EP1S10F672I7 - Stratix FPGA 10K LE, 672-FBGA | Intel
부품 번호: EP1S10F672I7 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $174.9 | $174.90 |
| 10 | $165.5 | $1,655.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.4 | $69,200.00 |
| 1,000 | $124.75 | $124,750.00 |
EP1S10F672I7 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and I/O cells that designers can program after manufacture to implement arbitrary digital functions. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design flexibility-versus-cost hierarchy: microcontrollers execute software, ASICs implement a fixed hardware function, and FPGAs can be reconfigured to implement any hardware function. The Stratix family was Intel's first FPGA generation under the Altera banner before Cyclone, Arria, and Stratix V/10 families, optimized for high-speed parallel DSP and memory-intensive designs.
Key features of the EP1S10F672I7 include 10,570 logic elements, dedicated DSP blocks for high-throughput multiply-accumulate operations, embedded TriMatrix memory for distributed and block RAM, support for multiple I/O standards including LVDS, and configuration via JTAG or serial/parallel PROM. The 35 x 35 mm 1.27 mm-pitch FBGA-672 package supports industrial-grade thermal ranges, and the I7 suffix denotes an industrial temperature grade (typically 0 to +85 C operating range as captured in distributor listings).
The EP1S10F672I7 architecture combines look-up-table-based logic elements with dedicated hardware multiplier blocks, allowing efficient implementation of finite impulse response (FIR) filters, FFT engines, and forward error correction (FEC) codecs. The internal 1.5 V core combined with selectable I/O voltages lets the FPGA bridge between modern low-voltage processors and legacy 3.3 V peripherals, simplifying board integration in mixed-voltage systems.
Typical applications include telecom base station channel cards, software-defined radio, video broadcast and image processing, high-speed data acquisition, ASIC prototyping, and military/aerospace signal processing. The Stratix family's generous block RAM and DSP ratio also make it well suited to encryption accelerators and radar front-end processing.
When designing with this device, verify Quartus II support status because legacy Stratix devices have moved out of active production. Plan for possible EOL/NRND transitions and confirm with Intel FPGA support that your chosen Quartus version still targets this die, or migrate to Stratix II/III equivalents.
This page synthesizes distributor pricing, drop-in alternative Stratix family MPNs, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP1S10F672I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10F672I7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, DSP Blocks, Package, Process Technology, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F672C7
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP1S10F672C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1S10F672C6
✅ 드롭인✓ 재고 있음
$72 / 개
데이터시트 보기 →EP1S10B672C7
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →EP1S10B672C7N
✅ 드롭인✓ 재고 있음
$67.9 / 개
데이터시트 보기 →EP1S10B672C6
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP1S10F672I7 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 10,570 |
| User I/O Pins | 345 |
| 패키지 | FBGA-672, 35 x 35 mm, 1.27 mm pitch |
| 동작 온도 | 0 C to +85 C (industrial grade, I7) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 0.13 um CMOS |
| Maximum Internal Clock | 420.17 MHz (per datasheet) |
| Logic Family | CMOS |
| Device Type | FPGA (Field Programmable Gate Array) |
| Total Pins | 672 (FBGA) |
| Configuration Method | JTAG / serial / parallel PROM |
| 메모리 유형 | TriMatrix embedded block RAM + distributed RAM |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | unknown - verify per lot |
EP1S10F672I7 fbga-672, 35 x 35 mm, 1.27 mm pitch 핀 구성 가이드
EP1S10F672I7(fbga-672, 35 x 35 mm, 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10F672I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10F672I7 적합 용도: 6 애플리케이션s: Telecom Base Station Channel Card, Software Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Video Broadcast Image Processing, High-Speed Data Acquisition Front-End, Military and Aerospace Signal Processing.
Telecom Base Station Channel Card
The EP1S10F672I7 fits telecom base station channel cards because its 10,570 LEs plus dedicated DSP blocks deliver enough parallel processing for uplink/downlink baseband functions at 420 MHz internal clock. Its TriMatrix memory supports distributed and block RAM buffering for symbol-rate sample streams, while 345 user I/O pins comfortably connect to multiple ADC/DAC lanes, CPRI/OBSAI links, and backplane SERDES. Industrial temperature grade (0 to +85 C) suits outdoor cabinet deployments. Use it with EP2S60 Stratix II for headroom if future capacity growth is anticipated.
추천
Software Defined Radio (SDR) Baseband
For SDR baseband, the EP1S10F672I7's hardware multiplier DSP blocks accelerate FIR filters and FFT engines common in digital down-conversion chains. The 1.5 V core keeps dynamic power reasonable even at 420 MHz, while 1.27 mm-pitch FBGA-672 supports controlled-impedance routing required for parallel LVDS ADC interfaces. With 10K LEs, single-board designs can integrate channelizer, demodulator, and MAC-layer logic. Pair with EP1K50 series devices for I/O expansion or pre/post-processing glue logic.
추천
ASIC Prototyping and Emulation
The EP1S10F672I7 is well suited as an ASIC prototyping vehicle for designs in the 5K-15K gate-equivalent range. Designers can map RTL partitions to the 10,570 LEs, use TriMatrix block RAM to emulate SRAM/DRAM controllers, and leverage 345 I/O pins to bring out entire bus interfaces for bench validation. Industrial temperature grade allows bring-up in thermally realistic enclosures. Quartus II software provides time-domain multiplexing to map larger ASICs onto several FPGAs in co-emulation.
추천
Video Broadcast Image Processing
Broadcast video processing applications benefit from the EP1S10F672I7's high I/O count and DSP capability for real-time color-space conversion, scaling, and overlay composition. With 345 user I/O pins, designers can interface to multiple parallel BT.656/BT.1120 video streams plus audio and metadata channels. The 420 MHz internal clock supports SD/HD processing per device, and the FBGA-672 footprint accommodates dense controlled-impedance routing for parallel video buses. Industrial temperature grade supports broadcast head-end environments.
추천
High-Speed Data Acquisition Front-End
High-speed data acquisition cards use the EP1S10F672I7 to capture LVDS-parallel ADC outputs, perform real-time DSP (decimation, channelization, FFT), and forward results to host processors via PCI/PCIe or Gigabit Ethernet. The device's 345 I/O pins comfortably handle 8-16 LVDS pairs plus control I/O, while DSP blocks accelerate multiply-accumulate operations at sample rates up to 420 MHz. Industrial temperature grade is appropriate for laboratory and field-deployed instrumentation.
추천
Military and Aerospace Signal Processing
Military and aerospace signal processing applications leverage the EP1S10F672I7's industrial temperature range, radiation-tolerant design flow, and reconfigurable logic for radar, EW, and SIGINT subsystems. The 10K-LE capacity fits channelized receiver back-ends where DSP blocks perform pulse compression, beamforming, and detection. The FBGA-672 package supports hermetic and ruggedized PCB assemblies. Verify lot-level screening and extended-temperature variants with Intel FPGA military programs if full -55 C to +125 C operation is required.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S10F672I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F672C7 | EP1S10F672C7N | EP1S10F672C6 | EP1S10B672C7 | EP1S10B672C7N | EP1S10B672C6 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-672 (35x35 mm, 1.27 mm pitch) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) |
| Brand | Intel (formerly Altera) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 10,570 | 10,570 (same) | 10,570 (same) | 10,570 (same) | 10,570 (same) | 10,570 (same) | 10,570 (same) |
| Temperature Grade | Industrial 0 to +85 C (I7) | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C |
| Speed Grade | -7 (faster) | -7 | -7 | -6 (slower bin) | -7 | -7 | -6 (slower bin) |
| Lead-Free (RoHS) | unknown - verify per lot | unknown | Yes (N suffix) | unknown | unknown | Yes (N suffix) | unknown |
| User I/O Pins | 345 | 345 | 345 | 345 | 345 | 345 | 345 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Family / Process | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um |
주요 차별점
- Industrial temperature grade variant (vs EP1S10F672C7)
- Faster -7 speed grade (vs EP1S10F672C6)
- Lead-free RoHS variant available (vs EP1S10F672C7 (without N suffix))
- Identical die to other EP1S10F672 variants (vs EP1S10B672C7 (B-suffix alternate))
설계 노트
The FBGA-672 package requires a thermal pad or thermal vias to a copper heatsink area. Estimate: at 420 MHz internal clock and typical Stratix toggle activity (~30%), core power dissipation is roughly 1.5-2 W, plus I/O power proportional to switching rate. Use at least 4-layer PCB with solid inner ground plane and 0.5-1 square inch of top-layer copper under the BGA, plus thermal via array (0.3 mm vias, 1 mm pitch) for production designs. Always verify with on-board thermistor for production validation.
BGA fan-out must use either via-in-pad (with plugged and plated-over vias) or dog-bone escape routing. Maintain 50 ohm controlled impedance for LVDS and 60 ohm for LVTTL/CMOS single-ended signals. Provide at least four dedicated power planes (1.5 V core, 3.3 V I/O, auxiliary, ground) with 22 uF + 0.1 uF + 10 uF decoupling placed as close to each power ball cluster as possible. BGA routing requires blind/buried vias or sequential lamination for full fanout on a 4-layer board.
Common pitfalls with mature Stratix devices: (1) using a Quartus version that no longer supports original Stratix - verify tool support before committing to a design; (2) confusing the I7 speed/temperature suffix with a memory size or package code - I = industrial, 7 = speed grade; (3) ignoring the configuration scheme - the EP1S10F672I7 requires a configuration device (EPC2/EPC4/EPC8 family) or JTAG download cable; (4) power sequencing - core 1.5 V must ramp before I/O voltages for proper power-on reset. Always verify with Quartus II PowerPlay early in the design.
For LVDS I/O, place 100 ohm differential termination resistors within 7 mm of the FPGA receiver pins. Series AC-coupling capacitors (100 nF) are recommended for inter-board LVDS links to prevent DC bias drift. For parallel ADC interfaces running above 100 MHz DDR, use internal soft-logic SERDES or external clock buffers (e.g., CY2305) to maintain low jitter. Verify SI with HyperLynx or similar tool before tape-out.
규정 준수 정보
EP1S10F672C7N and EP1S10B672C7N variants carry confirmed lead-free RoHS finish. Standard EP1S10F672I7 RoHS status is not stated in current distributor listings - request lot-specific certificate from supplier. AEC-Q100 not applicable (FPGA, not automotive discrete).
