EP1S10F780C6 - Stratix 10570-Cell FPGA, 780-BGA | Altera
부품 번호: EP1S10F780C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $130 | $65,000.00 |
| 1,000 | $118 | $118,000.00 |
EP1S10F780C6 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital circuits - from glue logic to full processor subsystems - in silicon via an SRAM-based configuration bitstream. FPGAs sit within the broader hierarchy of programmable logic devices (PLD), and the Stratix family was Altera's high-end, DSP-rich flagship line before being succeeded by Stratix II/III/IV/V. The 'EP1S' prefix denotes the first-generation Stratix family, with '10' indicating approximately 10K logic elements, 'F' marking the flip-chip BGA package, '780' giving the ball count, 'C' the commercial temperature range, and '6' the speed grade.
Key features include 1,057 LABs/CLBs, 10570 logic elements/cells, 920448 bits of embedded RAM (TriMatrix memory), support for up to 17 DSP blocks for high-speed fixed- and floating-point math, and 426 user I/O pins that interface to external LVDS, LVTTL, LVPECL, SSTL, and HSTL standards via dedicated True-LVDS circuitry. The device includes dedicated high-speed serial I/O capability, embedded multipliers, and a PLL/DLL rich clock tree for jitter-clean distribution.
The Stratix architecture uses a 1.5 V core with separate VCCIO banks for I/O flexibility, logic and routing fabric built on a 130 nm process, and on-chip configuration memory that must be loaded at every power-up from an external flash or via JTAG. The 'C6' commercial speed grade balances logic performance and dynamic power, making the part a common fit for cost-sensitive high-volume prototypes that need Stratix-class DSP and memory bandwidth.
Typical applications for the EP1S10F780C6 include telecom baseband and channel-card signal processing, high-speed serial protocol bridging (custom SERDES glue), military/aerospace video and DSP processing subsystems, and industrial prototyping of ASIC-replacement designs. It is also widely used in test-and-measurement custom backplanes, image processing pipelines, and educational platforms teaching RTL design on real silicon.
When designing with this part, ensure the 1.5 V core rail and VCCIO banks are properly decoupled (typically 0.1 uF + bulk per bank), use Altera Quartus II (legacy) or Quartus Prime for synthesis and place-and-route, and follow the Stratix pin connection guidelines for unused I/O and JTAG pins. Note that Stratix I is a mature/NRND family - verify long-term availability before committing to new designs.
This page synthesizes distributor inventory, mature Stratix family cross-reference data, and design guidance that is not consolidated in any single vendor PDF.
드롭인 대체품: EP1S10F780C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10F780C6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, User I/O Count.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F780C7
✅ 드롭인✓ 재고 있음
$128.4 / 개
데이터시트 보기 →EP1S10F780C5
✅ 드롭인✓ 재고 있음
$460 / 개
데이터시트 보기 →EP1S10F780C5N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S10F780C7N
✅ 드롭인✓ 재고 있음
$96.2 / 개
데이터시트 보기 →EP1S10F780C8
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S10F780C6 최대 정격 & 전기적 특성
| Series | Stratix (EP1S) |
| Family | Stratix I |
| Logic Elements / Cells | 10,570 |
| LABs / CLBs | 1,057 |
| Total RAM Bits | 920,448 |
| Number of I/O | 426 |
| Package Type | 780-BBGA (FC-FBGA, 29x29 mm, 1.0 mm pitch) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 동작 온도 | 0C to +85C (commercial 'C') |
| Speed Grade | C6 |
| Max User I/O | 426 |
| 실장 유형 | Surface Mount (SMT/SMD) |
| Logic Family / Base Technology | CMOS, SRAM-based configuration |
| Configuration Mode | JTAG / passive serial / external flash |
EP1S10F780C6 780-bbga (fc-fbga, 29x29 mm, 1.0 mm pitch) 핀 구성 가이드
EP1S10F780C6(780-bbga (fc-fbga, 29x29 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10F780C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10F780C6 적합 용도: 7 애플리케이션s: Telecom Baseband Signal Processing, Custom Serial Protocol Bridging / Glue Logic, Industrial Test and Measurement Backplanes, Video and Image Processing Pipelines, Aerospace and Defense Prototyping, ASIC Replacement / Education Platforms, High-Speed Custom DSP and FIR Filter Banks.
Telecom Baseband Signal Processing
The EP1S10F780C6 fits telecom baseband and channel-card DSP applications because its 10,570 logic elements and embedded DSP blocks deliver the parallel multiply-accumulate throughput needed for baseband modulation, channel filtering, and FEC decoding. The 920,448 bits of TriMatrix RAM absorb packet buffers and symbol-rate look-up tables without external memory contention, while 426 user I/O pins route wide parallel data buses to DSP co-processors and backplane connectors. The 130 nm 1.5 V core gives predictable timing closure at telecom clock rates, and Quartus II DSP Builder blocks accelerate FFT/FIR IP development. Trade-off: the Stratix I process node draws more power per MAC than later Stratix II/III families, so thermal design must account for ~5-10 W under sustained DSP load.
추천
Custom Serial Protocol Bridging / Glue Logic
Use the EP1S10F780C6 as a flexible protocol-bridging engine between proprietary or mixed-standard interfaces such as LVDS, LVPECL, HSTL, and SSTL. The 426 user I/O pins, organized across multiple VCCIO banks, allow the part to interface simultaneously to legacy 3.3 V peripheral logic and modern 1.8 V PHYs without external level shifters. TriMatrix RAM provides FIFO buffers for clock-domain crossing, and 1,057 LABs accommodate custom state machines for protocol conversion. Its SRAM-based configuration also enables field-updatable firmware via JTAG, simplifying production and field service. Compared with newer Stratix devices, this part remains cost-effective when a moderate logic density suffices and a 130 nm 1.5 V core is acceptable.
추천
Industrial Test and Measurement Backplanes
The EP1S10F780C6 is well suited to custom test and measurement backplanes that aggregate multiple sensor channels, apply real-time DSP, and forward processed data to a host controller. With 426 user I/O pins it can capture dozens of analog-front-end channels simultaneously, while embedded multipliers perform per-channel calibration and FIR filtering. The commercial 0C to +85C temperature range covers most factory-floor environments, and the 780-FBGA package provides robust thermal performance when paired with a PCB thermal-via array. Designers value the mature Quartus II tool flow for repeatable timing closure across design revisions. For higher channel counts, the EP1S20 or EP1S25 Stratix variants share the same tool flow and many IP cores.
추천
Video and Image Processing Pipelines
Deploy the EP1S10F780C6 in real-time video and image processing pipelines where its 10,570 LEs and TriMatrix memory deliver enough bandwidth for line buffers, 2D convolution kernels, and motion estimation. The 426 I/O pins can ingest parallel camera-interface data (e.g., LVDS-based Channel Link) and drive DVI/HDMI bridges or display controllers without external bus-switching glue. Embedded multipliers accelerate DCT/IDCT and color-space conversion, while 1.5 V core operation keeps dynamic power manageable for 60 fps operation. Note that for 4K or HDR pipelines you should migrate to Stratix IV/V devices, which integrate transceivers and more DSP blocks; the EP1S10 is best for 1080p and below designs.
추천
Aerospace and Defense Prototyping
The EP1S10F780C6 has historically been specified into aerospace and defense prototyping applications where Altera's mature IP ecosystem and long-standing qualification records give program managers confidence in supply continuity. The part supports MIL-STD-1553, ARINC 429, and other legacy avionic bus standards via third-party IP, and the 1.5 V core with multiple VCCIO banks interfaces to 5 V and 3.3 V avionics without external level translation. Commercial temperature grade is acceptable for cabin/ground systems; for flight-critical applications use the industrial 'I' grade variants (EP1S10F780I6/7) when available. The mature 130 nm silicon and Stratix I process node have an extensive reliability and SEU-mitigation track record in defense literature.
추천
ASIC Replacement / Education Platforms
Use the EP1S10F780C6 as an ASIC replacement in low-volume production runs where NRE costs of a custom ASIC cannot be justified. With 10,570 LEs, 920 Kbits of block RAM, and 426 I/O pins, it has enough logic density to absorb most mid-complexity ASIC designs while staying in stock at major distributors. It is also widely adopted in university courses teaching VLSI/FPGA design because of the well-documented Stratix I architecture, abundant textbook examples, and freely available Quartus II Web Edition. The 780-FBGA package requires a multi-layer PCB with controlled-impedance routing and a thermal-via array, so budget accordingly when using this part in coursework or hobby projects.
추천
High-Speed Custom DSP and FIR Filter Banks
The EP1S10F780C6 is a strong fit for custom DSP applications that require parallel multiply-accumulate operations, such as radar pulse compression, software-defined-radio channelizers, and adaptive FIR filter banks. Its embedded DSP blocks and on-chip multipliers allow per-cycle MAC operations, while the 920 Kbit TriMatrix memory provides coefficient storage and data buffer windows without external memory contention. The 1,057 LABs and abundant routing deliver tight timing closure at telecom sample rates. Compared with newer Stratix families, this part lacks hard transceivers, so designs needing multi-gigabit SERDES should migrate to Stratix II GX or later. For pure DSP workloads at moderate clock rates, EP1S10F780C6 remains a cost-effective choice.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S10F780C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F780C7 | EP1S10F780C5 | EP1S10F780C5N | EP1S10F780C7N | EP1S10F780C8 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix I (EP1S) | Stratix I | Stratix I | Stratix I | Stratix I | Stratix I |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| User I/O Pins | 426 | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | C6 (mid) | C7 (faster) | C5 (slower) | C5 (slower) + lead-free | C7 (faster) + lead-free | C8 (fastest) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C, lead-free | Commercial 0C to +85C, lead-free | Commercial 0C to +85C |
주요 차별점
- Most widely stocked mid-grade speed option in the EP1S10F780 family (vs EP1S10F780C5 / EP1S10F780C7)
- Mid-density 10K LE class within the Stratix I family (vs EP1S25F672 / EP1S20F672)
- Commercial temperature grade offers wider distributor stock than industrial (vs EP1S10F780I6 / EP1S10F780I7 (industrial))
설계 노트
Estimated: The EP1S10F780C6 draws 1.5 V core current in the range of 1-3 A depending on logic utilization and toggle rate, plus VCCIO current per bank. Provide a low-impedance 1.5 V plane with at least 4-6 bulk 220 uF polymer capacitors and per-pin 0.1 uF + 1 nF decoupling. VCCIO banks must be grouped by voltage (1.5 V/1.8 V/2.5 V/3.3 V) and each bank requires its own decoupling network; mixing VCCIO voltages on adjacent banks without proper isolation causes logic errors. Refer to the Stratix Device Handbook Section I power-supply guidelines for recommended ferrite-bead separation between analog PLL supplies and digital rails.
Estimated: At full DSP utilization the part can dissipate 5-10 W; combined with the 29x29 mm FC-FBGA package, this demands a thermal-via array under the package die region (typical Stratix recommendation: 9x9 or 11x11 via grid, 0.3 mm drill, 0.5 mm pitch). Without thermal vias, junction temperature can exceed 100C under load, causing timing degradation or thermal shutdown. Always run Quartus PowerPlay early in the design to estimate worst-case power and verify thermal envelope at the system level.
The 1.0 mm pitch BGA requires a high-density PCB stack-up: minimum 6 layers with microvia-in-pad or 1.0 mm laser-drilled vias. Route all I/O signals on the breakout layer using escape routing (via-in-pad or dog-bone fan-out). Use length-matched differential pairs for LVDS and HSTL class I/II signals, and add 100 ohm differential termination at the receiver end. Place configuration flash (EPCS1/EPCS4) within 50 mm of the FPGA to keep JTAG/AS configuration traces short. Refer to the Stratix Hardware Reference for I/O bank restrictions before final pin assignment.
Common mistakes on this part include: (1) tying unused I/O pins incorrectly - all unused I/O must be set to 'inputs tri-stated with weak pull-up' via Quartus pin assignments to avoid floating-input leakage; (2) using 5 V signals on a bank configured for 3.3 V VCCIO - this destroys the I/O; (3) failing to provide a clean CONFIG_DONE pull-up and proper nCONFIG/nSTATUS sequencing, which can prevent boot; (4) treating 'C5' and 'C6' speed grades as interchangeable in timing-closure - timing must be re-run if grade changes. Confirm with Quartus II timing analyzer output before tape-out.
Place the configuration flash and configuration mode jumpers (MSEL pins) within 50 mm of the FPGA. Use a 4-layer minimum PCB with continuous reference (ground) planes under all BGA fan-out traces to control impedance. JTAG chain pinout (TCK/TMS/TDO/TDI) must be brought to a standard 0.1 inch header or USB-Blaster pinout connector for programming access. Avoid routing clock signals across split planes or over the FBGA break-out region - both degrade jitter performance on the dedicated PLL inputs.
규정 준수 정보
Stratix I devices were launched before RoHS was widely adopted. The 'N' suffix variants (e.g., EP1S10F780C5N) typically indicate lead-free reflow-compatible packaging. Verify compliance directly with Altera/Intel or your distributor's product declaration.
