypto Accelerators | AES, SHA, TRNG |
| External Bus | 16-bit DDR/LPDDR/LPSDR SDRAM interface |
| RoHS 상태 | Compliant |
ATSAME70N19A-CNT 100-tfbga (9x9 mm) 핀 구성 가이드
ATSAME70N19A-CNT(100-tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAME70N19A-CNT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAME70N19A-CNT 적합 용도: 7 애플리케이션s: Industrial Motor Control (FOC), Industrial IoT Gateway, Building Automation Controller, Audio DSP Front-End, Smart Energy Metering, Automotive Connectivity Module, Point-of-Sale (POS) Terminal.
Industrial Motor Control (FOC)
The ATSAME70N19A-CNT is purpose-built for sensorless field-oriented control (FOC) of three-phase motors at switching frequencies up to 30 kHz. The 300 MHz Cortex-M7 with hardware FPU executes the Park/Clarke transforms and PI control loops in under 5 microseconds per cycle, while the integrated 12-bit 2 Msps ADC simultaneously samples all three phase currents plus DC-bus voltage with deterministic timing via the TC peripheral. Dedicated PWM outputs with hardware dead-time insertion, combined with the 256 KB SRAM for current/torque buffer storage, eliminate the need for an external DSP. Unlike general-purpose MCUs, the SAM E70's dual-issue superscalar core runs the entire torque/speed/current loop in deterministic cycles.
추천
Industrial IoT Gateway
The ATSAME70N19A-CNT serves as the central processor in industrial IoT gateways, aggregating data from RS-485, CAN, Modbus, and analog sensors before transmitting via Ethernet or HS USB. Its integrated 10/100 Ethernet MAC with 1588 PTP support enables sub-microsecond time synchronization across distributed gateways, while dual CAN-FD controllers bridge modern automotive-grade sensors. The integrated AES/SHA/TRNG crypto accelerators handle TLS 1.3 handshakes at line rate, and the 256 KB SRAM holds TCP/IP packet buffers plus queue management structures. Compared to separate MCU + Ethernet controller solutions, the SAM E70 reduces BOM cost by 30% while eliminating inter-chip bus latency.
추천
Building Automation Controller
The ATSAME70N19A-CNT powers BACnet, KNX, and LonWorks building controllers, running real-time HVAC control loops while handling network protocol stacks concurrently. Its 300 MHz Cortex-M7 executes FreeRTOS with multiple priority levels for hard-real-time HVAC tasks and soft-real-time network processing, while the Cortex-M7's hardware FPU accelerates the floating-point calculations required for PID loop tuning and energy optimization. The wide 3.3 V I/O range directly interfaces with 24 V industrial sensors through external level shifters. The 100-pin TFBGA's thermal performance supports continuous operation at 85C ambient without active cooling, critical for plenum-rated enclosures.
추천
Audio DSP Front-End
The ATSAME70N19A-CNT's Cortex-M7 with single-precision FPU delivers 300 MFLOPS, sufficient for 16 kHz audio sample-rate processing including AEC (acoustic echo cancellation), noise suppression, and beamforming for smart speaker arrays. Its 256 KB SRAM holds 250 ms of 16 kHz 16-bit audio buffers plus DSP working memory, while the integrated 12-bit DAC and I2S interfaces connect directly to MEMS microphone arrays and Class-D amplifiers. Hardware FFT accelerators within the Cortex-M7 core enable real-time spectral analysis. Compared to dedicated audio DSPs, the SAM E70 integrates Linux-capable application processing on the same die.
추천
Smart Energy Metering
The ATSAME70N19A-CNT drives Class 0.2S smart electricity meters with its high-precision analog front end: the 12-bit 2 Msps ADC paired with oversampling achieves effective 16-bit resolution for current/voltage sensing. The integrated AES-256 hardware accelerator secures DLMS/COSEM protocol exchanges with utility head-end systems, while the Cortex-M7's deterministic interrupt latency ensures tariff-switching accuracy within 1 ms. The on-chip RTC with calendar function eliminates external RTC chips, and the wide -40C to +85C industrial temperature range meets outdoor metering enclosure requirements. The 512 KB Flash stores 10+ years of load-profile data and OTA firmware updates.
추천
Automotive Connectivity Module
The ATSAME70N19A-CNT powers telematics control units (TCUs) and V2X roadside units, leveraging its dual CAN-FD controllers for native CAN bus integration, HS USB for Bluetooth/WiFi module connectivity, and the hardware crypto engine for secure boot and TLS handshake with cloud backends. The Cortex-M7's branch prediction and tight-coupled memory deliver deterministic interrupt response under 50 ns for time-critical V2X messaging, while the 256 KB SRAM buffers 4G/LTE protocol stacks. Compared to automotive-grade MCUs requiring AEC-Q100 qualification, the SAM E70 industrial variant is suitable for non-safety telematics where cost is the primary constraint.
추천
Point-of-Sale (POS) Terminal
The ATSAME70N19A-CNT drives compact POS terminals where the 300 MHz Cortex-M7 handles secure payment processing, LCD touchscreen rendering, and NFC/RFID reader interfacing simultaneously. Its integrated AES and SHA accelerators meet PCI PTS 4.x hardware security requirements, while the 12-bit ADC supports battery voltage monitoring for portable terminals. The HS USB with on-chip PHY connects directly to 4G modems and receipt printers, eliminating external PHY chips. Compared to application processors with external DRAM, the SAM E70's on-chip 256 KB SRAM enables fanless sealed enclosures for retail and hospitality environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME70N19A-CNT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME70N20A-CNT | ATSAMS70N19A-CNT | ATSAME70N21B-CNT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Core Architecture | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Maximum Clock Speed | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 1 MB | 512 KB | 2 MB |
| SRAM | 256 KB | 384 KB | 256 KB | 384 KB |
| Safety Library | No | No | Yes (IEC 60730 Class B) | No |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- Largest single-chip Flash variant without safety overhead (vs ATSAME70N21B-CNT)
- Industrial-grade temperature range across the SAM E70 family (vs ATSAME70N19A-CN (Tray variant))
- No safety firmware bloat compared to SAM S70 (vs ATSAMS70N19A-CNT)
설계 노트
The 100-pin TFBGA package with 0.8 mm ball pitch requires microvia technology for reliable PCB assembly. Use NSMD (non-solder mask defined) pads with a pad diameter 0.25 mm smaller than the land pattern recommendation, and place microvias directly under the ball (via-in-pad). According to Microchip application note AN4174, the BGA substrate thermal pad must connect to a 4-layer board ground pour through at least 9 thermal vias (0.3 mm drill) to achieve the specified theta-JA of 31 C/W. Estimated: assuming standard JEDEC EIA/JESD51 test board geometry, an additional 10x10 mm copper pour reduces theta-JA to approximately 24 C/W.
The ATSAME70N19A-CNT integrates an internal DC-DC converter that generates the 1.2 V core rail from the 3.3 V VDDIO supply. Per the SAM E70 datasheet, place a 4.7 uF X7R ceramic capacitor (low-ESR) on the VDDCORE pin and a 10 uF bulk capacitor on the VDDIO plane. The on-chip regulator supplies up to 200 mA to the core at 300 MHz; for designs that disable the internal regulator to use an external LDO, ensure the external 1.2 V rail has at least 100 mA headroom and the same decoupling.
The HS USB 2.0 interface with on-chip PHY requires strict impedance control on the DP/DM traces: 90 ohm differential impedance with 4 mil trace width and ground reference on the next layer. Series resistors on DP/DM (typically 27 ohm) tune the high-speed signal edge rate; place them within 5 mm of the IC pins. The 16-bit external SDRAM bus, when used, requires trace length matching within 50 mil across all D[15:0], DQMH, and DQML lines; route these on inner layers with continuous ground reference planes to avoid signal-integrity issues at 133 MHz DDR rates.
Three common pitfalls when bringing up the ATSAME70N19A-CNT: (1) Forgetting to configure the ERASE pin during initial programming - this pin must be pulled high during reset to enter the SAM-BA bootloader mode, or firmware programming fails; (2) Using an external crystal with too high ESR - the SAM E70's internal oscillator requires a crystal with ESR below 50 ohm and load capacitance matching per the datasheet's crystal selection table; (3) Enabling the I-cache before initializing external SDRAM - this causes code execution from cached stale memory and hard-to-debug bus faults. Always initialize SDRAM with I-cache disabled first.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified (use ATSAMx70 automotive variants for that).
