EP1SGX40DF1020C6BN - Stratix GX FPGA 41K LE 624 I/O 1020-FBGA | Intel
부품 번호: EP1SGX40DF1020C6BN ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 25 | $245 | $6,125.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188 | $94,000.00 |
EP1SGX40DF1020C6BN 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in which the logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than by fixed mask layers. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The Stratix GX family specifically adds multi-gigabit transceivers (MGTs) alongside the general-purpose logic, making the category hypernym a "transceiver-equipped FPGA" or "high-speed serial FPGA."
Key differentiating features include 4,125 LABs/CLBs, 41,250 logic elements, dedicated 18x18 multiplier blocks for DSP pipelines, Stratix GX multi-gigabit transceivers supporting backplane and chip-to-chip serial links, 3,423,744 bits of embedded RAM, and 624 general-purpose I/O pins. The 1020-ball FBGA package exposes the full user-I/O complement and integrates dedicated clock-management circuitry, including PLLs and a global clock network.
The architecture combines a logic-array block (LAB) fabric built from 4-input look-up tables (LUTs), embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers. Configuration is stored in SRAM cells, requiring a configuration device or controller for bitstream loading on power-up. JTAG (IEEE 1149.1) boundary-scan and configuration interfaces are exposed as standard I/O banks.
Typical applications include 10 Gbps backplane interfaces, SONET/SDH framer designs, multi-gigabit serial-link aggregation, high-speed test and measurement instrumentation, and protocol-bridge ASIC replacements. Engineers select this device when they need integrated multi-gigabit transceivers and high logic density on a single die.
When designing with this part, plan the PCB for the 1020-ball FBGA land pattern with controlled-impedance transceiver lanes, match-length differential pairs, and a robust decoupling network near each power pin. The Altera/Intel Quartus II design suite is required for synthesis, place-and-route, and bitstream generation; legacy project archives may need migration to Quartus II service packs still available on the Intel FPGA legacy support portal.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Stratix GX design notes that are not consolidated in any single manufacturer document.
드롭인 대체품: EP1SGX40DF1020C6BN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40DF1020C6BN (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Package, RoHS Status, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX40DF1020C6
✅ 드롭인✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP1SGX40DF1020C5N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX40DF1020C5
✅ 드롭인✓ 재고 있음
$3650 / 개
데이터시트 보기 →EP1SGX40DF1020C5ES
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX40DF1020C
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP1S25FF1020C6BN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1SGX40DF1020C6BN 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Number of LABs/CLBs | 4125 |
| Number of Logic Elements | 41250 |
| Total RAM Bits | 3423744 |
| Number of I/O | 624 |
| 패키지 | 1020-BBGA (FineLine BGA) |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | 6 |
| Configuration Memory | SRAM-based (volatile) |
| Multi-Gigabit Transceivers | Yes (Stratix GX MGTs) |
| DSP / Multiplier Blocks | Embedded 18x18 multipliers |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (per distributor listings) |
| Lead-Free | Yes |
EP1SGX40DF1020C6BN 1020-bbga (fineline bga) 핀 구성 가이드
EP1SGX40DF1020C6BN(1020-bbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX40DF1020C6BN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX40DF1020C6BN 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Backplane Aggregation, SONET/SDH Framer and Mapper Designs, High-Speed Test and Measurement Instrumentation, ASIC Replacement for Bridging and Glue Logic, High-Definition Video Processing and Routing, Industrial Control and High-Speed Data Acquisition.
Multi-Gigabit Serial Backplane Aggregation
The Stratix GX family's integrated multi-gigabit transceivers (MGTs) operating at 1 Gbps to 3.125 Gbps make the EP1SGX40DF1020C6BN a natural fit for backplane aggregation line cards that fan-in multiple SFP/SFP+ links into a switch fabric ASIC. With 41,250 logic elements and 3,423,744 bits of embedded RAM, the fabric absorbs protocol-overhead logic, CRC engines, and statistical counters without external memory. The 1020-ball FBGA exposes all 624 user I/O so engineers can simultaneously drive multiple SFP cages plus a fabric-side parallel bus. Trade-off: MGTs require tightly matched-length differential pairs and AC-coupling capacitors on every lane.
추천
SONET/SDH Framer and Mapper Designs
Telecom OEMs historically selected Stratix GX for OC-48/STM-16 framer designs because the MGTs natively clock at 622 Mbps to 2.488 Gbps with 8B/10B encoding and word-alignment logic. The 41,250 logic elements of the EP1SGX40DF1020C6BN fit the framer state machine plus overhead processing for STS/AU pointers, and the 3.4 Mbit of embedded RAM absorbs de-skew FIFOs and path-overhead buffers. Designers typically instantiate two MGTs as protection pair plus a parallel overhead bus. Trade-off: SONET/SDH jitter compliance requires the MGT reference clock to come from a stratum-3/3E OCXO.
추천
High-Speed Test and Measurement Instrumentation
Test-equipment vendors use the EP1SGX40DF1020C6BN to build protocol analyzers, BERT (bit-error-rate testers), and logic-analyzer capture cards that sample multiple serial lanes simultaneously. The 624 user I/O feed directly into on-board comparator banks, while the MGTs capture 3.125 Gbps traffic in real time. Embedded TriMatrix memory (3.4 Mbit) acts as a circular capture buffer for trigger-and-store operation, and the 41,250 logic elements run protocol-decode engines in parallel. Trade-off: SRAM-based configuration means the FPGA must be re-loaded on every power-up, requiring an EPC configuration device on the same PCB.
추천
ASIC Replacement for Bridging and Glue Logic
The EP1SGX40DF1020C6BN is often deployed as an ASIC replacement where legacy bus-bridging, I/O expansion, or protocol-translation logic needs to be re-implemented in reconfigurable fabric. With 41,250 logic elements and 624 I/O, a single device absorbs 5+ legacy bridge ASICs and reduces PCB area. The MGTs provide built-in serial connectivity for modern host interfaces while the legacy parallel I/O banks preserve compatibility with existing backplane pin-out. Trade-off: Quartus II design-suite license is required for bitstream generation; engineer ramp-up on TimeQuest timing analysis is needed.
추천
High-Definition Video Processing and Routing
Broadcast video routers and format converters historically used the EP1SGX40DF1020C6BN to handle SDI/HD-SDI ingest at 1.485 Gbps or 2.97 Gbps through the MGTs and route to multiple parallel output buses. The 41,250 logic elements run color-space conversion, frame-rate adaptation, and audio-embedding pipelines, while the 3.4 Mbit of embedded RAM acts as line and frame buffers. The 624 I/O supports many simultaneous SDI outputs plus a parallel DSP companion bus. Trade-off: HD-SDI jitter compliance requires careful MGT reference-clock design and matched-length trace routing per the Altera Stratix GX handbook.
추천
Industrial Control and High-Speed Data Acquisition
Industrial OEMs adopt the EP1SGX40DF1020C6BN for high-channel-count data-acquisition backplanes where hundreds of analog inputs are digitized and packetized for transmission to a host processor. The MGTs aggregate digitized streams into 1 Gbps Ethernet or Aurora links, and the 41,250 logic elements run on-the-fly FFTs and digital filters per channel. The 624 I/O connect to parallel ADC/DAC banks, and the 1020-ball FBGA accommodates all the LVDS pairs needed for ADC data capture. Trade-off: commercial temperature range (0C to +85C) limits deployment; for industrial extended-temp designs choose EP1SGX40DF1020I-series parts instead.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40DF1020C6BN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX40DF1020C6 | EP1SGX40DF1020C5N | EP1SGX40DF1020C5 | EP1SGX40DF1020C5ES | EP1SGX40DF1020C | EP1S25FF1020C6BN |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 25,660 (-38%) |
| Series | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix (non-GX) |
| Speed Grade | 6 | 6 | 5 | 5 | 5 | C | 6 |
| Multi-Gigabit Transceivers | Yes (GX MGTs) | Yes | Yes | Yes | Yes | Yes | No (Stratix non-GX) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Lead-free / RoHS terminal finish specified (vs EP1SGX40DF1020C6)
- Speed grade 6 (production-timing) instead of speed grade 5 (vs EP1SGX40DF1020C5N)
- Stratix GX with multi-gigabit transceivers (vs EP1S25FF1020C6BN)
- Highest density in the EP1SGX40 family (vs EP1SGX25 family parts)
설계 노트
The 1020-ball FineLine BGA requires a 6+ layer PCB with dedicated ground and power planes. Use the Intel/Altera-recommended land pattern (1.00 mm ball pitch) and via-in-pad with filled-and-capped vias to maximize BGA breakout channel routing. All multi-gigabit transceiver (MGT) lanes must use matched-length differential pairs with 100 ohm differential impedance, AC-coupling capacitors placed close to the FPGA receive pins, and a continuous reference ground plane beneath the entire MGT routing channel.
Stratix GX devices require multiple supply rails: VCCINT (core), VCCIO (I/O banks), VCCA (PLL analog), and VTT for MGT termination. Per the Stratix GX handbook, VCCINT decoupling needs at least 22 x 0.1 uF MLCC + 4 x 10 uF bulk capacitors placed within 100 mils of the BGA balls. Use a sequencer or voltage-tracking controller to enforce VCCINT-before-VCCIO power-up; reverse sequencing can damage the device or cause inrush latch-up.
SRAM-based Stratix GX devices lose their configuration on every power-down, so a configuration memory device (EPC16 or EPC64 family) must be present on the PCB or JTAG programming must be performed at every boot. MGT reference-clock jitter must stay below the device-specific limit (typically 1 ps RMS for 3.125 Gbps operation) - never route an MGT reference through a long trace or non-dedicated PLL output. Finally, the -6 commercial suffix means 0C to +85C only; for industrial temperature ranges select the -I (industrial) ordering code, not the -C (commercial) variant.
MGT transmit pre-emphasis and receive equalization settings must be tuned for the specific backplane or cable loss profile; default Quartus II settings target short chip-to-chip links. For channels exceeding 20 dB insertion loss at 1.5 GHz, increase pre-emphasis tap weights or activate the receiver adaptive equalization. IBIS-AMI models are available from Intel/Altera legacy support for system-level channel simulation in HyperLynx or ADS.
규정 준수 정보
RoHS compliance indicated by trailing -N suffix and confirmed by distributor listings (Jotrin, components-store.com). Halogen-free status and conflict-minerals declaration not explicitly stated in the verified distributor data - set to unknown pending Intel/Altera documentation retrieval. AEC-Q100 not applicable because the part is commercial-temperature grade (0C to +85C).