EP1SGX25DF1020C6N - Stratix GX FPGA 25K LE 607 I/O 1020-BGA | Intel
부품 번호: EP1SGX25DF1020C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $195 | $195,000.00 |
EP1SGX25DF1020C6N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software abstraction. The Stratix GX family further extends the standard FPGA taxonomy by adding high-speed serial transceivers, positioning Stratix GX between general-purpose FPGAs and dedicated serial-interface ASSPs. The EP1SGX25 sits at the low end of the Stratix GX density range (EP1SGX10, EP1SGX25, EP1SGX40, EP1SGX60), targeting cost-sensitive multi-gigabit designs.
Key features of the EP1SGX25DF1020C6N include 25,660 logic elements, 1,944,576 RAM bits, 80 DSP blocks, 20 transceiver channels supporting CPRI, OBSAI, PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI protocols, and a maximum operating frequency of 4385.97 MHz across internal timing paths. The "DF" suffix denotes the FineLine BGA package with 1020 balls at 1 mm pitch, and the "C6" speed grade places the device in the mid-speed commercial tier.
Architecture-wise, the Stratix GX combines a TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM blocks), dedicated hardware multipliers and adder chains in DSP blocks, and PLLs for clock management. The transceiver block embeds serializer/deserializer (SERDES), clock-data recovery (CDR), and word alignment, eliminating the need for external PHY devices in many serial-link applications.
Typical applications include wireless baseband processing, radio network controllers, Serial RapidIO backplanes, broadcast video routers, and PCI Express endpoint cards. Designers value the EP1SGX25 because it delivers Stratix GX transceiver density at a price point suited to mid-volume telecom and industrial products where a full Stratix II GX is overkill.
Design consideration: the EP1SGX25DF1020C6N requires a 1.5 V core supply and 3.3 V/2.5 V/1.8 V/1.5 V I/O supplies, with careful decoupling and a multi-layer PCB. The 1020-ball BGA at 1 mm pitch demands advanced assembly capability (typically 4-6 layer PCB, ENIG finish, and via-in-pad design rules). Power estimation should use the Quartus II PowerPlay early estimator before pin assignment.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the Intel datasheet alone.
드롭인 대체품: EP1SGX25DF1020C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package Type, Package, RoHS Status, Package Dimensions.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C6
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25FF1020C6N
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP1S25F1020C6N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP1SGX40DF1020C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$142 / 개
데이터시트 보기 →EP1SGX25DF1020C6N 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| User I/O | 607 |
| Transceiver Channels | 20 (up to 3.125 Gbps) |
| DSP Blocks | 80 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Maximum Internal Frequency | 4385.97 MHz |
| 동작 온도 | 0 C to +85 C (Commercial) |
| 패키지 | 1020-ball FC-FBGA (DF) 33 x 33 mm, 1 mm pitch |
| 실장 유형 | Surface Mount |
| Speed Grade | C6 |
| Lead Free | Yes |
| RoHS 상태 | Compliant |
EP1SGX25DF1020C6N 1020-ball fc-fbga (df) 33 x 33 mm, 1 mm pitch 핀 구성 가이드
EP1SGX25DF1020C6N(1020-ball fc-fbga (df) 33 x 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020C6N 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Serial RapidIO Backplane, PCI Express Endpoint Card, Broadcast Video Router, Industrial Multi-Gigabit Gateway, XAUI 10G Ethernet Aggregation.
Wireless Baseband Processing
The EP1SGX25DF1020C6N fits wireless baseband cards because 20 integrated transceiver channels support CPRI and OBSAI links to remote radio heads at up to 3.125 Gbps, eliminating external PHY chips. Its 25,660 logic elements and 80 DSP blocks handle uplink/downlink baseband computations (channel estimation, FFT/iFFT, scrambling) while 1,944,576 bits of embedded RAM buffer interleaved data streams. The 607 user I/O connect to backplane buses and external memory. Compared to a discrete SERDES-plus-FPGA solution, the integrated transceivers reduce BOM and simplify PCB routing.
추천
Serial RapidIO Backplane
The EP1SGX25DF1020C6N is well-suited for Serial RapidIO (SRIO) switch and endpoint cards because 20 transceiver channels aggregate to support multiple SRIO lanes at 1.25/2.5/3.125 Gbps. Its TriMatrix memory architecture provides 1,944,576 bits of distributed buffer for packet queuing, while 80 DSP blocks accelerate message-header processing. The 607 user I/O maintain compatibility with legacy 32-bit RapidIO parallel interfaces when bridging to serial. Power consumption is moderate for the 33x33 mm DF BGA, but designers should budget ~8-10 W for full transceiver utilization.
추천
PCI Express Endpoint Card
The EP1SGX25DF1020C6N implements a single x4 or x8 PCI Express endpoint using 4-8 of its 20 transceiver channels at 2.5 Gbps per lane, leaving 12-16 channels for other high-speed links or local interconnect. The hard PCI Express IP core in Quartus II handles protocol layer, link training, and transaction handling, while 25,660 logic elements implement application-layer functions such as DMA engines and data movers. Designers gain a fully integrated Gen1 PCIe solution without external PCIe PHY silicon. Migration to Gen2 requires upgrading to a Stratix IV GX or later device.
추천
Broadcast Video Router
The EP1SGX25DF1020C6N serves in broadcast SDI/HD-SDI routers and cross-point switches because 20 transceivers support 10-bit SDI links at 270 Mbps, 1.485 Gbps HD-SDI, and 2.97 Gbps 3G-SDI simultaneously. Embedded RAM buffers video frames while 80 DSP blocks perform color-space conversion and overlay composition. 607 user I/O accommodate control planes and audio embedding. Compared to ASSP video crosspoint chips, the Stratix GX approach offers reconfigurable I/O mapping and field upgradability via FPGA bitstream updates.
추천
Industrial Multi-Gigabit Gateway
The EP1SGX25DF1020C6N is a strong fit for industrial gateways bridging PROFINET, EtherCAT, and Serial RapidIO because 20 integrated transceivers handle multiple industrial Ethernet protocols concurrently. The 130 nm process and 0-85 C commercial temperature range are sufficient for indoor industrial enclosures. 80 DSP blocks and 1,944,576 bits of embedded memory enable on-chip protocol stack processing without external co-processors. The 1020-ball DF BGA package is well-supported by contract manufacturers; consider EP1SGX25FF1020C6N for harsher thermal environments.
추천
XAUI 10G Ethernet Aggregation
The EP1SGX25DF1020C6N supports XAUI (10 Gigabit Attachment Unit Interface) by bonding four 3.125 Gbps transceivers per XAUI lane, allowing up to five independent XAUI links from 20 transceivers. This is ideal for 10G Ethernet aggregation switches, line cards, and MAC designs. The hard XAUI IP in Quartus II implements the XGMII-to-XAUI conversion, while 25,660 logic elements implement MAC and address-table logic. Compared to an ASIC-based 10G solution, the FPGA approach allows late-stage protocol changes and field firmware updates across multiple Ethernet standards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C7N | EP1SGX25FF1020C6N | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (DF) 33x33 mm | 1020-ball FC-FBGA (DF) - same | 1020-ball FC-FBGA (DF) - same | 1020-ball FC-FBGA (DF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (F) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Transceiver Channels | 20 @ up to 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 0 (no transceivers) |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | C6 | C6 |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| User I/O | 607 | 607 | 607 | 607 | 607 | 706 |
| Lifecycle Status | Obsolete (EOL) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Integrated multi-gigabit transceivers (vs EP1S25F1020C6N)
- Faster speed grade for tight timing closure (vs EP1SGX25DF1020C5N)
- Enhanced BGA thermal package option (vs EP1SGX25FF1020C6N)
설계 노트
The 1020-ball FC-FBGA at 1 mm pitch requires a 4-6 layer PCB with ENIG finish and via-in-pad technology for reliable assembly. Use a solder paste stencil of 0.125 mm thickness with apertures sized 0.4-0.5 mm diameter. Plan for 8 mil (0.2 mm) trace width and 4 mil (0.1 mm) clearance in the fanout region. Verify your assembly house supports 1 mm pitch BGA before committing to the layout; otherwise migrate to the FF Enhanced BGA variant (same ball count but easier thermal profiling).
Estimate: core power for a fully utilized EP1SGX25 at 50% toggle rate and 25,660 LE is approximately 5-7 W. With 20 transceivers active at 3.125 Gbps, add 2-4 W for the SERDES blocks, giving a 7-11 W total. Use the Quartus II PowerPlay early estimator with your actual toggle rates; for a conservative design, budget 12 W and design the power supply and PCB thermal dissipation accordingly. Decoupling requires 100 uF bulk + 0.1 uF + 0.01 uF + 0.001 uF per supply pin group, placed within 5 mm of the BGA balls.
Route all 20 transceiver channels with controlled impedance of 100 ohm differential (85 ohm for PCIe), using a stripline or microstrip topology with reference planes on adjacent layers. Match intra-pair skew to under 5 mil (0.125 mm) and inter-pair skew to under 50 mil (1.25 mm) to maintain signal integrity at 3.125 Gbps. Use the Quartus II transceiver toolkit post-layout to validate eye margins; do not rely on simulation alone. Transceiver reference clock routing is similarly critical - use 50 ohm single-ended or 100 ohm differential with isolated ground returns.
Do not confuse DF (FineLine BGA, 33x33 mm) with FF (Enhanced FineLine BGA, same ball count) or F (legacy FC-BGA) - all three are 1020-ball but have different land patterns. Verify the exact ball-map file in the Quartus II device library matches your PCB footprint before assembly. A common mistake is to assign 3.3 V LVCMOS to a bank without checking VCCIO compatibility with the chosen I/O standard; the EP1SGX25 supports 1.5/1.8/2.5/3.3 V per bank, but each bank must be uniformly supplied. Finally, configure unused transceiver channels to power-down mode in software to reduce quiescent power by up to 30%.
규정 준수 정보
RoHS compliant per Alldatasheet and DigiKey product pages. Lead-free / lead-free designator "N" suffix. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Halogen-free status not explicitly stated in the verified data; treat as unknown.
