EP1S10B672C6 - Stratix 10,570 LEs FPGA 672-BGA | Intel / Altera
부품 번호: EP1S10B672C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $299.12 | $299.12 |
| 10 | $275 | $2,750.00 |
| 100 | $240 | $24,000.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $185 | $185,000.00 |
EP1S10B672C6 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, dedicated block memory, and DSP/multiplier slices that an end user can re-program at the board level. In the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers in the digital IC family. Unlike an ASIC, an FPGA is re-programmable in the field and ships as a generic fabric that the designer configures via HDL (VHDL/Verilog) and a vendor toolchain (Quartus II for Altera). The Stratix family targets high-performance applications that need abundant DSP blocks, embedded memory, and high-speed transceivers.
Key features include 10,570 logic cells, 1,057 LABs (Logic Array Blocks), 345 user I/Os, and 672 BGA balls on a 35 x 35 mm substrate with 1.27 mm pitch. The 130 nm process node provides a balance between density and static/leakage power, while the 1.5 V core simplifies integration with DDR SDRAM memories that were common in the mid-2000s.
Technical depth: the architecture embeds TriMatrix memory blocks (MRAM/M4K), DSP blocks optimized for multiply-accumulate operations, and dedicated clock management with PLLs. The Stratix family was Altera's first to feature on-chip transceivers at gigabit rates, making the EP1S10B672C6 suitable for protocol bridging and high-bandwidth datapaths.
Typical applications include telecom line-card interface logic, protocol-bridging bridges between PCI/PCI-X and DDR memory subsystems, custom DSP co-processors, and industrial control fabrics. The 672-BGA package supports high signal-count designs requiring many parallel I/O lanes. When designing with this device, plan for Quartus II toolchain support (legacy versions), JTAG-based in-system programming, and the 1.5 V core supply decoupling requirements of the Stratix family.
드롭인 대체품: EP1S10B672C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10B672C6 (동일 폼 팩터 및 풋프린트) — 차이점: DSP Blocks, Operating Temperature, Process Technology, Configuration Method, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F672C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1S10F672C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S10F672I6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S10B672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$67.9 / 개
데이터시트 보기 →EP1S10B672I6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S10B672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$140 / 개
데이터시트 보기 →EP1S10B672C6 최대 정격 & 전기적 특성
| Manufacturer | Intel / Altera |
| Series | Stratix |
| Logic Elements / Cells | 10,570 |
| LABs / CLBs | 1,057 |
| User I/Os | 345 |
| 패키지 | 672-BBGA (35 x 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core) | 1.5 V (1.425 V - 1.575 V) |
| Process Technology | 130 nm CMOS |
| Maximum Operating Frequency | 450.05 MHz |
| 동작 온도 | 0 C to 85 C (Commercial Extended) |
| Logic Family | CMOS |
| 실장 유형 | Surface Mount (BGA) |
| Supplier Device Package | 672-BGA |
| Memory | Embedded TriMatrix (MRAM/M4K) blocks |
| DSP Blocks | Yes, dedicated multiply-accumulate blocks |
| Clock Management | PLLs for clock synthesis |
| Configuration | JTAG / passive serial / fast passive parallel |
| RoHS 상태 | Compliant |
EP1S10B672C6 672-bga 핀 구성 가이드
EP1S10B672C6(672-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10B672C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10B672C6 적합 용도: 7 애플리케이션s: Telecom Line-Card Interface Logic, DSP Co-Processor for Video Processing, Industrial Control and Factory Automation, DDR SDRAM Memory Controller Bridge, PCI / PCI-X Bus Bridge, Aerospace and Defense Legacy Systems, High-Speed Custom Test Equipment.
Telecom Line-Card Interface Logic
The EP1S10B672C6 fits telecom line-card interface logic because its 10,570 logic elements and 345 user I/Os provide ample capacity for backplane bridges, framer interfaces, and serializer/deserializer glue logic. The Stratix family's embedded TriMatrix memory supports packet buffer FIFOs up to 512 Kbits per M4K block, while dedicated DSP blocks accelerate Reed-Solomon and CRC operations. Compared with ASIC alternatives, this FPGA enables field reprogrammability for protocol updates (POS-PHY, Utopia, SPI-4.2) without respin.
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DSP Co-Processor for Video Processing
With its dedicated DSP blocks optimized for multiply-accumulate operations, the EP1S10B672C6 suits DSP co-processing in video broadcast and image processing systems. At 450 MHz fabric speed, the device can sustain hundreds of MMACs per second, sufficient for SD/HD video scaling, deinterlacing, and color-space conversion. The 345 I/Os handle parallel video buses (BT.656, BT.1120) and DDR SDRAM interfaces, with on-chip TriMatrix memory acting as line buffers.
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Industrial Control and Factory Automation
The EP1S10B672C6's 345 I/Os and commercial-extended temperature range (0-85 C) make it suitable for industrial control PLCs, motor-drive controllers, and factory automation fabrics. The 1.5 V core with 130 nm process provides reliable operation in control cabinet environments, while BGA package ensures mechanical robustness against vibration. Engineers typically implement custom protocols (EtherCAT, Profinet) and deterministic timing using the on-chip PLLs.
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DDR SDRAM Memory Controller Bridge
The Stratix family's dedicated DDR SDRAM controllers and 345 I/Os make the EP1S10B672C6 a natural fit as a memory bridge between legacy processors and DDR1/DDR2 SDRAM. The 1.5 V core matches DDR memory voltage requirements, simplifying power design, while abundant I/O banks support 32/64-bit memory interfaces with parity/ECC. TriMatrix memory blocks store address-translation tables for processor-memory mapping.
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PCI / PCI-X Bus Bridge
The 672-BGA variant of the EP1S10B672C6 with its abundant I/O count and embedded memory is widely deployed as a PCI/PCI-X bridge in workstation and server mainboards. The fabric implements 32-bit/64-bit PCI-X 133 MHz interfaces with built-in transaction-layer logic, while on-chip TriMatrix buffers write posting queues. BGA package ensures signal integrity at 133 MHz bus speeds.
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Aerospace and Defense Legacy Systems
The EP1S10B672C6 remains in service across aerospace and defense platforms where formal qualification of the original part makes redesign prohibitive. Its 1.5 V core, commercial-extended temperature range, and BGA robustness suit avionics databuses, radar signal pre-processing, and military comms encryption engines. Long-term supply via Rochester Electronics ensures availability for multi-decade support windows typical in defense programs.
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High-Speed Custom Test Equipment
Test and measurement equipment including logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP1S10B672C6's 450 MHz fabric and abundant I/Os to generate and capture parallel data streams. Engineers implement custom pattern generators, BERT cores, and protocol-state machines in HDL, with the JTAG chain enabling rapid iteration. The BGA package's thermal performance supports continuous high-utilization operation.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S10B672C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F672C7N | EP1S10F672C6N | EP1S10F672I6N | EP1S10B672C7N | EP1S10B672I6 | EP1S10B672C7 |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 672-BGA (35x35 mm) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Logic Elements | 10,570 | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -6 (same) | -7 (faster) | -6 (same) | -7 (faster) |
| Operating Temperature | 0 C to 85 C (Commercial Extended) | 0 C to 85 C - same | 0 C to 85 C - same | -40 C to +100 C (Industrial) | 0 C to 85 C - same | -40 C to +100 C (Industrial) | 0 C to 85 C - same |
| User I/Os | 345 | 345 - same | 345 - same | 345 - same | 345 - same | 345 - same | 345 - same |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Maximum Frequency | 450.05 MHz | Higher Fmax (speed grade -7) | 450.05 MHz - same | 450.05 MHz - same | Higher Fmax (speed grade -7) | 450.05 MHz - same | Higher Fmax (speed grade -7) |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Drop-in compatible with -7 speed grade variant for higher Fmax (vs EP1S10F672C7N)
- Commercial-extended temperature support within same Stratum die (vs EP1S10B672I6)
- 10,570 LEs in 672-BGA positions for highest-density Stratix-1 (vs EP1S10F484 (484-BGA variant))
- Long-term supply via Rochester Electronics for legacy support (vs Cyclone 10 LP (newer family))
설계 노트
Estimated: the Stratix EP1S10 core draws 0.5-1.5 W at typical toggle rates (15-30% utilization), with peak I/O bank current reaching 2-4 A during simultaneous switching. Provide at least four 0.1 uF + four 10 uF ceramic decoupling capacitors per VCCINT and VCCIO bank, plus a single 100 uF bulk capacitor per supply rail. PLL analog supplies (VCC_PLL) require additional pi-filter (ferrite + 10 uF + 0.1 uF) to minimize jitter. Estimated power assumes 25 C ambient and 200 MHz typical clock.
The 672-BGA package at 1.27 mm pitch demands controlled-impedance PCB routing (50 ohm single-ended, 100 ohm differential) and 4-6 layer stackup with continuous ground planes beneath the BGA. Escape routing of inner-row balls requires microvia or sequential lamination build-up; standard 8 mil via-in-pad may not suffice for all inner rows. Use X-ray inspection post-assembly to verify BGA joint integrity, especially on prototype builds.
Estimated: the 672-BGA package has theta_JA of approximately 15-20 C/W with a properly designed thermal via array (4-9 thermal vias under the die, 0.3 mm drill). At 2 W dissipation this yields a 40 C rise above ambient, well within the 85 C commercial-extended limit. For continuous high-utilization workloads (>4 W), add a copper heat spreader or forced-air cooling. Industrial-temperature variants (EP1S10B672I6) require derating curves beyond 70 C ambient.
Three common pitfalls when designing with the EP1S10B672C6: (1) incorrect MSEL pin configuration can prevent JTAG recognition - refer to the Stratix handbook Chapter 1 for the proper MSEL pull-up/pull-down scheme; (2) configuration data corruption from noisy power-up requires proper nCONFIG/nSTATUS sequencing; (3) confusing 'B' (commercial-extended temp) with 'I' (industrial temp) in the part number leads to out-of-spec operation in harsh environments - verify temperature grade carefully when sourcing.
The 672-BGA package at 1.27 mm pitch creates dense signal escape routing that requires careful stackup planning. Maintain 3W spacing rule (3x trace width) between adjacent high-speed signals to minimize crosstalk; use length matching within 50 mils for DDR SDRAM interfaces. Series-damping resistors (33 ohm) on clocks and high-speed bus lines reduce overshoot. Perform post-layout signal integrity simulation with the Quartus II IBIS models before committing to fabrication.
규정 준수 정보
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Industrial-temperature variants (EP1S10B672I6) extend operating range to -40 C to +100 C.
