EP1K10TC144-3 - 10K Gate ACEX-1K FPGA 144-LQFP | Intel / Altera
Référence : EP1K10TC144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $16.1 | $161,00 |
| 100 | $14.2 | $1 420,00 |
| 500 | $12.75 | $6 375,00 |
| 1 000 | $11.55 | $11 550,00 |
EP1K10TC144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital IC whose logic function is defined by user-supplied configuration bitstreams stored in on-chip SRAM. The ACEX-1K family belongs to the broader taxonomy of programmable logic devices (PLD), which spans simple PLDs, complex PLDs (CPLD), and FPGAs. Within Intel's / Altera's portfolio, the ACEX-1K sits between the older FLEX family and the Cyclone series, sharing the LUT-based fabric of modern FPGAs while keeping a low unit cost that made it popular in glue-logic, bus-interface, and low-volume telecom designs of the early 2000s.
Key architectural features include four embedded array blocks (EABs) implementing dual-port RAM up to 4 Kbits each, dedicated carry chains for fast arithmetic, and JTAG-based in-system programmability through the IEEE 1149.1 boundary-scan interface. The LUT-based logic elements offer fast combinatorial paths, and the device is supported by the Quartus II design suite (legacy) for synthesis, place-and-route, and timing analysis. Note that ACEX-1K devices are no longer recommended for new designs.
Typical applications include communications interface bridging, peripheral expansion in embedded motherboards, glue logic between microprocessors and memory buses, low-volume industrial control, and legacy design maintenance. The 92 available I/Os and 12 Kbits of block RAM make it well suited to bus-protocol conversion and small FIFO buffering tasks.
When designing with this part, ensure the 2.5V VCCINT and 3.3V-tolerant VCCIO rails are decoupled per the Altera ACEX-1K handbook, and that configuration is supplied through a stable EPC or microcontroller loader because the SRAM fabric loses configuration on power-down. Programming files are generated with Quartus II software. This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP1K10TC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K10TC144-3 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Typical Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K10TC144-3N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP1K10TC144-2N
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP1K10TC144-2
✅ Remplacement direct✓ En stock
$11.9 / unité
Voir la fiche technique →EP1K10TC144-1N
✅ Remplacement direct✓ En stock
$4.35 / unité
Voir la fiche technique →EP1K10TC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K30TC144-3
✅ Remplacement direct✓ En stock
$10.8 / unité
Voir la fiche technique →EP1K10TC144-3 Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Logic Elements / Cells | 576 |
| Typical Gates | 10,000 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 4 |
| User I/O Pins | 92 |
| Speed Grade | -3 |
| Maximum Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Process Technology | 0.22 µm CMOS |
| Boîtier | 144-LQFP (TQFP) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +70C (commercial) |
| Configuration Method | SRAM, JTAG IEEE 1149.1 |
Configuration des broches de EP1K10TC144-3
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | VCCINT — Core supply (2.5V) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | GND — Ground |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | VCCINT — Core supply (2.5V) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin (bank 3) |
| Broche 26 | I/O — User I/O pin (bank 3) |
| Broche 27 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Broche 28 | I/O — User I/O pin (bank 3) |
| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | VCCINT — Core supply (2.5V) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O pin (bank 4) |
| Broche 38 | I/O — User I/O pin (bank 4) |
| Broche 39 | VCCIO4 — I/O bank 4 supply (3.3V) |
| Broche 40 | I/O — User I/O pin (bank 4) |
| Broche 41 | I/O — User I/O pin (bank 4) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O pin (bank 4) |
| Broche 44 | I/O — User I/O pin (bank 4) |
| Broche 45 | VCCINT — Core supply (2.5V) |
| Broche 46 | I/O — User I/O pin (bank 4) |
| Broche 47 | I/O — User I/O pin (bank 4) |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O pin (bank 4) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | VCCIO4 — I/O bank 4 supply (3.3V) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | VCCINT — Core supply (2.5V) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | VCCINT — Core supply (2.5V) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | VCCINT — Core supply (2.5V) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O pin (bank 2) |
| Broche 88 | I/O — User I/O pin (bank 2) |
| Broche 89 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Broche 90 | I/O — User I/O pin (bank 2) |
| Broche 91 | I/O — User I/O pin (bank 2) |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O pin (bank 2) |
| Broche 94 | I/O — User I/O pin (bank 2) |
| Broche 95 | VCCINT — Core supply (2.5V) |
| Broche 96 | I/O — User I/O pin (bank 2) |
| Broche 97 | I/O — User I/O pin (bank 2) |
| Broche 98 | GND — Ground |
| Broche 99 | I/O — User I/O pin (bank 2) |
| Broche 100 | I/O — User I/O pin (bank 2) |
| Broche 101 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Broche 102 | I/O — User I/O pin (bank 2) |
| Broche 103 | I/O — User I/O pin (bank 2) |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — User I/O pin (bank 2) |
| Broche 106 | I/O — User I/O pin (bank 2) |
| Broche 107 | VCCINT — Core supply (2.5V) |
| Broche 108 | I/O — User I/O pin (bank 2) |
| Broche 109 | I/O — User I/O pin (bank 2) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 1) |
| Broche 112 | I/O — User I/O pin (bank 1) |
| Broche 113 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Broche 114 | I/O — User I/O pin (bank 1) |
| Broche 115 | I/O — User I/O pin (bank 1) |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — User I/O pin (bank 1) |
| Broche 118 | I/O — User I/O pin (bank 1) |
| Broche 119 | VCCINT — Core supply (2.5V) |
| Broche 120 | I/O — User I/O pin (bank 1) |
| Broche 121 | I/O — User I/O pin (bank 1) |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Broche 126 | I/O — User I/O pin (bank 1) |
| Broche 127 | I/O — User I/O pin (bank 1) |
| Broche 128 | GND — Ground |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | VCCINT — Core supply (2.5V) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | GND — Ground |
| Broche 135 | TDI — JTAG Test Data In |
| Broche 136 | TMS — JTAG Test Mode Select |
| Broche 137 | TCK — JTAG Test Clock |
| Broche 138 | nSTATUS — Configuration status |
| Broche 139 | nCONFIG — Configuration control (active low) |
| Broche 140 | DCLK — Configuration clock |
| Broche 141 | CONF_DONE — Configuration done indicator |
| Broche 142 | TDO — JTAG Test Data Out |
| Broche 143 | MSEL0 — Configuration mode select 0 |
| Broche 144 | MSEL1 — Configuration mode select 1 |
Applications typiques
EP1K10TC144-3 convient pour 6 applications: Legacy Bus Interface Bridging, Industrial Control Logic Replacement, Telecom Glue Logic and Protocol Conversion, Embedded System Peripheral Expansion, Test Equipment Custom Instrumentation, Legacy Design Maintenance and Repair.
Legacy Bus Interface Bridging
The EP1K10TC144-3's 92 user I/O pins and 12,288 bits of block RAM make it well suited for legacy bus interface bridging between microprocessors, memory, and peripherals such as ISA-to-PCI, VME, or custom parallel buses. Its 200 MHz internal operation allows glue-logic conversion at speeds that match most peripheral buses, while the four embedded array blocks (EABs) provide dual-port RAM for FIFO buffering between asynchronous clock domains. Placing the part between two bus connectors with proper VCCIO 3.3V rail isolation, designers can replace multiple 74-series TTL chips with a single reconfigurable device that adapts to evolving interface standards. The 144-LQFP footprint is the same as classic glue-logic packages, simplifying PCB migration from discrete-logic implementations.
Recommandé
Industrial Control Logic Replacement
In factory automation and process control, the EP1K10TC144-3 replaces obsolete discrete-logic boards implementing state controllers, timer chains, and alarm encoders. With 576 logic elements, it can hold tens of state machines plus combinational encoding logic, and its SRAM-based configuration supports field updates via JTAG when product firmware changes. Industrial users benefit from the part's commercial 0-70°C rating suitable for enclosed control cabinets and the 144-LQFP package's compatibility with standard reflow profiles. A typical design places the FPGA between sensor-conditioning ASICs and a microcontroller SPI/I²C bus, offloading bit-banging and protocol conversion. Note that for new industrial designs, AEC-Q100 is not applicable; choose a modern industrial-grade Cyclone or MAX 10 instead.
Recommandé
Telecom Glue Logic and Protocol Conversion
The EP1K10TC144-3 was widely deployed in early-2000s telecom equipment for low-speed protocol conversion, framing, and clock-domain crossing. Its four embedded array blocks implement dual-port RAM buffers for HDLC, UART, or framing tasks, while the 200 MHz internal frequency supports high-speed serial bit alignment. The 92 I/Os accommodate parallel TDM bus interfaces common in T1/E1 and H.110 telecom backplanes. In a typical application the FPGA sits between a framer IC and a network processor, offloading cell delineation and alarm detection. Designers should validate jitter tolerance with the VCCINT 2.5V supply and observe the Altera recommended PLL configuration guidelines if more than one clock domain is needed.
Recommandé
Embedded System Peripheral Expansion
Embedded motherboards in test, medical, and instrumentation equipment frequently pair a low-cost microcontroller with an FPGA that adds custom peripherals: PWM generators, encoder counters, custom LCD controllers, or parallel data acquisition channels. The EP1K10TC144-3 with 10K gates and 92 I/Os is sized for exactly this role, providing several dozen soft peripherals alongside bus-interface glue. The 12 Kbits of block RAM serves as FIFO storage for ADC/DAC streaming. In a typical design, the FPGA connects to the MCU via an 8/16-bit SRAM-style bus, offloading deterministic timing tasks from the MCU's interrupt-driven software. Verify timing margin with Quartus II Static Timing Analysis since the part is in NRND status.
Recommandé
Test Equipment Custom Instrumentation
Custom ATE and bench-instrument designers use the EP1K10TC144-3 to implement pattern generators, custom stimulus sequencers, and protocol-aware triggering. The 200 MHz operation supports high-speed digital stimulus generation, and the dual-port EAB RAM stores long test patterns or captured waveforms. The 144-LQFP package allows inspection-friendly hand-soldering for prototype builds, and JTAG-based programming enables rapid firmware iteration during development. A typical test fixture places the FPGA between a USB or Ethernet host controller and a device-under-test, with the FPGA translating high-level commands into device-specific timing sequences. The NRND status means engineers should plan migration to MAX 10 or Cyclone for new ATE platforms.
Recommandé
Legacy Design Maintenance and Repair
The EP1K10TC144-3 remains an active maintenance component for installed equipment in telecom central offices, industrial control systems, and military electronics with multi-decade service lives. Repair depots and OEM service organizations use it to rebuild failed boards without redesigning the surrounding PCB. With 144-LQFP same-as-original packaging, the part drops into existing boards designed in the early 2000s. Authorized distributor stock at DigiKey and Heisener (verified 2026-09-07) supports repair operations. For long-term support, customers should engage Intel / Altera franchised distributors about lifetime-buy arrangements or migrate to the Cyclone IV EP4CE6E22, which offers a pin-compatible 144-pin footprint and modern Quartus Prime toolchain.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K10TC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K10TC144-3N | EP1K10TC144-2N | EP1K10TC144-1N | EP1K30TC144-3 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP144) | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 30,000 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 (mid) | -1 (slowest) | -3 (fastest) |
| Logic Elements | 576 | 576 | 576 | 576 | 1,728 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 24,576 |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | RoHS / Lead-Free | RoHS / Lead-Free | RoHS / Lead-Free | Non-RoHS (SnPb) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest speed grade in same-footprint ACEX-1K family (vs EP1K10TC144-2N)
- RoHS compliance availability in same package (vs EP1K10TC144-3N)
- Smallest ACEX-1K member (10K gates) with 92 I/Os (vs EP1K30TC144-3)
Notes de conception
The EP1K10TC144-3 requires separate 2.5V VCCINT and 3.3V VCCIO rails; place 0.1µF decoupling capacitors adjacent to every VCCINT and VCCIO pin pair, plus a single 10µF bulk tantalum or ceramic capacitor near the package. Power-on sequencing is not critical but VCCINT should reach 2.5V within 100ms of VCCIO reaching 3.3V to avoid latch-up; in-circuit supervisors are recommended for production boards. Estimated: ICCINT typical ~50 mA and ICCIO ~10 mA per bank based on ACEX-1K family characteristics - verify with worst-case design utilization via the Quartus II PowerPlay analyzer.
Route all four VCCIO bank supplies (VCCIO1-VCCIO4) as wide traces or planes with multiple vias to inner planes; the 144-LQFP package's lead pitch is 0.5 mm and requires 4-mil trace/space rules with microvia stack-ups for dense breakout. Place the configuration EEPROM or MCU configuration driver within 50 mm of DCLK/nCONFIG/nSTATUS/CONF_DONE to avoid signal-integrity issues. Keep JTAG TCK trace under 100 mm with 22Ω series damping if longer routing is unavoidable. Connect MSEL0/MSEL1 to defined logic levels (typically 0/0 for AS mode or 1/0 for PS mode) - do not leave floating.
ACEX-1K SRAM-based FPGAs lose configuration on power-down - a non-volatile configuration source (EPC1, EPC2, MCU bootloader, or flash) is mandatory. Do not leave JTAG TDI/TMS floating during operation; tie them to known logic levels via 10kΩ pull-ups. The configuration clock (DCLK) must be stable before nCONFIG is released. Avoid 5V signals on I/O pins without external series resistors, since VCCIO is 3.3V. For multi-clock designs, use the dedicated CLK pins (CLK0-CLK3) rather than routed clocks to minimize skew.
Estimated: at 200 MHz toggle rate with 70% utilization across 576 LEs, the EP1K10TC144-3 dissipates approximately 0.5-0.8W. The 144-LQFP package has a theta_JA of approximately 35-45 C/W on a standard JEDEC 4-layer PCB, resulting in a 20-35 C junction temperature rise above ambient - well within the 0-70 C commercial rating. For higher utilization designs, add thermal vias under the exposed die pad region and route inner copper planes to spread heat. Do not use the part in sealed enclosures above 60 C ambient without verifying junction temperature via the thermal-resistance formula Tj = Ta + (Pd × theta_JA).
Informations de conformité
EP1K10TC144-3 (SnPb terminal finish) is non-RoHS; choose EP1K10TC144-3N for RoHS/lead-free compliance. ACEX-1K family is not AEC-Q100 qualified (commercial grade only). Reach and conflict-minerals compliance per Intel / Altera product declaration.