EP1S10F672C6 - 10K LE Stratix FPGA 672-BGA | Intel (Altera)
부품 번호: EP1S10F672C6 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 500 | $76.5 | $38,250.00 |
| 1,000 | $72 | $72,000.00 |
EP1S10F672C6 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP multipliers, and high-speed transceivers. FPGAs occupy the top of the programmable-logic hierarchy (FPGA > CPLD > PLD > programmable logic), serving as the most flexible class of digital ICs and supporting silicon re-spin avoidance through software-defined hardware. The Stratix family, launched in 2002, was Altera's first device family built around embedded TriMatrix memory, DSP blocks, and high-speed I/O - defining the modern high-density FPGA.
Key features of the EP1S10F672C6 include 1057 logic array blocks (LABs), 6 embedded DSP blocks, 1.5 V core voltage with 3.3 V I/O standard support, dual-purpose configuration pins, JTAG IEEE 1149.1 boundary-scan test, and in-system programmability via the passive serial (PS), fast passive parallel (FPP), or Active Serial (AS) configuration schemes. The commercial temperature grade (0C to +85C ambient) makes it suitable for controlled-environment designs.
Typical applications include digital signal processing, telecommunications infrastructure, high-speed data acquisition systems, ASIC prototyping, and embedded control platforms. The dense logic capacity and integrated memory enable single-chip implementations of complex data paths that previously required multiple discrete ASSPs. The 672-ball FBGA provides a compact, high-I/O-density footprint for space-constrained boards.
When designing with the EP1S10F672C6, ensure proper decoupling on all VCC and VCCIO pins and observe JTAG configuration sequencing guidelines. Designers should also consider migrating to active successor families (Cyclone III, Stratix II/III/IV) for new designs, since Stratix I is now in mature production status and most Stratix I devices have been migrated. The 1.5 V core voltage and 130 nm process node require attention to I/O bank compatibility with modern 1.8 V/2.5 V/3.3 V peripherals. This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP1S10F672C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10F672C6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, DSP Blocks, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F672C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S10B672C6
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP1S10F672C7
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP1S10B672C7
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →EP1S10F672C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1S10F672I6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S10F672C6 최대 정격 & 전기적 특성
| Series | Stratix® I |
| Family | Stratix FPGA |
| Logic Elements (LE) | 10,570 |
| Logic Array Blocks (LABs) | 1057 |
| Total Memory Bits | 920,448 bits |
| Embedded Memory | TriMatrix (MRAM/M4K) |
| DSP Blocks | 6 |
| Number of I/Os | 345 |
| Number of PLLs | 12 (6 per device side) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 패키지 | 672-ball FineLine BGA (FBGA) |
| 동작 온도 | 0C to +85C (Commercial) |
| Maximum Core Frequency | 420.17 MHz |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| 실장 유형 | Surface Mount (BGA) |
EP1S10F672C6 672-ball fineline bga (fbga) 핀 구성 가이드
EP1S10F672C6(672-ball fineline bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10F672C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10F672C6 적합 용도: 6 애플리케이션s: Digital Signal Processing, Telecommunications Infrastructure, ASIC Prototyping, High-Speed Data Acquisition, Embedded Control Platforms, Legacy System Sustainment.
Digital Signal Processing
The EP1S10F672C6 is well suited to mid-density DSP applications such as real-time FIR/IIR filtering, FFT engines, and software-defined radio baseband processing. Its 6 embedded DSP blocks deliver hardware multiplier-accumulator throughput that competes with dedicated DSP processors, while 10,570 LEs and 920 Kbits of TriMatrix memory absorb the surrounding control and buffering logic. The 1.5 V Stratix I architecture supports sustained sample rates into the hundreds of MHz when designs target the device's 420 MHz core limit. Place DSP cores in the dedicated DSP blocks (versus soft logic) to maximize throughput; the 12 PLLs route phase-aligned clocks to these blocks for multi-channel synchronization.
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Telecommunications Infrastructure
In telecom line-card and backhaul designs, the EP1S10F672C6 serves as a multi-protocol bridge, framer, or packet processor in space-constrained 672-FBGA footprints. Its 345 user I/Os support parallel LVTTL/SSTL interfaces to external PHY devices, network processors, and SRAM banks, while 920 Kbits of embedded memory handle protocol headers and queue descriptors without external SRAM. The commercial temperature grade suits indoor equipment racks. Designers typically pair the Stratix I device with external PHY transceivers; use the dedicated PLLs to generate per-port clocks and the JTAG interface for in-system firmware updates via the Altera Quartus toolchain.
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ASIC Prototyping
Engineers commonly use the EP1S10F672C6 as an ASIC prototyping vehicle for designs targeting 5K-15K gate ASICs, because its 10,570 logic elements map most small-to-mid ASICs with timing fidelity better than CPLDs. The 672-ball FBGA provides sufficient I/O density to mirror peripheral ASIC pinouts, while the Quartus synthesis flow supports ASIC-style Verilog/VHDL entry with timing constraints. Designers map ASIC clock domains onto the 12 PLLs to validate metastability, reset distribution, and asynchronous boundary crossings before committing to silicon. The commercial 0C-85C rating is acceptable for lab validation; for full-speed validation across temperature, the EP1S10F672I6 industrial variant is recommended.
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High-Speed Data Acquisition
The EP1S10F672C6 supports high-speed ADC/DAC interface logic, channel multiplexing, and on-chip FIFO buffering for data acquisition systems sampling in the 100-400 MSPS range. Its 345 user I/Os route LVDS/LVTTL data from external ADCs into the FPGA fabric, where 920 Kbits of TriMatrix memory provides buffer space before transferring to external SDRAM via the parallel I/O banks. The 6 DSP blocks enable on-chip decimation filtering, reducing downstream processor load. Place FIFO buffers in M-RAM blocks (large 32 Kbit banks) and use the dedicated PLLs to generate precise ADC sampling clocks with sub-100 ps jitter.
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Embedded Control Platforms
In embedded industrial controllers, the EP1S10F672C6 implements custom glue logic, motor control loops, and HMI drivers on a single FPGA, replacing discrete microcontrollers plus logic ICs. Its 12 PLLs generate the multiple clock domains typical of motor control systems (PWM, encoder sampling, communications), while the 345 I/Os drive incremental encoder inputs, HMI displays, and fieldbus transceivers. The 1.5 V core and 130 nm process yield robust transient immunity for industrial environments. Designers use the soft-core Nios II embedded processor in Quartus to integrate control tasks directly in the FPGA fabric, eliminating external MCUs.
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Legacy System Sustainment
Many defense, aerospace, medical, and industrial OEMs still maintain deployed systems built around the EP1S10F672C6 because the design is in-service and validated. For sustainment programs, the EP1S10F672C6N (lead-free) and EP1S10B672C6 (B-suffix lead-free) are the primary drop-in replacement options. As Intel winds down last-time-buy inventory, OEMs may also consider migration to EP1S10F672C7 or EP1S10F672C7N (speed grade 7) parts that share the 672-FBGA footprint but offer slightly slower timing margins. Verify timing closure before substituting speed-grade variants, and lock supply chain sources early to manage last-time-buy pricing.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S10F672C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F672C6N | EP1S10B672C6 | EP1S10F672C7 | EP1S10B672C7 | EP1S10F672C7N | EP1S10F672I6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded Memory (Kbits) | 920 | 920 | 920 | 920 | 920 | 920 | 920 |
| DSP Blocks | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| User I/Os | 345 | 345 | 345 | 345 | 345 | 345 | 345 |
| Speed Grade | 6 | 6 | 6 | 7 | 7 | 7 | 6 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Industry-proven Stratix I architecture with mature Quartus toolchain (vs EP1S10F672C6N)
- Pin-compatible speed grade variants allow timing-margin trade-offs (vs EP1S10F672C7)
- Industrial-temperature equivalent for harsh-environment drop-in (vs EP1S10F672I6)
설계 노트
The EP1S10F672C6 requires multiple supply rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V per bank), VCCPD (configuration-related supply), and VREF for SSTL/HSTL I/O standards. Per Stratix I Handbook recommendations, place at least one 100 uF bulk + 10 x 0.1 uF ceramic decoupling capacitors distributed around the 672-FBGA perimeter, with one 0.1 uF + 10 uF pair per VCCIO bank. Estimated core current at 420 MHz with full logic utilization can exceed 1 A; size the VCCINT regulator with 30% headroom.
The 672-ball FineLine BGA requires a multilayer PCB with microvia stack-ups for breakout routing. Use a 1.0 mm pitch BGA land pattern matching the Altera reference footprint. Power and ground planes should occupy entire PCB layers with no signal traces crossing them. Place configuration devices (EPCS or compatible serial flash) within 6 inches of MSEL[2:0] and DATA0/DATA1/DCLK/nCONFIG/nSTATUS pins. Differential clock pairs (CLK0/CLK1) require 100 ohm differential routing with length matching to within 50 mil.
Common pitfalls when using the EP1S10F672C6: (1) misconfiguring MSEL[2:0] pins for the wrong configuration scheme - they select AS, PS, FPP, or JTAG-only modes; (2) leaving VCCPD unpowered during configuration, which prevents the device from entering user mode; (3) using unsupported I/O standards in a given bank - check bank-VCCIO compatibility before assigning pins; (4) ignoring the configuration CRC check at startup - configure the device to enable CRC error detection so corrupted bitstreams are detected reliably.
Estimated: at 100% logic utilization and 420 MHz clock, the EP1S10F672C6 dissipates approximately 1.5-2 W. The 672-FBGA package's exposed-pad underside provides primary thermal relief via thermal vias to inner PCB ground planes. For sustained high-utilization operation in enclosed chassis, route at least 4 thermal vias per thermal pad ball, and consider an attached heatsink for >85C ambient environments. Industrial-grade EP1S10F672I6 variant is recommended for -40C to +100C ambient operation.
규정 준수 정보
RoHS status of EP1S10F672C6 was not specified in the verified web data; lead-free variants (C6N, B672C6) are explicitly lead-free. AEC-Q100 not applicable for FPGAs. For automotive applications, verify compliance with manufacturer documentation.