EP1K10TC144-3 - 10K Gate ACEX-1K FPGA 144-LQFP | Intel / Altera
부품 번호: EP1K10TC144-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.4 | $18.40 |
| 10 | $16.1 | $161.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.75 | $6,375.00 |
| 1,000 | $11.55 | $11,550.00 |
EP1K10TC144-3 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital IC whose logic function is defined by user-supplied configuration bitstreams stored in on-chip SRAM. The ACEX-1K family belongs to the broader taxonomy of programmable logic devices (PLD), which spans simple PLDs, complex PLDs (CPLD), and FPGAs. Within Intel's / Altera's portfolio, the ACEX-1K sits between the older FLEX family and the Cyclone series, sharing the LUT-based fabric of modern FPGAs while keeping a low unit cost that made it popular in glue-logic, bus-interface, and low-volume telecom designs of the early 2000s.
Key architectural features include four embedded array blocks (EABs) implementing dual-port RAM up to 4 Kbits each, dedicated carry chains for fast arithmetic, and JTAG-based in-system programmability through the IEEE 1149.1 boundary-scan interface. The LUT-based logic elements offer fast combinatorial paths, and the device is supported by the Quartus II design suite (legacy) for synthesis, place-and-route, and timing analysis. Note that ACEX-1K devices are no longer recommended for new designs.
Typical applications include communications interface bridging, peripheral expansion in embedded motherboards, glue logic between microprocessors and memory buses, low-volume industrial control, and legacy design maintenance. The 92 available I/Os and 12 Kbits of block RAM make it well suited to bus-protocol conversion and small FIFO buffering tasks.
When designing with this part, ensure the 2.5V VCCINT and 3.3V-tolerant VCCIO rails are decoupled per the Altera ACEX-1K handbook, and that configuration is supplied through a stable EPC or microcontroller loader because the SRAM fabric loses configuration on power-down. Programming files are generated with Quartus II software. This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet.
드롭인 대체품: EP1K10TC144-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K10TC144-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Configuration Method, Typical Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K10TC144-3N
✅ 드롭인✓ 재고 있음
$10.5 / 개
데이터시트 보기 →EP1K10TC144-2N
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →EP1K10TC144-2
✅ 드롭인✓ 재고 있음
$11.9 / 개
데이터시트 보기 →EP1K10TC144-1N
✅ 드롭인✓ 재고 있음
$4.35 / 개
데이터시트 보기 →EP1K10TC144-1
✅ 드롭인✓ 재고 있음
$9.95 / 개
데이터시트 보기 →EP1K30TC144-3
✅ 드롭인✓ 재고 있음
$10.8 / 개
데이터시트 보기 →EP1K10TC144-3 최대 정격 & 전기적 특성
| Family | ACEX-1K |
| Logic Elements / Cells | 576 |
| Typical Gates | 10,000 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 4 |
| User I/O Pins | 92 |
| Speed Grade | -3 |
| Maximum Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Process Technology | 0.22 µm CMOS |
| 패키지 | 144-LQFP (TQFP) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +70C (commercial) |
| Configuration Method | SRAM, JTAG IEEE 1149.1 |
EP1K10TC144-3 핀 구성
| 핀 1 | I/O — User I/O pin (bank 1) |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | VCCIO1 — I/O bank 1 supply (3.3V) |
| 핀 4 | I/O — User I/O pin (bank 1) |
| 핀 5 | I/O — User I/O pin (bank 1) |
| 핀 6 | GND — Ground |
| 핀 7 | I/O — User I/O pin (bank 1) |
| 핀 8 | I/O — User I/O pin (bank 1) |
| 핀 9 | VCCINT — Core supply (2.5V) |
| 핀 10 | I/O — User I/O pin (bank 1) |
| 핀 11 | I/O — User I/O pin (bank 1) |
| 핀 12 | GND — Ground |
| 핀 13 | I/O — User I/O pin (bank 2) |
| 핀 14 | I/O — User I/O pin (bank 2) |
| 핀 15 | VCCIO2 — I/O bank 2 supply (3.3V) |
| 핀 16 | I/O — User I/O pin (bank 2) |
| 핀 17 | I/O — User I/O pin (bank 2) |
| 핀 18 | GND — Ground |
| 핀 19 | I/O — User I/O pin (bank 2) |
| 핀 20 | I/O — User I/O pin (bank 2) |
| 핀 21 | VCCINT — Core supply (2.5V) |
| 핀 22 | I/O — User I/O pin (bank 2) |
| 핀 23 | I/O — User I/O pin (bank 2) |
| 핀 24 | GND — Ground |
| 핀 25 | I/O — User I/O pin (bank 3) |
| 핀 26 | I/O — User I/O pin (bank 3) |
| 핀 27 | VCCIO3 — I/O bank 3 supply (3.3V) |
| 핀 28 | I/O — User I/O pin (bank 3) |
| 핀 29 | I/O — User I/O pin (bank 3) |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — User I/O pin (bank 3) |
| 핀 32 | I/O — User I/O pin (bank 3) |
| 핀 33 | VCCINT — Core supply (2.5V) |
| 핀 34 | I/O — User I/O pin (bank 3) |
| 핀 35 | I/O — User I/O pin (bank 3) |
| 핀 36 | GND — Ground |
| 핀 37 | I/O — User I/O pin (bank 4) |
| 핀 38 | I/O — User I/O pin (bank 4) |
| 핀 39 | VCCIO4 — I/O bank 4 supply (3.3V) |
| 핀 40 | I/O — User I/O pin (bank 4) |
| 핀 41 | I/O — User I/O pin (bank 4) |
| 핀 42 | GND — Ground |
| 핀 43 | I/O — User I/O pin (bank 4) |
| 핀 44 | I/O — User I/O pin (bank 4) |
| 핀 45 | VCCINT — Core supply (2.5V) |
| 핀 46 | I/O — User I/O pin (bank 4) |
| 핀 47 | I/O — User I/O pin (bank 4) |
| 핀 48 | GND — Ground |
| 핀 49 | I/O — User I/O pin (bank 4) |
| 핀 50 | I/O — User I/O pin (bank 4) |
| 핀 51 | I/O — User I/O pin (bank 4) |
| 핀 52 | I/O — User I/O pin (bank 4) |
| 핀 53 | VCCIO4 — I/O bank 4 supply (3.3V) |
| 핀 54 | I/O — User I/O pin (bank 4) |
| 핀 55 | I/O — User I/O pin (bank 4) |
| 핀 56 | GND — Ground |
| 핀 57 | I/O — User I/O pin (bank 4) |
| 핀 58 | I/O — User I/O pin (bank 4) |
| 핀 59 | VCCINT — Core supply (2.5V) |
| 핀 60 | I/O — User I/O pin (bank 4) |
| 핀 61 | I/O — User I/O pin (bank 4) |
| 핀 62 | GND — Ground |
| 핀 63 | I/O — User I/O pin (bank 3) |
| 핀 64 | I/O — User I/O pin (bank 3) |
| 핀 65 | VCCIO3 — I/O bank 3 supply (3.3V) |
| 핀 66 | I/O — User I/O pin (bank 3) |
| 핀 67 | I/O — User I/O pin (bank 3) |
| 핀 68 | GND — Ground |
| 핀 69 | I/O — User I/O pin (bank 3) |
| 핀 70 | I/O — User I/O pin (bank 3) |
| 핀 71 | VCCINT — Core supply (2.5V) |
| 핀 72 | I/O — User I/O pin (bank 3) |
| 핀 73 | I/O — User I/O pin (bank 3) |
| 핀 74 | GND — Ground |
| 핀 75 | I/O — User I/O pin (bank 3) |
| 핀 76 | I/O — User I/O pin (bank 3) |
| 핀 77 | VCCIO3 — I/O bank 3 supply (3.3V) |
| 핀 78 | I/O — User I/O pin (bank 3) |
| 핀 79 | I/O — User I/O pin (bank 3) |
| 핀 80 | GND — Ground |
| 핀 81 | I/O — User I/O pin (bank 3) |
| 핀 82 | I/O — User I/O pin (bank 3) |
| 핀 83 | VCCINT — Core supply (2.5V) |
| 핀 84 | I/O — User I/O pin (bank 3) |
| 핀 85 | I/O — User I/O pin (bank 3) |
| 핀 86 | GND — Ground |
| 핀 87 | I/O — User I/O pin (bank 2) |
| 핀 88 | I/O — User I/O pin (bank 2) |
| 핀 89 | VCCIO2 — I/O bank 2 supply (3.3V) |
| 핀 90 | I/O — User I/O pin (bank 2) |
| 핀 91 | I/O — User I/O pin (bank 2) |
| 핀 92 | GND — Ground |
| 핀 93 | I/O — User I/O pin (bank 2) |
| 핀 94 | I/O — User I/O pin (bank 2) |
| 핀 95 | VCCINT — Core supply (2.5V) |
| 핀 96 | I/O — User I/O pin (bank 2) |
| 핀 97 | I/O — User I/O pin (bank 2) |
| 핀 98 | GND — Ground |
| 핀 99 | I/O — User I/O pin (bank 2) |
| 핀 100 | I/O — User I/O pin (bank 2) |
| 핀 101 | VCCIO2 — I/O bank 2 supply (3.3V) |
| 핀 102 | I/O — User I/O pin (bank 2) |
| 핀 103 | I/O — User I/O pin (bank 2) |
| 핀 104 | GND — Ground |
| 핀 105 | I/O — User I/O pin (bank 2) |
| 핀 106 | I/O — User I/O pin (bank 2) |
| 핀 107 | VCCINT — Core supply (2.5V) |
| 핀 108 | I/O — User I/O pin (bank 2) |
| 핀 109 | I/O — User I/O pin (bank 2) |
| 핀 110 | GND — Ground |
| 핀 111 | I/O — User I/O pin (bank 1) |
| 핀 112 | I/O — User I/O pin (bank 1) |
| 핀 113 | VCCIO1 — I/O bank 1 supply (3.3V) |
| 핀 114 | I/O — User I/O pin (bank 1) |
| 핀 115 | I/O — User I/O pin (bank 1) |
| 핀 116 | GND — Ground |
| 핀 117 | I/O — User I/O pin (bank 1) |
| 핀 118 | I/O — User I/O pin (bank 1) |
| 핀 119 | VCCINT — Core supply (2.5V) |
| 핀 120 | I/O — User I/O pin (bank 1) |
| 핀 121 | I/O — User I/O pin (bank 1) |
| 핀 122 | GND — Ground |
| 핀 123 | I/O — User I/O pin (bank 1) |
| 핀 124 | I/O — User I/O pin (bank 1) |
| 핀 125 | VCCIO1 — I/O bank 1 supply (3.3V) |
| 핀 126 | I/O — User I/O pin (bank 1) |
| 핀 127 | I/O — User I/O pin (bank 1) |
| 핀 128 | GND — Ground |
| 핀 129 | I/O — User I/O pin (bank 1) |
| 핀 130 | I/O — User I/O pin (bank 1) |
| 핀 131 | VCCINT — Core supply (2.5V) |
| 핀 132 | I/O — User I/O pin (bank 1) |
| 핀 133 | I/O — User I/O pin (bank 1) |
| 핀 134 | GND — Ground |
| 핀 135 | TDI — JTAG Test Data In |
| 핀 136 | TMS — JTAG Test Mode Select |
| 핀 137 | TCK — JTAG Test Clock |
| 핀 138 | nSTATUS — Configuration status |
| 핀 139 | nCONFIG — Configuration control (active low) |
| 핀 140 | DCLK — Configuration clock |
| 핀 141 | CONF_DONE — Configuration done indicator |
| 핀 142 | TDO — JTAG Test Data Out |
| 핀 143 | MSEL0 — Configuration mode select 0 |
| 핀 144 | MSEL1 — Configuration mode select 1 |
일반적인 애플리케이션
EP1K10TC144-3 적합 용도: 6 애플리케이션s: Legacy Bus Interface Bridging, Industrial Control Logic Replacement, Telecom Glue Logic and Protocol Conversion, Embedded System Peripheral Expansion, Test Equipment Custom Instrumentation, Legacy Design Maintenance and Repair.
Legacy Bus Interface Bridging
The EP1K10TC144-3's 92 user I/O pins and 12,288 bits of block RAM make it well suited for legacy bus interface bridging between microprocessors, memory, and peripherals such as ISA-to-PCI, VME, or custom parallel buses. Its 200 MHz internal operation allows glue-logic conversion at speeds that match most peripheral buses, while the four embedded array blocks (EABs) provide dual-port RAM for FIFO buffering between asynchronous clock domains. Placing the part between two bus connectors with proper VCCIO 3.3V rail isolation, designers can replace multiple 74-series TTL chips with a single reconfigurable device that adapts to evolving interface standards. The 144-LQFP footprint is the same as classic glue-logic packages, simplifying PCB migration from discrete-logic implementations.
추천
Industrial Control Logic Replacement
In factory automation and process control, the EP1K10TC144-3 replaces obsolete discrete-logic boards implementing state controllers, timer chains, and alarm encoders. With 576 logic elements, it can hold tens of state machines plus combinational encoding logic, and its SRAM-based configuration supports field updates via JTAG when product firmware changes. Industrial users benefit from the part's commercial 0-70°C rating suitable for enclosed control cabinets and the 144-LQFP package's compatibility with standard reflow profiles. A typical design places the FPGA between sensor-conditioning ASICs and a microcontroller SPI/I²C bus, offloading bit-banging and protocol conversion. Note that for new industrial designs, AEC-Q100 is not applicable; choose a modern industrial-grade Cyclone or MAX 10 instead.
추천
Telecom Glue Logic and Protocol Conversion
The EP1K10TC144-3 was widely deployed in early-2000s telecom equipment for low-speed protocol conversion, framing, and clock-domain crossing. Its four embedded array blocks implement dual-port RAM buffers for HDLC, UART, or framing tasks, while the 200 MHz internal frequency supports high-speed serial bit alignment. The 92 I/Os accommodate parallel TDM bus interfaces common in T1/E1 and H.110 telecom backplanes. In a typical application the FPGA sits between a framer IC and a network processor, offloading cell delineation and alarm detection. Designers should validate jitter tolerance with the VCCINT 2.5V supply and observe the Altera recommended PLL configuration guidelines if more than one clock domain is needed.
추천
Embedded System Peripheral Expansion
Embedded motherboards in test, medical, and instrumentation equipment frequently pair a low-cost microcontroller with an FPGA that adds custom peripherals: PWM generators, encoder counters, custom LCD controllers, or parallel data acquisition channels. The EP1K10TC144-3 with 10K gates and 92 I/Os is sized for exactly this role, providing several dozen soft peripherals alongside bus-interface glue. The 12 Kbits of block RAM serves as FIFO storage for ADC/DAC streaming. In a typical design, the FPGA connects to the MCU via an 8/16-bit SRAM-style bus, offloading deterministic timing tasks from the MCU's interrupt-driven software. Verify timing margin with Quartus II Static Timing Analysis since the part is in NRND status.
추천
Test Equipment Custom Instrumentation
Custom ATE and bench-instrument designers use the EP1K10TC144-3 to implement pattern generators, custom stimulus sequencers, and protocol-aware triggering. The 200 MHz operation supports high-speed digital stimulus generation, and the dual-port EAB RAM stores long test patterns or captured waveforms. The 144-LQFP package allows inspection-friendly hand-soldering for prototype builds, and JTAG-based programming enables rapid firmware iteration during development. A typical test fixture places the FPGA between a USB or Ethernet host controller and a device-under-test, with the FPGA translating high-level commands into device-specific timing sequences. The NRND status means engineers should plan migration to MAX 10 or Cyclone for new ATE platforms.
추천
Legacy Design Maintenance and Repair
The EP1K10TC144-3 remains an active maintenance component for installed equipment in telecom central offices, industrial control systems, and military electronics with multi-decade service lives. Repair depots and OEM service organizations use it to rebuild failed boards without redesigning the surrounding PCB. With 144-LQFP same-as-original packaging, the part drops into existing boards designed in the early 2000s. Authorized distributor stock at DigiKey and Heisener (verified 2026-09-07) supports repair operations. For long-term support, customers should engage Intel / Altera franchised distributors about lifetime-buy arrangements or migrate to the Cyclone IV EP4CE6E22, which offers a pin-compatible 144-pin footprint and modern Quartus Prime toolchain.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K10TC144-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K10TC144-3N | EP1K10TC144-2N | EP1K10TC144-1N | EP1K30TC144-3 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP144) | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 30,000 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 (mid) | -1 (slowest) | -3 (fastest) |
| Logic Elements | 576 | 576 | 576 | 576 | 1,728 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 24,576 |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | RoHS / Lead-Free | RoHS / Lead-Free | RoHS / Lead-Free | Non-RoHS (SnPb) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest speed grade in same-footprint ACEX-1K family (vs EP1K10TC144-2N)
- RoHS compliance availability in same package (vs EP1K10TC144-3N)
- Smallest ACEX-1K member (10K gates) with 92 I/Os (vs EP1K30TC144-3)
설계 노트
The EP1K10TC144-3 requires separate 2.5V VCCINT and 3.3V VCCIO rails; place 0.1µF decoupling capacitors adjacent to every VCCINT and VCCIO pin pair, plus a single 10µF bulk tantalum or ceramic capacitor near the package. Power-on sequencing is not critical but VCCINT should reach 2.5V within 100ms of VCCIO reaching 3.3V to avoid latch-up; in-circuit supervisors are recommended for production boards. Estimated: ICCINT typical ~50 mA and ICCIO ~10 mA per bank based on ACEX-1K family characteristics - verify with worst-case design utilization via the Quartus II PowerPlay analyzer.
Route all four VCCIO bank supplies (VCCIO1-VCCIO4) as wide traces or planes with multiple vias to inner planes; the 144-LQFP package's lead pitch is 0.5 mm and requires 4-mil trace/space rules with microvia stack-ups for dense breakout. Place the configuration EEPROM or MCU configuration driver within 50 mm of DCLK/nCONFIG/nSTATUS/CONF_DONE to avoid signal-integrity issues. Keep JTAG TCK trace under 100 mm with 22Ω series damping if longer routing is unavoidable. Connect MSEL0/MSEL1 to defined logic levels (typically 0/0 for AS mode or 1/0 for PS mode) - do not leave floating.
ACEX-1K SRAM-based FPGAs lose configuration on power-down - a non-volatile configuration source (EPC1, EPC2, MCU bootloader, or flash) is mandatory. Do not leave JTAG TDI/TMS floating during operation; tie them to known logic levels via 10kΩ pull-ups. The configuration clock (DCLK) must be stable before nCONFIG is released. Avoid 5V signals on I/O pins without external series resistors, since VCCIO is 3.3V. For multi-clock designs, use the dedicated CLK pins (CLK0-CLK3) rather than routed clocks to minimize skew.
Estimated: at 200 MHz toggle rate with 70% utilization across 576 LEs, the EP1K10TC144-3 dissipates approximately 0.5-0.8W. The 144-LQFP package has a theta_JA of approximately 35-45 C/W on a standard JEDEC 4-layer PCB, resulting in a 20-35 C junction temperature rise above ambient - well within the 0-70 C commercial rating. For higher utilization designs, add thermal vias under the exposed die pad region and route inner copper planes to spread heat. Do not use the part in sealed enclosures above 60 C ambient without verifying junction temperature via the thermal-resistance formula Tj = Ta + (Pd × theta_JA).
규정 준수 정보
EP1K10TC144-3 (SnPb terminal finish) is non-RoHS; choose EP1K10TC144-3N for RoHS/lead-free compliance. ACEX-1K family is not AEC-Q100 qualified (commercial grade only). Reach and conflict-minerals compliance per Intel / Altera product declaration.