EP1SGX25DF1020C5 - 25K LE Stratix GX FPGA, 1020-FBGA | Intel
부품 번호: EP1SGX25DF1020C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2244.28 | $2,244.28 |
| 10 | $2150 | $21,500.00 |
| 100 | $1990 | $199,000.00 |
| 500 | $1850 | $925,000.00 |
| 1,000 | $1720 | $1,720,000.00 |
EP1SGX25DF1020C5 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together via a programmable interconnect. The Stratix GX family belongs to the higher-level category hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. It augments a general-purpose fabric with embedded high-speed transceivers, embedding SERDES functionality that historically required a companion physical-layer (PHY) chip.
Key features of the EP1SGX25DF1020C5 include 25,660 logic elements, 607 user I/O pins, dedicated hardware multipliers for DSP, on-chip TriMatrix memory, and support for multiple I/O standards including LVDS, LVPECL, HSTL, SSTL, and PCI. The transceiver channels support source-synchronous clocking and clock data recovery (CDR), while embedded PCS logic implements 8B/10B encoding/decoding, word alignment, and rate matching.
The architectural choice of embedded transceivers reduces bill-of-materials cost, simplifies PCB layout, and shrinks board area for systems that would otherwise need a separate PHY plus complex impedance-controlled routing. The 1020-FBGA package provides ample signal escape and supports the bandwidth density required by multi-channel serial links.
Typical applications include multi-gigabit serial backplane aggregation, telecom line cards, video broadcast infrastructure, high-end test and measurement equipment, and ASIC prototyping for serial-protocol IP. When designing with this device, ensure the transceiver reference clocks meet the jitter specifications listed in the Stratix GX datasheet and that PCB stackup and impedance control meet the Stratix GX device family guidelines for the chosen data rate.
드롭인 대체품: EP1SGX25DF1020C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, DSP Blocks, Package Type, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C6
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →EP1SGX25DF1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX25DF1020C4
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP1SGX25FF1020C6N
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP1SGX25DF1020C5 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Family | Stratix GX |
| Logic Elements | 25,660 |
| User I/O Count | 607 |
| Number of Transceivers | 20 |
| Transceiver Data Rate | up to 3.125 Gbps per channel |
| Supply Voltage (Core) | 1.5 V |
| Logic Family | CMOS |
| Package Type | 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch |
| 동작 온도 | 0 C to 85 C (Commercial) |
| 실장 유형 | Surface Mount |
| Lead Free | Yes |
| RoHS 상태 | Compliant |
| Speed Grade | C5 |
| Device Family | Stratix GX (Altera/Intel) |
EP1SGX25DF1020C5 1020-bbga (fc-fbga), 33 x 33 mm, 1 mm pitch 핀 구성 가이드
EP1SGX25DF1020C5(1020-bbga (fc-fbga), 33 x 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020C5 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Backplane Aggregation, Telecom Line Cards, Video Broadcast Infrastructure, High-End Test and Measurement Equipment, ASIC Prototyping for Serial-Protocol IP, Embedded Multi-Protocol Industrial Systems.
Multi-Gigabit Serial Backplane Aggregation
The EP1SGX25DF1020C5's 20 embedded transceiver channels at up to 3.125 Gbps each provide the high-speed serial I/O needed for backplane aggregation in telecom and datacom systems. Aggregating multiple lower-rate links into a higher-rate fabric (XAUI, SerialLite, custom protocol) avoids the cost and complexity of discrete PHY chips. With 25,660 logic elements and 607 user I/O, the device can implement aggregation logic, link-layer processing, and traffic shaping alongside the SERDES, all in a single chip.
추천
Telecom Line Cards
Telecom line cards require multi-protocol serial interfaces to connect to backplanes, fabric switches, and framer/serializer devices. The EP1SGX25DF1020C5's embedded PCS logic with 8B/10B encoding/decoding, word alignment, and rate matching is well suited for SPI-4.2, SFI-4.1, and custom telecom protocols. Combined with 607 user I/O, the device can drive parallel control buses, framer ports, and clock distribution while handling serial-protocol processing in the fabric.
추천
Video Broadcast Infrastructure
Video broadcast equipment such as routers, frame synchronizers, and format converters requires high-bandwidth serial links like HD-SDI (SMPTE 292M) and 3G-SDI (SMPTE 424M). The EP1SGX25DF1020C5's transceivers natively support the bit rates required for SDI rates up to 3 Gbps, enabling direct serial interconnect without external cable drivers. The 25,660 logic elements provide ample capacity for video processing, format conversion, and ancillary data handling within a single FPGA.
추천
High-End Test and Measurement Equipment
Test and measurement instruments - bit-error-rate testers, protocol analyzers, signal generators - need flexible high-speed serial I/O to stimulate and capture signals under test. The EP1SGX25DF1020C5's 20 transceiver channels allow simultaneous multi-link stimulus and capture at up to 3.125 Gbps. Its 607 user I/O enable integration of parallel stimulus pins, status LEDs, and control interfaces, reducing the need for additional glue logic on the test instrument mainboard.
추천
ASIC Prototyping for Serial-Protocol IP
Engineers prototyping ASICs that include multi-gigabit serial interfaces need an FPGA with sufficient transceiver count to validate the design before tape-out. The EP1SGX25DF1020C5's 20 SERDES channels allow mapping of common 4-, 8-, 12-, and 16-lane serial protocols directly. The 25,660 logic elements provide reasonable capacity for partitioning ASIC logic across one or multiple FPGAs, and Quartus II supports common ASIC prototyping flows.
추천
Embedded Multi-Protocol Industrial Systems
Industrial systems such as machine vision cameras, factory automation controllers, and high-speed data acquisition modules increasingly embed multiple serial protocols (Gigabit Ethernet, PCIe, Camera Link, CoaXPress). The EP1SGX25DF1020C5 with its mix of high-speed transceivers and 607 user I/O can implement protocol bridging, image processing, and control logic in one device. Industrial users should evaluate the Stratix GX industrial (I-grade) variants for extended temperature range.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C5N | EP1SGX25DF1020C6 | EP1SGX25DF1020C6N | EP1SGX25DF1020C4 | EP1SGX25FF1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Transceiver Channels | 20 | 20 | 20 | 20 | 20 | 20 |
| User I/O Count | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | C5 | C5 | C6 (faster) | C6 (faster) | C4 (slower) | C6 FF |
| Lead-Free Finish | Standard (non-N) | Yes (Pb-free) | Standard | Yes (Pb-free) | Standard | Yes (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Lead-free (Pb-free) finish for RoHS-compliant designs (vs EP1SGX25DF1020C5)
- Higher speed grade for tighter timing margins (vs EP1SGX25DF1020C5)
- FF speed grade option for maximum performance (vs EP1SGX25DF1020C5)
설계 노트
The 1020-FBGA package requires a 33 x 33 mm PCB land pattern with 1 mm ball pitch. Verified web data specifies the Stratix GX device family datasheet guidelines for PCB stackup, which require controlled-impedance routing for all 20 transceiver channels. Use a minimum 8-layer stackup with dedicated ground planes under the BGA field and length-matched differential pairs for SERDES lanes to meet 3.125 Gbps signal-integrity targets.
The Stratix GX core runs at 1.5 V with separate analog supply rails for transceiver PLLs and I/O banks. Decouple each supply pin with low-ESR ceramic capacitors placed as close to the BGA balls as possible (typically 0.1 uF + 10 uF per rail). Total device power at full transceiver utilization can exceed 15 W, so thermal dissipation via copper pours and/or a heatspreader is required.
The 20 high-speed transceivers each require a low-jitter reference clock meeting the jitter specifications listed in the Stratix GX datasheet. Place the reference clock generator close to the FPGA, use a dedicated clean ground island, and isolate clock traces from switching signals. Loss budget for the 3.125 Gbps channels should target less than 12 dB total channel loss including the package breakout.
The EP1SGX25DF1020C5 is obsolete, so do not specify it for new production designs. When maintaining legacy systems, verify each lot's date code and quarantine suspect parts since counterfeit Stratix GX FPGAs have been observed in the secondary market. Always program and verify the configuration bitstream via JTAG before deployment.
규정 준수 정보
Standard EP1SGX25DF1020C5 (non-N suffix) is not lead-free; the EP1SGX25DF1020C5N variant is the RoHS-compliant replacement per cross-reference data. AEC-Q100 not applicable for FPGA logic devices.
