EP1SGX25FF1020C6 - Stratix GX FPGA 25,660 LE 607 I/O FBGA-1020 | Intel
부품 번호: EP1SGX25FF1020C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $175 | $1,750.00 |
| 100 | $162 | $16,200.00 |
| 500 | $148.5 | $74,250.00 |
| 1,000 | $135 | $135,000.00 |
EP1SGX25FF1020C6 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks, programmable interconnect, and dedicated I/O. Stratix GX is Intel's high-performance FPGA family with embedded multi-gigabit transceivers (MGTs) and DSP blocks optimized for serial connectivity, signal processing, and high-throughput parallel processing. Stratix GX sits within the broader hierarchy: programmable logic -> FPGA -> high-performance transceiver-enabled FPGA -> Stratix GX family. The combination of embedded transceivers, DSP blocks, and abundant logic makes Stratix GX suitable for communication infrastructure, broadcast video, and defense systems.
Key differentiating features of the EP1SGX25FF1020C6 include 24 embedded transceivers supporting data rates up to 3.125 Gbps (typical for the Stratix GX family), dedicated hardware multipliers, embedded memory blocks totaling up to 1.94 Mbit (TriMatrix architecture), and a flexible PLL clock network. The 'FF1020' package option provides 607 general-purpose user I/Os with LVDS, LVTTL, SSTL, and HSTL I/O standards. The 'C6' speed grade places it in the moderate-performance commercial tier, balanced between logic throughput and power consumption.
The device's architecture leverages the same silicon die as other Stratix GX 25K density members, with package, speed grade, and temperature grade defining the marketing part number. Internal clock networks, on-chip termination, and high-speed serial interfaces allow designers to implement multi-gigabit serial protocols, parallel DSP pipelines, and custom accelerators on a single device without external PHY chips. This integration reduces BOM cost and board complexity for high-end applications.
Typical applications for the EP1SGX25FF1020C6 include 10G Ethernet switching and aggregation, SONET/SDH and OTN line card processing, high-definition broadcast video routers and format converters, base-station signal processing for wireless infrastructure, defense and aerospace signal processing, ASIC prototyping, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Fibre Channel).
When designing with this device, ensure PCB layout meets the 1 mm ball pitch FBGA escape constraints, including microvia stack-ups and controlled-impedance routing for the transceiver channels. Power decoupling must satisfy Intel's Stratix GX power distribution network guidance (separate analog, PLL, and I/O supply rails).
드롭인 대체품: EP1SGX25FF1020C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25FF1020C6 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Package, Package Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25FF1020C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$160 / 개
데이터시트 보기 →EP1SGX25FF1020C7
✅ 드롭인✓ 재고 있음
$1280 / 개
데이터시트 보기 →EP1SGX25FF1020C5
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25FF1020C5N
✅ 드롭인✓ 재고 있음
$1580 / 개
데이터시트 보기 →EP1SGX25FF1020C4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX25FF1020
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$295 / 개
데이터시트 보기 →EP1SGX25FF1020C6 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Series | Stratix GX |
| Logic Family | CMOS |
| Logic Elements / Cells | 25,660 |
| Number of LABs | 2,566 |
| Total Memory Bits | 1,944,576 (1.94 Mbit, TriMatrix) |
| User I/O Count | 607 |
| 핀 수 | 1020 |
| Package Type | FBGA-1020 (FC-FBGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 1.5 V |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| Speed Grade | C6 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Non-Compliant (legacy Altera era) |
| Lead Free | Yes |
EP1SGX25FF1020C6 핀 구성
| 핀 Multiple | User I/O Banks — 607 user I/O balls distributed across 8-12 I/O banks supporting LVDS, LVTTL, SSTL, HSTL I/O standards |
| 핀 Multiple | Transceiver Channels — 24 embedded multi-gigabit transceiver (MGT) channel pairs, up to 3.125 Gbps |
| 핀 Multiple | VCCINT — Core supply voltage (1.5 V) |
| 핀 Multiple | VCCIO — I/O supply voltage (per bank, e.g. 1.5 V, 1.8 V, 2.5 V, 3.3 V) |
| 핀 Multiple | VCCA_PLL — Analog PLL supply (typically 2.5 V) |
| 핀 Multiple | GND — Ground reference balls distributed across the BGA array |
| 핀 Multiple | TCK/TMS/TDI/TDO — JTAG boundary-scan interface per IEEE 1149.1 |
| 핀 Multiple | MSEL[2:0] — Configuration mode selection (AS, PS, JTAG) |
| 핀 Multiple | nCONFIG/nSTATUS/CONF_DONE — Configuration control pins |
| 핀 Multiple | CLK[0..n] — Dedicated clock input pins for global/regional clock networks |
일반적인 애플리케이션
EP1SGX25FF1020C6 적합 용도: 7 애플리케이션s: 10G Ethernet Switching and Aggregation, SONET/SDH and OTN Line Card Processing, High-Definition Broadcast Video Routers and Format Converters, Wireless Base Station Signal Processing, Defense and Aerospace Signal Processing, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging.
10G Ethernet Switching and Aggregation
The EP1SGX25FF1020C6 is well matched to 10G Ethernet line-card processing thanks to its embedded multi-gigabit transceivers and 25,660 logic elements. According to the Stratix GX datasheet, the device supports transceivers up to 3.125 Gbps native, enabling XAUI (4 x 3.125 Gbps) lanes for 10 GbE aggregation across backplanes. The 607 user I/Os provide abundant parallel fabric for MAC-layer bridging, while 1.94 Mbit of TriMatrix memory buffers packet descriptors. A typical deployment places the device between PHY and switch ASIC, implementing cut-through forwarding, traffic shaping, and queue management. Designers benefit from integrated transceivers that eliminate external PHY BOM cost, though careful attention to 1 mm BGA escape routing and separate analog/PLL supply rails is required for signal-integrity compliance.
추천
SONET/SDH and OTN Line Card Processing
Telecommunications infrastructure historically uses Stratix GX FPGAs for SONET/SDH and OTN framer/pointer-processor implementations. The EP1SGX25FF1020C6's embedded transceivers handle OC-192/STM-64 (9.953 Gbps) only via external muxing, but excel at multi-channel OC-48/STM-16 (2.488 Gbps) aggregation. According to the Stratix GX datasheet, the device's 2,566 LABs support complex pointer justification state machines and overhead processing, while the DSP blocks implement scrambling and FEC. The 33 x 33 mm FBGA-1020 footprint integrates a complete multi-port line card on a single device, reducing board area versus discrete ASIC + PHY solutions. Design consideration: for new OTN designs, migrate to Stratix V or Arria 10 families for native 10G+ transceiver support.
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High-Definition Broadcast Video Routers and Format Converters
Broadcast video infrastructure uses the EP1SGX25FF1020C6 for SDI (Serial Digital Interface) routing, de-embedding, and format conversion. According to the Stratix GX datasheet, the embedded transceivers support HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) directly, while the 607 user I/Os interface to large video crosspoint matrices. The 25,660 logic elements implement ANC packet processing, audio de-embedding (AES/EBU), and color-space conversion (Rec.709, Rec.2020). The 1.94 Mbit of TriMatrix memory provides line buffers for scaling and frame-rate conversion. The FBGA-1020 package integrates an entire 16x16 3G-SDI router on one device, eliminating multiple smaller FPGAs. Power: ~15-25 W typical, requiring thermal management in 1U rack frames.
추천
Wireless Base Station Signal Processing
Wireless base-station designs use the EP1SGX25FF1020C6 for CPRI (Common Public Radio Interface) fronthaul and baseband processing. According to the Stratix GX datasheet, the embedded transceivers support CPRI line rates up to 3.072 Gbps (CPRI Option 3), while the 25,660 logic elements implement crest factor reduction (CFR), digital predistortion (DPD), and channel filtering. The dedicated hardware multipliers accelerate FFT/iFFT operations for OFDM modulation, and the 1.94 Mbit TriMatrix memory buffers I/Q sample streams. The commercial 0-85 °C temperature range suits indoor macro-cell deployments. For outdoor remote-radio-head units (-40 °C to +100 °C), migrate to an industrial-grade variant or a Stratix IV GX family member.
추천
Defense and Aerospace Signal Processing
Defense applications leverage the EP1SGX25FF1020C6 for radar signal processing, electronic warfare, and secure communications. The 25,660 logic elements implement pulse compression, MTI filtering, and beamforming algorithms, while embedded transceivers handle high-speed ADC/DAC data links. According to the Stratix GX datasheet, the FPGA's deterministic timing and abundant DSP blocks enable real-time processing of wideband radar waveforms. However, the EP1SGX25FF1020C6 is commercial-grade (0-85 °C), so defense applications requiring extended temperature must select a different speed/temperature grade or use the device in temperature-controlled enclosures. Designers should verify ECC and SEU mitigation features per Intel's Stratix GX reliability documentation.
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ASIC Prototyping and Emulation
The EP1SGX25FF1020C6 serves as an ASIC prototyping platform for designs targeting multi-million-gate ASICs. According to the Stratix GX datasheet, the device's 25,660 logic elements, abundant memory, and 607 user I/Os allow partitioning of large ASIC designs across multiple Stratix GX FPGAs using standard ASIC-prototyping flows. The embedded transceivers model high-speed serial interfaces between ASIC blocks. Designers commonly combine 2-4 EP1SGX25FF1020C6 devices on a single prototyping board to emulate ASICs up to 100K gates. The FBGA-1020 package supports high-pin-count ASIC designs requiring hundreds of signals. Note: for ASIC prototypes exceeding 200K ASIC gates, migrate to Stratix IV or Stratix V families for higher density.
추천
High-Speed Serial Protocol Bridging
Protocol-bridging applications (PCI Express to Serial RapidIO, Fibre Channel to Ethernet, Aurora to custom protocols) rely on the EP1SGX25FF1020C6's embedded transceivers. According to the Stratix GX datasheet, the device supports transceiver rates up to 3.125 Gbps, sufficient for PCIe Gen1 (2.5 Gbps), Serial RapidIO, and Fibre Channel 1G/2G. The 25,660 logic elements implement protocol-stack translation, packet buffering, and DMA engines. The 607 user I/Os interface to host processors and memory subsystems. Drop-in compatibility within the Stratix GX FF1020 family allows designers to migrate to faster or slower speed grades without PCB redesign, providing flexibility for performance/cost trade-offs.
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추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25FF1020C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25FF1020C6N | EP1SGX25FF1020C7 | EP1SGX25FF1020C5 | EP1SGX25FF1020C4 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C6 | C6 | C7 (1 grade faster) | C5 (1 grade slower) | C4 (2 grades slower) |
| User I/O | 607 | 607 | 607 | 607 | 607 |
| Embedded Memory | 1.94 Mbit | 1.94 Mbit | 1.94 Mbit | 1.94 Mbit | 1.94 Mbit |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Estimated Unit Price (USD, as of 2026-09-07) | 185.00 (1 pc) | 185.00 (1 pc, est.) | 210.00 (1 pc, est.) | 165.00 (1 pc, est.) | 150.00 (1 pc, est.) |
주요 차별점
- Same FF1020 footprint across multiple speed grades (vs EP1SGX25FF1020C7)
- Lead-free variant (EP1SGX25FF1020C6N) supports RoHS designs (vs EP1SGX25FF1020C5)
- Embedded multi-gigabit transceivers eliminate external PHY cost (vs EP1S25F1020C6 (non-GX Stratix))
설계 노트
The FBGA-1020 package (33 x 33 mm, 1 mm pitch) requires microvia PCB technology for fan-out. According to Stratix GX hardware design guidelines, use a stack-up with at least 4-6 layers and microvias (laser-drilled) on the BGA-pad side. Maintain 50 ohm controlled impedance for transceiver channels and 100 ohm differential for LVDS pairs. Decoupling: place 0.1 uF X7R ceramics on every VCCINT ball within 100 mils, plus bulk 10-100 uF tantalum or polymer capacitors for each power rail. Transceiver supply filtering requires ferrite beads and separate analog ground islands.
Estimated: At full utilization (90% logic, 100% I/O toggle, all transceivers active), the EP1SGX25FF1020C6 consumes approximately 15-25 W. According to the Stratix GX datasheet, the device requires separate VCCINT (1.5 V core), VCCIO (per bank), VCCA_PLL (2.5 V analog PLL), and VCCPD (pre-driver) supplies. Power sequencing: VCCINT must ramp before or simultaneously with VCCPD. Use a power management IC (for example, the LTC3567 or equivalent) with proper sequencing to avoid latch-up. Total power-supply current at 1.5 V core can exceed 10 A, requiring multi-layer copper pours on the PCB.
Common pitfalls for the EP1SGX25FF1020C6 include: (1) RoHS confusion - the EP1SGX25FF1020C6 is RoHS non-compliant per distributor data; use the EP1SGX25FF1020C6N variant for RoHS-strict designs. (2) Configuration mode - the MSEL[2:0] pins must match the intended configuration source (AS = 011, PS = 000, JTAG = 101); wrong settings cause configuration failure. (3) Transceiver reference clock - the REFCLK inputs require low-jitter differential clocks (typically 100 MHz or 156.25 MHz for CPRI); poor clock quality causes high transceiver BER. (4) Thermal - commercial grade (0-85 °C) is unsuitable for outdoor deployment; select industrial or extended temperature variants for harsh environments.
Signal-integrity considerations for the EP1SGX25FF1020C6 focus on the multi-gigabit transceiver channels. According to Stratix GX design guidelines, transceiver channels require controlled-impedance differential routing (100 ohm differential, with skew matching better than 5 mils for 3 Gbps rates), AC-coupling capacitors (typically 100 nF) at the transmit side, and a clean reference clock. PCB stack-up must keep transceiver channels on stripline layers adjacent to solid GND planes. For LVDS I/O pairs, maintain 100 ohm differential impedance and length-match clock-to-data pairs within 50 mils. Use IBIS models for signal-integrity simulation at the schematic-to-PCB handoff.
규정 준수 정보
Per IC-Components distributor listing: RoHS non-compliant. Lead-free status reported as 'Yes' in some listings but 'No' in others (legacy Altera era - likely SnPb or SnAgCu ball metallurgy depending on date code). For RoHS-strict end products, choose EP1SGX25FF1020C6N. AEC-Q100 not applicable for FPGAs (this is a complex programmable logic device, not an automotive-grade IC).
