ATSAME70N19A-CNT - 300MHz Cortex-M7 MCU, 512KB Flash | Microchip
MPN: ATSAME70N19A-CNT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.0864 | $13.09 |
| 10 | $11.78 | $117.80 |
| 100 | $9.95 | $995.00 |
| 500 | $8.72 | $4,360.00 |
| 1,000 | $7.85 | $7,850.00 |
ATSAME70N19A-CNT Overview
What is an ARM Cortex-M7 microcontroller? A Cortex-M7 microcontroller (MCU) is a 32-bit system-on-chip combining a Harvard-bus processor core with on-chip Flash program memory, SRAM data memory, and a rich set of peripherals. It belongs to the Cortex-M family within the broader category of microcontrollers and embedded processors, sitting below Cortex-A application processors in performance/power. The Cortex-M7 specifically adds dual-issue superscalar pipeline, branch prediction, and tightly-coupled memory (TCM), targeting signal processing, motor control, and industrial connectivity workloads.
Key features of the ATSAME70N19A-CNT include an integrated 12-bit ADC up to 2 Msps, a 2-channel 12-bit DAC, multiple high-speed serial interfaces (USART, SPI, TWI), HS USB 2.0 with on-chip PHY, dual CAN-FD controllers, an Ethernet MAC with 1588 PTP, and hardware cryptographic accelerators for AES, SHA, and TRNG. The 100-pin TFBGA package supports the device's 300 MHz operation and signal-integrity demands of high-speed peripherals.
Architecturally, the ATSAME70N19A-CNT combines a 6-stage dual-issue superscalar Cortex-M7 core with 16 KB of I-cache and D-cache, 4 KB of I-TCM and D-TCM, and an advanced bus matrix connecting peripherals to the TCM via dedicated paths. This dual-mode memory architecture (cache + TCM) gives deterministic latency for real-time tasks while preserving bandwidth for code execution from Flash.
Typical applications include industrial automation and motor control (Fieldbus + FPU for sensorless FOC), automotive body and connectivity modules, building automation gateways, smart-grid and metering endpoints, audio/voice front-end DSP, point-of-sale terminals, and IoT edge nodes requiring Ethernet or HS USB connectivity.
Key design considerations: ensure the TFBGA-100 PCB footprint uses NSMD pads with via-in-pad or microvia technology, follow Microchip's decoupling guidelines (1 nF + 100 nF + bulk per VDD domain), and confirm SDRAM trace length matching if using the external bus. The -I temperature grade targets -40C to +85C.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for ATSAME70N19A-CNT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME70N19A-CNT (same form factor and footprint) — differing in Ethernet, Operating Temperature, ADC, Package, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME70N20A-CNT
✅ Drop-In✓ In Stock
$8.85 / Unit
View Datasheet →ATSAMS70N19A-CNT
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAME70N21B-CNT
✅ Drop-In✓ In Stock
$9.28 / Unit
View Datasheet →ATSAME70N19A-CN
✅ Drop-In✓ In Stock
$8.39 / Unit
View Datasheet →ATSAME70N19A-CNT Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M7 with FPU |
| Core Count | Single-core |
| Maximum Clock Speed | 300 MHz |
| Data Bus Width | 32-bit |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 256 KB |
| Package | 100-TFBGA (9x9 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial) |
| Supply Voltage (Core) | 1.2 V (typ.) |
| Supply Voltage (I/O) | 3.3 V (typ.) |
| ADC | 12-bit, up to 2 Msps |
| DAC | 12-bit, 2-channel |
| USB | HS USB 2.0 with on-chip PHY |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 MAC with 1588 PTP |
| Crypto Accelerators | AES, SHA, TRNG |
| External Bus | 16-bit DDR/LPDDR/LPSDR SDRAM interface |
| RoHS Status | Compliant |
ATSAME70N19A-CNT 100-tfbga (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAME70N19A-CNT (100-tfbga (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAME70N19A-CNT.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAME70N19A-CNT is suitable for 7 applications: Industrial Motor Control (FOC), Industrial IoT Gateway, Building Automation Controller, Audio DSP Front-End, Smart Energy Metering, Automotive Connectivity Module, Point-of-Sale (POS) Terminal.
Industrial Motor Control (FOC)
The ATSAME70N19A-CNT is purpose-built for sensorless field-oriented control (FOC) of three-phase motors at switching frequencies up to 30 kHz. The 300 MHz Cortex-M7 with hardware FPU executes the Park/Clarke transforms and PI control loops in under 5 microseconds per cycle, while the integrated 12-bit 2 Msps ADC simultaneously samples all three phase currents plus DC-bus voltage with deterministic timing via the TC peripheral. Dedicated PWM outputs with hardware dead-time insertion, combined with the 256 KB SRAM for current/torque buffer storage, eliminate the need for an external DSP. Unlike general-purpose MCUs, the SAM E70's dual-issue superscalar core runs the entire torque/speed/current loop in deterministic cycles.
Recommended
Industrial IoT Gateway
The ATSAME70N19A-CNT serves as the central processor in industrial IoT gateways, aggregating data from RS-485, CAN, Modbus, and analog sensors before transmitting via Ethernet or HS USB. Its integrated 10/100 Ethernet MAC with 1588 PTP support enables sub-microsecond time synchronization across distributed gateways, while dual CAN-FD controllers bridge modern automotive-grade sensors. The integrated AES/SHA/TRNG crypto accelerators handle TLS 1.3 handshakes at line rate, and the 256 KB SRAM holds TCP/IP packet buffers plus queue management structures. Compared to separate MCU + Ethernet controller solutions, the SAM E70 reduces BOM cost by 30% while eliminating inter-chip bus latency.
Recommended
Building Automation Controller
The ATSAME70N19A-CNT powers BACnet, KNX, and LonWorks building controllers, running real-time HVAC control loops while handling network protocol stacks concurrently. Its 300 MHz Cortex-M7 executes FreeRTOS with multiple priority levels for hard-real-time HVAC tasks and soft-real-time network processing, while the Cortex-M7's hardware FPU accelerates the floating-point calculations required for PID loop tuning and energy optimization. The wide 3.3 V I/O range directly interfaces with 24 V industrial sensors through external level shifters. The 100-pin TFBGA's thermal performance supports continuous operation at 85C ambient without active cooling, critical for plenum-rated enclosures.
Recommended
Audio DSP Front-End
The ATSAME70N19A-CNT's Cortex-M7 with single-precision FPU delivers 300 MFLOPS, sufficient for 16 kHz audio sample-rate processing including AEC (acoustic echo cancellation), noise suppression, and beamforming for smart speaker arrays. Its 256 KB SRAM holds 250 ms of 16 kHz 16-bit audio buffers plus DSP working memory, while the integrated 12-bit DAC and I2S interfaces connect directly to MEMS microphone arrays and Class-D amplifiers. Hardware FFT accelerators within the Cortex-M7 core enable real-time spectral analysis. Compared to dedicated audio DSPs, the SAM E70 integrates Linux-capable application processing on the same die.
Recommended
Smart Energy Metering
The ATSAME70N19A-CNT drives Class 0.2S smart electricity meters with its high-precision analog front end: the 12-bit 2 Msps ADC paired with oversampling achieves effective 16-bit resolution for current/voltage sensing. The integrated AES-256 hardware accelerator secures DLMS/COSEM protocol exchanges with utility head-end systems, while the Cortex-M7's deterministic interrupt latency ensures tariff-switching accuracy within 1 ms. The on-chip RTC with calendar function eliminates external RTC chips, and the wide -40C to +85C industrial temperature range meets outdoor metering enclosure requirements. The 512 KB Flash stores 10+ years of load-profile data and OTA firmware updates.
Recommended
Automotive Connectivity Module
The ATSAME70N19A-CNT powers telematics control units (TCUs) and V2X roadside units, leveraging its dual CAN-FD controllers for native CAN bus integration, HS USB for Bluetooth/WiFi module connectivity, and the hardware crypto engine for secure boot and TLS handshake with cloud backends. The Cortex-M7's branch prediction and tight-coupled memory deliver deterministic interrupt response under 50 ns for time-critical V2X messaging, while the 256 KB SRAM buffers 4G/LTE protocol stacks. Compared to automotive-grade MCUs requiring AEC-Q100 qualification, the SAM E70 industrial variant is suitable for non-safety telematics where cost is the primary constraint.
Recommended
Point-of-Sale (POS) Terminal
The ATSAME70N19A-CNT drives compact POS terminals where the 300 MHz Cortex-M7 handles secure payment processing, LCD touchscreen rendering, and NFC/RFID reader interfacing simultaneously. Its integrated AES and SHA accelerators meet PCI PTS 4.x hardware security requirements, while the 12-bit ADC supports battery voltage monitoring for portable terminals. The HS USB with on-chip PHY connects directly to 4G modems and receipt printers, eliminating external PHY chips. Compared to application processors with external DRAM, the SAM E70's on-chip 256 KB SRAM enables fanless sealed enclosures for retail and hospitality environments.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME70N19A-CNT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME70N20A-CNT | ATSAMS70N19A-CNT | ATSAME70N21B-CNT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Core Architecture | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Maximum Clock Speed | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 1 MB | 512 KB | 2 MB |
| SRAM | 256 KB | 384 KB | 256 KB | 384 KB |
| Safety Library | No | No | Yes (IEC 60730 Class B) | No |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Largest single-chip Flash variant without safety overhead (vs ATSAME70N21B-CNT)
- Industrial-grade temperature range across the SAM E70 family (vs ATSAME70N19A-CN (Tray variant))
- No safety firmware bloat compared to SAM S70 (vs ATSAMS70N19A-CNT)
Design Notes
The 100-pin TFBGA package with 0.8 mm ball pitch requires microvia technology for reliable PCB assembly. Use NSMD (non-solder mask defined) pads with a pad diameter 0.25 mm smaller than the land pattern recommendation, and place microvias directly under the ball (via-in-pad). According to Microchip application note AN4174, the BGA substrate thermal pad must connect to a 4-layer board ground pour through at least 9 thermal vias (0.3 mm drill) to achieve the specified theta-JA of 31 C/W. Estimated: assuming standard JEDEC EIA/JESD51 test board geometry, an additional 10x10 mm copper pour reduces theta-JA to approximately 24 C/W.
The ATSAME70N19A-CNT integrates an internal DC-DC converter that generates the 1.2 V core rail from the 3.3 V VDDIO supply. Per the SAM E70 datasheet, place a 4.7 uF X7R ceramic capacitor (low-ESR) on the VDDCORE pin and a 10 uF bulk capacitor on the VDDIO plane. The on-chip regulator supplies up to 200 mA to the core at 300 MHz; for designs that disable the internal regulator to use an external LDO, ensure the external 1.2 V rail has at least 100 mA headroom and the same decoupling.
The HS USB 2.0 interface with on-chip PHY requires strict impedance control on the DP/DM traces: 90 ohm differential impedance with 4 mil trace width and ground reference on the next layer. Series resistors on DP/DM (typically 27 ohm) tune the high-speed signal edge rate; place them within 5 mm of the IC pins. The 16-bit external SDRAM bus, when used, requires trace length matching within 50 mil across all D[15:0], DQMH, and DQML lines; route these on inner layers with continuous ground reference planes to avoid signal-integrity issues at 133 MHz DDR rates.
Three common pitfalls when bringing up the ATSAME70N19A-CNT: (1) Forgetting to configure the ERASE pin during initial programming - this pin must be pulled high during reset to enter the SAM-BA bootloader mode, or firmware programming fails; (2) Using an external crystal with too high ESR - the SAM E70's internal oscillator requires a crystal with ESR below 50 ohm and load capacitance matching per the datasheet's crystal selection table; (3) Enabling the I-cache before initializing external SDRAM - this causes code execution from cached stale memory and hard-to-debug bus faults. Always initialize SDRAM with I-cache disabled first.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified (use ATSAMx70 automotive variants for that).
