EP1K10FC256-2 - 10K ACEX-1K FPGA, 136 I/O, 256-BGA | Intel / Altera
부품 번호: EP1K10FC256-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $11.8 | $5,900.00 |
| 1,000 | $9.95 | $9,950.00 |
EP1K10FC256-2 개요
An FPGA (Field Programmable Gate Array) is a class of programmable logic device (PLD) that combines the density of gate arrays with the configurability of logic blocks, interconnect, and I/O. Within the broader system-on-a-programmable-chip (SOPC) taxonomy, FPGAs enable integration of megafunctions such as DSP blocks, FIFOs, dual-port memories, and specialized logic into a single device, replacing multiple discrete components and accelerating time-to-market.
Key features of the EP1K10FC256-2 include a maximum toggle frequency around 200 MHz, embedded array blocks (EABs) for efficient memory and specialized logic functions, support for LVCMOS, LVTTL, SSTL-2/3, and HSTL I/O standards, and an in-system programmability (ISP) interface via the JTAG-compliant passive serial configuration scheme. The device is specified for commercial operating temperature (0 °C to 70 °C) at the -2 speed grade.
From a technical depth perspective, the ACEX-1K architecture pairs a fine-grained Look-Up Table (LUT)-based logic fabric with coarse-grained Embedded Array Blocks (EABs) that can be configured as RAM, ROM, or specialized megafunction blocks. This heterogeneous structure delivers higher effective logic density than uniform LUT fabrics of similar raw gate count, while the 0.22 µm process balances cost and performance for cost-sensitive glue-logic, bridging, and control-plane applications.
Typical applications include telecommunications bridging, low-density glue logic, industrial control interfacing, and pre-silicon prototyping of ASIC-equivalent logic. With its small footprint, ample dual-port memory, and JTAG ISP, the EP1K10FC256-2 is widely used in legacy designs where re-spin cost or supply continuity matter more than absolute logic density.
When designing with this part, verify that the Quartus II or MAX+PLUS II toolchain supports the ACEX-1K family, confirm power-rail sequencing for the 2.5 V VCCINT and any bank reference voltages, and respect the device's I/O pin count when migrating from the original -1 or -3 speed grades.
This page synthesizes distributor pricing, drop-in same-package alternatives, application contexts, and practical design notes not found in the original Altera datasheet alone.
드롭인 대체품: EP1K10FC256-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K10FC256-2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Configuration Method, Embedded Array Blocks (EABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K10FC256-1
✅ 드롭인✓ 재고 있음
$22.62 / 개
데이터시트 보기 →EP1K10FC256-2N
✅ 드롭인✓ 재고 있음
$5.62 / 개
데이터시트 보기 →EP1K10FC256-2P
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1K10FC256-2F
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1K100FC256-2
✅ 드롭인✓ 재고 있음
$27.6 / 개
데이터시트 보기 →EP1K100FC256-2N
✅ 드롭인✓ 재고 있음
$78.1951 / 개
데이터시트 보기 →EP1K10FC256-2 최대 정격 & 전기적 특성
| Family | ACEX-1K |
| Series | EP1K10 |
| Logic Elements / Cells | 576 |
| Number of LABs/CLBs | 72 |
| Total RAM Bits | 12288 |
| Number of I/O | 136 |
| Number of Gates | 10,000 typical |
| Core Voltage | 2.375 V to 2.625 V (2.5 V nominal) |
| Speed Grade | -2 |
| 동작 온도 | 0 °C to +70 °C (commercial) |
| 패키지 | 256-BGA (FineLine BGA, 17 x 17 mm) |
| 실장 유형 | Surface Mount |
| Process Technology | 0.22 µm CMOS |
| Configuration Method | JTAG / Passive Serial (ISP) |
EP1K10FC256-2 256-bga (fineline bga, 17 x 17 mm) 핀 구성 가이드
EP1K10FC256-2(256-bga (fineline bga, 17 x 17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1K10FC256-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1K10FC256-2 적합 용도: 6 애플리케이션s: Telecommunications Bridging and Glue Logic, Industrial Control and Interface Consolidation, ASIC Pre-Silicon Prototyping and Emulation, Legacy Maintenance and Board Rev-Sustaining Designs, Low-Density DSP and FIR Filter Acceleration, Communication Peripherals and Test Equipment.
Telecommunications Bridging and Glue Logic
The EP1K10FC256-2 fits telecom bridging because its 576 logic elements and 72 LABs deliver roughly 10,000 gates of configurable logic, enough to implement protocol bridges, bus converters, and timing skew adjustment between backplane ASICs. The 136 user I/Os on the 256-BGA expose multiple LVCMOS and LVTTL banks so designers can mix 3.3 V and 2.5 V domains without external level shifters. The 12,288 bits of embedded dual-port RAM serve as small FIFO / elastic buffer storage for packet-rate adaptation. Compared with a CPLD, the FPGA's structured ASIC blocks (EABs) and JTAG ISP shorten the design-prototype-revise loop typical of bridging firmware.
추천
Industrial Control and Interface Consolidation
In industrial control panels, the EP1K10FC256-2 consolidates discrete glue logic such as optocoupler debouncers, encoder quadrature decoders, and PWM generators into a single device. Its 136 I/O pins comfortably support 8 to 16 channels of parallel I/O at 24 V-tolerant interfaces when paired with external drivers. The 2.5 V core supply and 0-70 °C commercial temperature range suit enclosed control cabinets with moderate ambient. JTAG-based in-system programming accelerates field firmware updates on deployed panels without removing the device.
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ASIC Pre-Silicon Prototyping and Emulation
Engineers use the EP1K10FC256-2 as a fast-prototyping vehicle for ASIC-equivalent logic blocks because the LUT-based fabric maps ASIC gate-level netlists through standard synthesis flows in Quartus II or MAX+PLUS II. The 12,288 bits of dual-port RAM emulate ASIC register files and small SRAM macros, while the 72 LABs distribute logic for timing closure studies. The 256-BGA FineLine package exposes enough I/O to break out debug signals and boundary-scan chains. Compared with running RTL on a simulator, real silicon at ~200 MHz validates timing assumptions and brings up firmware weeks earlier.
추천
Legacy Maintenance and Board Rev-Sustaining Designs
For long-lifecycle products in the field, the EP1K10FC256-2 supports drop-in board-rev sustaining designs because the 256-BGA pinout is shared across the EP1K10 and EP1K100 families. When original ACEX-1K stock is depleted, the EP1K100FC256-2 delivers 10x the logic resources on the same footprint without PCB rework. Designers re-validate timing closure only, since the 2.5 V core, ball map, and ISP flow remain identical. This minimizes re-certification cost in medical, aerospace, and industrial segments where board respins are prohibitively expensive.
추천
Low-Density DSP and FIR Filter Acceleration
The EP1K10FC256-2 implements modest FIR filters, sigma-delta modulators, and audio sample-rate converters using its EAB-based multipliers and dual-port RAM. With 12,288 RAM bits, designers can store 512 x 24-bit coefficients or delay-line samples, while 576 logic cells realize the adder tree. The 256-BGA package exposes enough I/O for parallel audio data buses (I2S, TDM, or DSP serial ports). At toggle frequencies around 200 MHz, the device comfortably processes baseband audio and low-MHz IF signal processing tasks.
추천
Communication Peripherals and Test Equipment
Test-and-measurement peripherals such as logic-analyzer probe heads, JTAG-controlled breakout boards, and custom protocol exercisers use the EP1K10FC256-2 for its flexible I/O standards (LVCMOS, LVTTL, SSTL-2/3, HSTL) and JTAG ISP. The 136 user I/Os adapt the device to multiple parallel-bus widths (8/16/32-bit), while the EAB-based dual-port RAM captures transient signal buffers in pattern-generator applications. The 256-BGA package's compact 17 x 17 mm footprint fits handheld test instruments and modular mezzanine cards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K10FC256-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K10FC256-1 | EP1K10FC256-2N | EP1K100FC256-2 |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-BGA (FineLine BGA) | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 576 | 576 | 576 | 4992 |
| Total Gates | 10,000 | 10,000 | 10,000 | 100,000 |
| Number of LABs/CLBs | 72 | 72 | 72 | 624 |
| Total RAM Bits | 12288 | 12288 | 12288 | 49152 |
| Number of I/O | 136 | 136 | 136 | 136 |
| Speed Grade | -2 | -1 | -2 | -2 |
| Core Voltage | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V |
주요 차별점
- Same 256-BGA pinout as EP1K100FC256-2 enabling ~10x density upgrade with no PCB rework (vs EP1K100FC256-2)
- Lead-free N-suffix variant supports modern environmental compliance regimes (vs EP1K10FC256-2N)
- P-grade EP1K10FC256-2P variant available for non-RoHS legacy assemblies (vs EP1K10FC256-2P)
- Lower-density 10K gates consume less core power than EP1K100FC256-2 (vs EP1K100FC256-2)
설계 노트
Estimated: at VCCINT = 2.5 V, ICCINT typical ~50 mA quiescent plus dynamic current proportional to toggle rate; for a 136-I/O design at ~50 MHz, total supply current is on the order of 200-300 mA. Provide a 2.5 V LDO with at least 10 % headroom and place 0.1 µF + 10 µF decoupling close to every VCCINT ball. VCCIO banks may require 3.3 V or 2.5 V depending on the I/O standard mix - verify bank reference voltages against the datasheet I/O standard table.
The 256-FineLine BGA uses a 1.00 mm ball pitch with a 17 x 17 mm body. Use 4-layer or 6-layer PCB stack-up with continuous GND planes under the package for thermal dissipation and signal return paths. Route differential pairs in matched length within ±150 mil for LVDS-style I/O standards. Place JTAG chain header (TMS, TCK, TDI, TDO, TRST) within 2 inches of the device to minimize stub length and ISP signal integrity risk.
Configure the FPGA via JTAG in-system programming or passive serial configuration PROM. For multi-device chains, route the JTAG signals in a daisy chain with TMS and TCK buffered only if the chain exceeds 4-5 devices. Decouple each VCCIO bank with 0.1 µF X7R ceramics placed within 100 mil of the bank balls, plus a single 10 µF bulk capacitor per bank.
Do not assume the EP1K10 and EP1K100 families are bitstream-compatible despite sharing the same 256-BGA footprint - configuration bitstream sizes differ and the LAB / EAB architecture scales. Validate that your Quartus II compile target selects the correct device, otherwise the device will fail configuration. Also note that the ACEX-1K family uses a passive serial configuration scheme - newer Cyclone devices require PS or AS configuration with different bitstream headers.
Estimated: at full I/O toggle on all 136 pins at 2.5 V and 25 °C ambient, junction temperature rise is approximately 8-12 °C above ambient when mounted on a 4-layer JEDEC test PCB. For enclosed chassis without forced airflow, derate toggle activity by 30-40 % to keep Tj below 85 °C. Thermal resistance θJA for the 256-FBGA is approximately 20-25 °C/W on a standard 4-layer PCB per JEDEC EIA/JESD51.
규정 준수 정보
Compliance status not explicitly stated in the verified web data. The -2N suffix typically indicates lead-free finish per Altera legacy ordering scheme, while the -2P suffix denotes Pb-bearing balls. RoHS/REACH should be confirmed with the distributor or manufacturer's environmental compliance letter before production.
