EP1SGX25FF1020C7 - 25K LE Stratix GX FPGA, 607 I/O, 1020-FBGA | Altera
부품 번호: EP1SGX25FF1020C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1680 | $16,800.00 |
| 100 | $1520 | $152,000.00 |
| 500 | $1395 | $697,500.00 |
| 1,000 | $1280 | $1,280,000.00 |
EP1SGX25FF1020C7 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs allow post-manufacture hardware reconfiguration via HDL bitstreams, making them ideal for prototyping, low-volume production, and applications requiring hardware acceleration. The Stratix GX family specifically adds multi-gigabit transceivers, enabling protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to 3.125 Gbps.
Key features of the EP1SGX25FF1020C7 include 25,660 logic elements organized into 2,566 logic array blocks (LABs), 607 user I/O pins supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), embedded multiplier blocks for DSP, and an internal maximum operating frequency cited by Arrow as 4,385.97 MHz. The device operates from a 1.425 V to 1.575 V core supply with separate VCCIO banks for I/O voltage flexibility.
From an architectural perspective, this device is fabricated on a 1.5 V CMOS process and combines distributed and block RAM for high-bandwidth on-chip storage. Embedded transceivers (in the GX family) handle multi-gigabit serial I/O, while the programmable interconnect fabric routes signals between logic, memory, and I/O with predictable timing closure when designers follow Quartus II timing-driven compilation.
Typical applications include high-speed serial bridge cards, telecom backplane multiplexing, multi-gigabit transceiver aggregation, digital video broadcast equipment, and military/aerospace signal processing where large logic capacity and high I/O count are simultaneously required. Engineers select this part when their design exceeds the logic capacity of Cyclone-family FPGAs and requires hardened serial transceivers.
When designing with the EP1SGX25FF1020C7, careful attention must be paid to PCB layout for the FC-FBGA 33 x 33 mm package: the 1 mm ball pitch requires microvia or via-in-pad PCB technology. Power distribution must use low-impedance planes for the 1.5 V core, and decoupling must be dense around the BGA perimeter. Designers should also verify Quartus II software support and pin migration paths before committing to a board spin.
드롭인 대체품: EP1SGX25FF1020C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25FF1020C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25FF1020C6
✅ 드롭인✓ 재고 있음
$135 / 개
데이터시트 보기 →EP1SGX25FF1020C5
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25FF1020
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →EP1S25F1020C7
✅ 드롭인✓ 재고 있음
$820 / 개
데이터시트 보기 →EP1S25F1020C6
✅ 드롭인✓ 재고 있음
$425 / 개
데이터시트 보기 →EP1SGX25FF1020C7 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 607 |
| Supply Voltage - Core | 1.425 V to 1.575 V |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) |
| Supplier Device Package | 1020-FBGA (33x33) |
| Logic Family | CMOS |
| 동작 온도 | 0 C to 85 C |
| Lead Free | Yes (per digchip datasheet) |
| Max Operating Frequency (cited) | 4385.97 MHz (per Arrow listing) |
| Process Technology | 1.5 V CMOS |
EP1SGX25FF1020C7 1020-fbga (33x33) 핀 구성 가이드
EP1SGX25FF1020C7(1020-fbga (33x33) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25FF1020C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25FF1020C7 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Bridge Cards, Telecom Backplane Aggregation, Digital Video Broadcast Equipment, High-Speed Instrumentation and Test Equipment, Military and Aerospace Signal Processing, Industrial Imaging and Machine Vision.
Multi-Gigabit Serial Bridge Cards
The EP1SGX25FF1020C7 is well suited for multi-gigabit serial bridge cards because it combines 25,660 logic elements with the Stratix GX family hardened transceivers supporting protocols up to 3.125 Gbps such as PCI Express, Gigabit Ethernet, and Serial RapidIO. Placed on a line card between a host ASIC and backplane, the device performs protocol translation, buffering in its 1,944,576-bit embedded RAM, and clock domain crossing. Its 607 user I/O pins provide ample headroom for parallel side-band signaling, while the FF1020 BGA allows dense board placement. Compared with discrete serializer/deserializer chips plus an FPGA, this part saves board area and simplifies BOM. The trade-off is higher unit cost and the obsolete status requiring long-term inventory planning.
추천
Telecom Backplane Aggregation
Telecom backplane aggregation nodes aggregate multiple lower-speed tributary signals into a higher-speed uplink, requiring large logic capacity for protocol mapping and significant transceiver bandwidth. The EP1SGX25FF1020C7 fits this role with 25,660 LEs for protocol state machines, 1,944,576 bits of on-chip RAM for cell/packet buffering, and multiple GX transceivers for tributary links. Placed on an AdvancedTCA or proprietary backplane card, the device terminates incoming serial streams, de-maps framing, and re-multiplexes onto a higher-rate uplink. Designers benefit from Quartus II's timing-driven compilation for deterministic backplane timing closure. The 1020-FBGA footprint demands microvia PCB fabrication, so early PCB vendor engagement is critical.
추천
Digital Video Broadcast Equipment
Digital video broadcast (DVB) and professional video routers require high-speed serial I/O for SDI (Serial Digital Interface) at 270 Mbps, 1.485 Gbps, and 2.97 Gbps, combined with logic capacity for audio embedding, ancillary data processing, and format conversion. The EP1SGX25FF1020C7 handles multiple SDI streams simultaneously through its GX transceivers while the 25,660 logic elements implement video processing pipelines. Placed on a video router crosspoint card, it provides 4-8 SDI ports per device with audio de-embedding into embedded RAM. The 607 user I/O pins also support parallel control interfaces and GPIO for module-level housekeeping. This obsolete part remains in long-lifecycle broadcast installations; new designs should consider Cyclone 10 GX or Arria 10 GX.
추천
High-Speed Instrumentation and Test Equipment
Test and measurement instruments such as oscilloscopes, logic analyzers, and protocol analyzers require fast data acquisition, large on-chip memory for sample buffering, and high pin counts for parallel test access. The EP1SGX25FF1020C7 supports these roles with 25,660 LEs for trigger logic, 1,944,576-bit RAM for waveform samples, and 607 I/O pins for probe multiplexing. GX transceivers enable high-speed serial data export to host computers. Placed on a digitizer board, the FPGA preprocesses samples and forwards them to a host via serial links, reducing host CPU load. The 1020-FBGA package allows dense channel placement; careful BGA fan-out and matched-length routing are essential for analog signal integrity.
추천
Military and Aerospace Signal Processing
Defense and aerospace signal-processing systems such as radar front-ends, electronic warfare subsystems, and satellite communication modems demand high logic capacity for DSP algorithms combined with radiation tolerance or extended temperature operation. The EP1SGX25FF1020C7, in its commercial 0-85 C grade, is suitable for ground-based or sheltered installations, while extended-temperature variants exist in the family. With 25,660 LEs and embedded multiplier blocks, the device implements FFT, digital down-conversion, and matched filtering in real time. The 1020-FBGA package suits ruggedized PCB assemblies with thermal management. Designers in this sector typically maintain multi-year inventory due to the obsolete status and long qualification cycles.
추천
Industrial Imaging and Machine Vision
Industrial machine-vision systems require high-bandwidth image acquisition from Camera Link, CoaXPress, or GigE Vision cameras, combined with real-time image processing pipelines. The EP1SGX25FF1020C7 can interface with Camera Link base/medium/full configurations using its transceivers and abundant I/O, and it implements preprocessing functions like Bayer demosaicing, color space conversion, and feature extraction in its 25,660 LEs. The 1,944,576 bits of embedded RAM buffer full image lines on chip. Placed on a frame grabber card, the FPGA transfers processed data over PCIe to the host PC. The 1020-FBGA package supports the multi-layer PCB stackups needed for high-speed camera interfaces, though designers should plan for the obsolete lifecycle.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25FF1020C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25FF1020C6 | EP1SGX25FF1020C5 | EP1SGX25FF1020 | EP1S25F1020C7 | EP1S25F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-FBGA (33x33, 1mm pitch) | 1020-FBGA (33x33, 1mm pitch) - same | 1020-FBGA (33x33, 1mm pitch) - same | 1020-FBGA (33x33, 1mm pitch) - same | 1020-FBGA (33x33, 1mm pitch) - same | 1020-FBGA (33x33, 1mm pitch) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Count | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C7 (fastest) | C6 | C5 | Not specified | C7 | C6 |
| Multi-Gigabit Transceivers | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | No (Stratix non-GX) | No (Stratix non-GX) |
| Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Fastest Stratix GX speed grade for the 25K LE die (vs EP1SGX25FF1020C6)
- Includes hardened multi-gigabit transceivers (vs EP1S25F1020C7)
- Highest I/O count in the Stratix GX family at this logic capacity (vs EP1SGX10FF672C7)
설계 노트
The 1020-ball FC-FBGA package with 1 mm ball pitch demands microvia or via-in-pad PCB technology. Standard 0.2 mm drilled vias cannot escape the 1 mm pitch reliably. Designers must engage their PCB fabrication vendor early to confirm stackup, microvia aspect ratio, and BGA fan-out routing capability before committing to board layout. Ground and power planes should be solid under the BGA to provide low-impedance return paths for high-speed transceivers.
Estimated: at 25,660 LEs utilization near 70% with typical Stratix GX toggle rates, the core current can exceed several amperes. Designers must provide a low-impedance 1.5 V plane, place bulk decoupling capacitors (typically 220 uF to 470 uF polymer) near the BGA, and add high-frequency ceramic capacitors (10 uF, 1 uF, 0.1 uF) at the package perimeter. Multiple VCCIO banks each require independent decoupling per the manufacturer datasheet. Voltage regulators should be sized with 30-50% headroom above calculated worst-case current to handle inrush during configuration.
Do not assume the EP1SGX25FF1020C7 is still in production - the Stratix GX family is obsolete. New designs should consider Stratix IV GX, Cyclone 10 GX, or Arria 10 GX for active lifecycle support. For maintenance of legacy boards, verify Quartus II software version compatibility (7.2 or later for the Stratix GX family) and secure long-term inventory supply before committing to production schedules. Configuration bitstream security (e.g., AES encryption) should be verified per the Quartus II configuration user guide.
규정 준수 정보
Lead-free per digchip datasheet note. RoHS, REACH, and halogen-free status not explicitly stated in the provided source data; marked as unknown per Data Authenticity Rules. AEC-Q100 not applicable - this is a commercial-grade FPGA intended for industrial, telecom, and computing applications, not automotive.
