EP1S25F780C6 - Stratix FPGA 25K LE, 597 I/O, 780-FBGA | Altera
MPN: EP1S25F780C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1216.96 | $1,216.96 |
| 10 | $1095.27 | $10,952.70 |
| 100 | $973.57 | $97,357.00 |
| 500 | $876.21 | $438,105.00 |
| 1,000 | $791.02 | $791,020.00 |
Drop-in alternatives for EP1S25F780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F780I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1250 / Unit
View Datasheet →EP1S25F780C5N
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$595 / Unit
View Datasheet →EP1S25F780C5
✅ Drop-In✓ In Stock
$1249.5 / Unit
View Datasheet →EP1S20F780C6
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Contact for price
View Datasheet →EP1S20F780C6N
✅ Drop-In✓ In Stock
$188.75 / Unit
View Datasheet →EP1S25F780C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| Number of LABs/CLBs | 2566 |
| Number of I/O | 597 |
| Supply Voltage - Core | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Internal Frequency | 450.05 MHz |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 780-BBGA (FCBGA), 29 x 29 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Speed Grade | C6 |
| Logic Family | CMOS |
| Number of Pins | 780 |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG |
EP1S25F780C6 780-bbga (fcbga), 29 x 29 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S25F780C6 (780-bbga (fcbga), 29 x 29 mm, 1 mm pitch package) with 780 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F780C6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 780 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F780C6 is suitable for 6 applications: Telecom Line-Card Interface Logic, Military and Aerospace Signal Processing, Custom DSP Pipeline and Channelizer, Bus Bridge and Glue Logic Aggregator, Prototype ASIC Verification Platform, Legacy Industrial Controller Sustaining.
Telecom Line-Card Interface Logic
The EP1S25F780C6 fits telecom line-card designs because its 597 user I/O and 25,660 logic elements can terminate multiple TDM buses, implement UTOPIA/SPI-3 backplane interfaces, and run glue logic between network processors and framer ICs in parallel. The dedicated PLL and clock-network hardware supports clean 77.76 MHz STS-12/STM-4 clock distribution with low jitter, and the 1,944,576 bits of TriMatrix RAM provide per-channel FIFO buffering without external SRAM. Compared to a discrete CPLD bank, this part consolidates interface logic into a single reprogrammable device, simplifying board layout while keeping the firmware path identical across line-card SKUs.
Recommended
Military and Aerospace Signal Processing
The EP1S25F780C6 is widely deployed in legacy defense signal-processing subsystems because the 80 DSP blocks deliver 18x18-bit MAC throughput for FIR filters, FFT butterflies, and beamforming weights at sample rates up to ~250 MHz, and the Commercial 0-85C temperature range covers most ground-station and shipboard chassis. The 780-FBGA package exposes 597 I/O for parallel ADC/DAC interfaces (e.g., LVDS to dual-channel 14-bit 125 MSPS converters), while the 1.5 V core keeps dynamic power manageable for air-cooled enclosures. For systems already proven with Stratix firmware, sustaining the EP1S25F780C6 over redesigning to newer Cyclone V preserves the IP investment.
Recommended
Custom DSP Pipeline and Channelizer
Engineers using the EP1S25F780C6 for custom DSP pipelines benefit from the dedicated hardware multipliers (80 DSP blocks, 18x18) and TriMatrix memory blocks (M512, M4K, MRAM) which enable fully pipelined multiply-accumulate structures with no LUT overhead. Each DSP block supports up to 450 MHz throughput, allowing real-time baseband processing for software-defined radio channelizers, radar pulse compressors, and modem signal chains. The 1,944,576 embedded RAM bits are sufficient for 256-tap FIR filter banks or 16K-point FFT working memory, eliminating external SRAM in compact baseband designs.
Recommended
Bus Bridge and Glue Logic Aggregator
The EP1S25F780C6 serves as a multi-bus bridge aggregating legacy interfaces such as ISA, VME, PCI, or proprietary backplanes into a single coherent interface to a modern processor or SoM. The 597 user I/O can simultaneously connect to a 32-bit local bus, a 16-bit GPIO bank, and a parallel external memory port, while the embedded TriMatrix memory holds bridge FIFOs without external buffering. The flexible per-bank VCCIO (1.5/1.8/2.5/3.3 V) allows direct connection to 5 V-TTL peripherals via external 3.3 V translation, eliminating level-shifters on legacy boards. This pattern is common in long-life industrial controllers where the FPGA becomes the single revision point.
Recommended
Prototype ASIC Verification Platform
The EP1S25F780C6 is well-suited as an ASIC verification vehicle because its 25,660 logic elements can hold a representative slice of a target ASIC's logic, with 1,944,576 embedded RAM bits mapping to embedded SRAM macros and 80 DSP blocks mirroring candidate MAC units. The 597 user I/O fan out to break-out headers exercising the full pad ring of the ASIC under test, while JTAG-driven configuration allows rapid bitstream iteration between verification campaigns. Using Quartus II for synthesis lets verification engineers reuse RTL written for ASIC sign-off with minimal modification, accelerating bring-up of large SoC designs before tape-out.
Recommended
Legacy Industrial Controller Sustaining
Long-life industrial automation and process-control products originally designed around the EP1S25F780C6 continue to specify this part because the firmware is already validated to regulatory standards and the PCB layout is qualified. The Commercial 0-85C range covers factory-floor enclosure temperatures, and the 780-FBGA package provides the I/O density needed for multi-axis motion-control or PLC-style discrete I/O aggregation. Sustaining the existing Stratix silicon avoids costly re-certification of new FPGA firmware under IEC 61508 or UL 508 standards, making this obsolete part strategically important for 10-15 year product lifecycles.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F780C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F780I6N | EP1S25F780C5N | EP1S25F780C5 | EP1S20F780C6 |
|---|---|---|---|---|---|
| Package | 780-BBGA (FCBGA) | 780-BBGA (FCBGA) - same | 780-BBGA (FCBGA) - same | 780-BBGA (FCBGA) - same | 780-BBGA (FCBGA) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 18,460 (-28%) |
| Number of I/O | 597 | 597 (same die) | 597 (same die) | 597 (same die) | 586 (-2%) |
| Temperature Grade | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Speed Grade | C6 | I6 (slower) | C5 (faster) | C5 (faster) | C6 (same) |
| Lead-Free / RoHS | Lead-bearing (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | Lead-bearing | Lead-bearing |
| Supply Voltage - Core | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits (same die) | 1,944,576 bits (same die) | 1,944,576 bits (same die) | 1,669,248 bits (-14%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density Stratix with 780-FBGA maximum I/O count (vs EP1S20F780C6)
- Lead-free RoHS drop-in option available without redesign (vs EP1S25F780I6N)
- Same-die speed grade flexibility (C5/C6/I6) without footprint change (vs EP1S25F780C5N)
Design Notes
Estimated: at 100% toggle rate on a typical Stratix design with 50% I/O utilization, the 1.5 V core draws ~1.2 A (~1.8 W) plus ~0.5 A per VCCIO bank configured to 3.3 V. Total power budget for a 4-bank design is typically 4-6 W. Use a low-ESR ceramic decoupling network of 4.7 uF + 0.1 uF per VCC pin pair, with bulk 100 uF tantalum on each supply rail. The 1.5 V VCCINT rail requires sequencing - bring VCCINT up before VCCIO and VCCPD per the Stratix handbook power-on reset (POR) specification.
The 780-FBGA uses 1.0 mm ball pitch in a 29 x 29 mm body. PCB design requires 4 mil (0.1 mm) trace-and-space with 0.5 mm microvia stack-ups; a 6-layer stackup (signal-GND-power-signal-power-signal) is recommended for impedance-controlled LVDS pairs. All VCC and GND balls must be connected directly to planes - any non-connected VCC ball will cause logic failure or POR issues. Use antipad-in-pad or via-in-pad to fan out the inner rows to inner layers for power distribution and signal escape.
Do not assume the EP1S25F780C6 is RoHS compliant - the non-N suffix part uses lead-bearing balls. For new designs or products requiring RoHS, choose EP1S25F780C6N explicitly. Configuration mode pins MSEL[2:0] must match the intended configuration scheme at every power-up; incorrect MSEL settings cause configuration failure with no error indication on nSTATUS. The nCONFIG pin must see a clean rising edge with monotonicity < 10 ns - noisy power-up causes false configuration retries.
Compliance Information
EP1S25F780C6 is the lead-bearing variant; the N-suffix variant EP1S25F780C6N is RoHS compliant. FPGAs are not AEC-Q100 qualified in this family; industrial temperature grade does not imply automotive qualification.
