EP1K30TC144-1 - ACEX-1K 30K Gates FPGA, 144-LQFP | Altera
부품 번호: EP1K30TC144-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.75 | $9,750.00 |
EP1K30TC144-1 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic, memory blocks, and dedicated I/O functions in a single IC after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. The ACEX-1K family specifically targets low-cost system-on-a-programmable-chip (SOPC) integration, combining look-up-table (LUT)-based logic with dual-port embedded array blocks (EABs) that can be configured as memory or specialized logic functions.
Key features of the EP1K30TC144-1 include 30,000 typical gates, 1,728 logic elements (cells), 24,576 total RAM bits, 216 LABs, and 102 maximum user I/O pins. The device operates from a 2.5 V core supply and supports in-system programmability via SRAM configuration memory. The -1 speed grade corresponds to the slowest of the three available ACEX-1K speed bins, trading timing margin for lower price.
Architecturally, the EP1K30TC144-1 uses a continuous, hierarchical interconnect structure of fast row and column channels that route signals between LABs and embedded array blocks (EABs). Each EAB provides up to 4,096 bits of RAM that can be used for true dual-port, simple dual-port, or single-port memory, supporting megafunctions such as FIFOs, ROM, and CAM. The LUT-based LE delivers predictable 4-input combinational logic plus a dedicated carry chain for efficient arithmetic.
Typical applications include glue logic replacement, low-volume ASIC prototyping, industrial control interfaces, communication bridges, and embedded control subsystems where the 30K-gate density and 102 I/Os offer an attractive balance between capability and cost. The 144-LQFP package is also convenient for hand-solderable prototyping or production runs where BGA handling infrastructure is not required.
When designing with this part, note that ACEX-1K devices are SRAM-based and require a configuration ROM or microcontroller to load the bitstream at every power-up. The 144-LQFP package has limited thermal headroom compared to BGA variants, so high-toggle-rate designs should evaluate junction temperature against the package's theta_JA.
This page synthesizes distributor pricing from 19+ sources, same-brand Altera drop-in alternatives in the same 144-LQFP footprint, and practical design notes not consolidated in the manufacturer datasheet, delivering decision-ready information for sourcing and engineering teams.
드롭인 대체품: EP1K30TC144-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K30TC144-1 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, Operating Temperature, Configuration.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K30TC144-2
✅ 드롭인✓ 재고 있음
$18.4 / 개
데이터시트 보기 →EP1K30TC144-3
✅ 드롭인✓ 재고 있음
$10.8 / 개
데이터시트 보기 →EP1K30TC144-1N
✅ 드롭인✓ 재고 있음
$11.5 / 개
데이터시트 보기 →EP1K30TI144-2
✅ 드롭인✓ 재고 있음
$13.85 / 개
데이터시트 보기 →EP1K10TC144-1
✅ 드롭인✓ 재고 있음
$9.95 / 개
데이터시트 보기 →EP1K30TC144-1 최대 정격 & 전기적 특성
| Series | ACEX-1K |
| Family | ACEX 1K |
| Equivalent Gates | 30,000 |
| Number of Logic Elements / Cells | 1,728 |
| Number of LABs / CLBs | 216 |
| Total RAM Bits | 24,576 |
| Number of I/O | 102 |
| 패키지 | 144-LQFP (TQFP) |
| 실장 유형 | Surface Mount |
| Core Supply Voltage | 2.5 V |
| Technology | CMOS, SRAM-based |
| Speed Grade | -1 (slowest in ACEX-1K family) |
| 동작 온도 | 0C to +70C (commercial) |
| Configuration Method | SRAM, in-system programmable |
EP1K30TC144-1 144-lqfp (tqfp) 핀 구성 가이드
EP1K30TC144-1(144-lqfp (tqfp) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1K30TC144-1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1K30TC144-1 적합 용도: 6 애플리케이션s: ASIC Prototyping and Logic Emulation, Industrial Control and Glue Logic Replacement, Communication Bridge and Protocol Conversion, Embedded Display and Video Processing Front-End, Educational and FPGA Learning Platforms, Legacy System Maintenance and Drop-In Board Replacement.
ASIC Prototyping and Logic Emulation
The EP1K30TC144-1's 30,000 equivalent gates and 1,728 logic elements provide a low-cost platform for prototyping custom ASICs before committing to mask costs. Designers map RTL onto the LUT-based fabric, validate timing with the -1 speed grade's conservative Fmax, and use the 24,576 bits of embedded RAM for scratch buffers and FIFOs. The 144-LQFP package enables hand-solderable prototypes and fast design iterations, while JTAG configuration allows rapid bitstream reloads during verification cycles.
추천
Industrial Control and Glue Logic Replacement
With 102 user I/Os and 2.5 V core supply, the EP1K30TC144-1 consolidates multiple 74-series glue-logic chips, counters, and state machines into a single programmable device for industrial controllers. The 216 LABs deliver ample logic density for motor-control sequencing, sensor conditioning, and parallel bus arbitration, while the 144-LQFP package tolerates factory-floor thermal environments when industrial-grade parts are specified. The -1 speed grade is acceptable for control loops running below 50 MHz.
추천
Communication Bridge and Protocol Conversion
The EP1K30TC144-1 supports UART, SPI, I2C, and custom parallel-protocol bridges that glue together mixed-vintage subsystems in telecom and networking equipment. Its 102 I/Os accommodate wide data buses, and the EAB-based dual-port RAM (24,576 bits) provides FIFO buffering between asynchronous clock domains. ACEX-1K fabric at -1 speed grade easily meets typical 25-50 MHz bridge timing, and JTAG-based field reconfiguration enables post-deployment firmware updates.
추천
Embedded Display and Video Processing Front-End
The EP1K30TC144-1 handles timing-controller duties for small TFT/LCD panels, generating HSYNC/VSYNC, pixel clocks, and color-space conversions from digital video sources. Its 1,728 logic elements are sufficient for medium-resolution pixel pipelines, and the 24,576 bits of embedded RAM double as line buffers. The 144-LQFP footprint is widely accepted in industrial-display reference designs, and the -1 speed grade supports typical 25 MHz pixel clocks without timing closure issues.
추천
Educational and FPGA Learning Platforms
The EP1K30TC144-1 is a popular teaching device in university digital-design labs because it offers meaningful logic capacity (30K gates, 1,728 LEs) without overwhelming beginners. The 144-LQFP package is forgiving for student soldering and accepts standard 0.5 mm-pitch QFP breakout boards, while the Altera Quartus toolchain supports industry-standard HDL design flows. The -1 speed grade's relaxed timing makes first-time bring-up easier, reducing lab debug cycles for student projects.
추천
Legacy System Maintenance and Drop-In Board Replacement
For long-lifecycle industrial, medical, and aerospace systems where the EP1K30TC144-1 was originally designed in, the part remains a critical spare for board-level repair. Stocking distributors such as Heisener and Micro-Semiconductor list thousands of pieces as of September 2026, ensuring field-replacement availability even after NRND announcement. The 144-LQFP footprint, established ACEX-1K bitstream format, and identical pinout across speed grades (-1, -2, -3) allow straightforward swap-in repair without PCB rework.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K30TC144-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K30TC144-2 | EP1K30TC144-3 | EP1K30TC144-1N | EP1K30TI144-2 | EP1K10TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 10,000 (-67%) |
| Logic Elements / Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 (-67%) |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 12,288 (-50%) |
| Number of LABs / CLBs | 216 | 216 | 216 | 216 | 216 | 72 (-67%) |
| Number of User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -1 (slowest) | -2 (~20-30% faster Fmax) | -3 (fastest, +40-60% vs -1) | -1 (industrial temp) | -2 (industrial temp) | -1 (slowest) |
| Operating Temperature | 0C to +70C (commercial) | 0C to +70C | 0C to +70C | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C |
주요 차별점
- Same package as -2 and -3 speed grades with full pin compatibility (vs EP1K30TC144-2)
- Industrial temperature grade option in same footprint (vs EP1K30TC144-1N)
- Halved logic and memory when stepping down to lower density (vs EP1K10TC144-1)
설계 노트
The EP1K30TC144-1 requires a regulated 2.5 V VCCINT supply with adequate decoupling. Place 0.1 uF ceramic capacitors within 5 mm of every VCCINT/GND pair, and add a 10 uF bulk capacitor near the supply pin. According to the ACEX-1K datasheet, VCCINT ripple above 5% can cause configuration memory corruption, so use a low-noise LDO rather than a switching regulator for the core rail when possible. I/O banks may operate at 2.5 V or 3.3 V depending on bank voltage selection.
Estimated: At full activity on all 102 I/Os toggling at 50 MHz, the EP1K30TC144-1 dissipates approximately 0.5-1.0 W. The 144-LQFP package has a higher theta_JA than the BGA 256-ball variant (typically 25-35 C/W without airflow). For designs sustained at maximum junction temperature (125 C for commercial), confirm thermal headroom using the package thermal metrics in the ACEX-1K datasheet and consider a small heatsink or airflow for continuous high-utilization workloads.
The 144-LQFP package uses 0.5 mm lead pitch, which is hand-solderable with a fine-tip iron but requires careful PCB layout. Use a 4-layer PCB with continuous power and ground planes under the device to provide low-impedance VCCINT distribution and signal return paths. Route all clock inputs (CLK0, CLK1) on inner layers with controlled impedance, and keep JTAG signals (TDI, TDO, TMS, TCK) short to avoid configuration failures.
Do not assume the EP1K30TC144-1 retains its bitstream through power cycling. As an SRAM-based FPGA, it must be reconfigured at every power-up via a configuration ROM (Altera EPC2 family) or external microcontroller. Plan PCB footprint to accommodate a configuration memory device. Also note that the -1 speed grade is the slowest ACEX-1K bin; designs targeting above 100 MHz Fmax should select -2 or -3 instead.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not present in verified distributor or datasheet snippets; the part is classified as NRND by Altera/Intel as of September 2026. Verify compliance directly with the manufacturer for production use.