EP1SGX40DF1020C6N - Stratix GX FPGA, 41,250 LEs, 1020-FBGA | Intel
부품 번호: EP1SGX40DF1020C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
EP1SGX40DF1020C6N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement arbitrary digital logic, signal processing, and memory functions in silicon without a custom ASIC tape-out. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and are widely used for prototyping, low-volume production, and applications where post-silicon logic updates are required. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications such as communications infrastructure, broadcast video, and defense signal processing.
Key features include 3,423,744 embedded RAM bits, integrated high-speed transceivers supporting multi-gigabit serial protocols, and a commercial operating temperature range of 0 °C to 85 °C. The DF1020C6N speed grade designates a 1020-ball FBGA package with the device identifier indicating the 40K logic-element density tier. The Stratix GX device family is built on 130 nm CMOS technology and provides dedicated hardware multipliers, embedded memory blocks, and digital signal processing (DSP) blocks alongside the general-purpose logic fabric.
Typical applications for the EP1SGX40DF1020C6N include telecom line cards with SERDES backplanes, software-defined radio (SDR) front ends, video broadcast encoders/decoders, military secure communications, and high-performance ASIC prototyping. The combination of high logic density, multi-gigabit transceivers, and substantial on-chip memory makes it well suited to designs that previously required multiple discrete ASSPs or custom ASICs.
When designing with this device, plan for the 33 x 33 mm 1020-ball BGA land pattern, multi-layer PCB stack-up with controlled-impedance SERDES traces, and thermal management via the exposed die / heat-spreader interface. Reference designs from the Altera Stratix GX handbook and the Quartus II development toolchain should be consulted for transceiver channel configuration, PLL setup, and pinout assignment before PCB layout.
This page synthesizes distributor pricing, drop-in replacement parts from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP1SGX40DF1020C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40DF1020C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Speed Grade, Package, Package Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX40GF1020C6N
✅ 드롭인✓ 재고 있음
$980 / 개
데이터시트 보기 →EP1SGX40GF1020C7N
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP1SGX40DF1020C6ES
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX40DF1020C6BN
✅ 드롭인✓ 재고 있음
$188 / 개
데이터시트 보기 →EP1SGX40DF1020C5N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX40DF1020C
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP1SGX40DF1020C6N 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 LABs / 4697 CLBs |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 5000 MHz |
| 동작 온도 | 0 C to 85 C |
| Package Type | 1020-FBGA (33 x 33 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount |
| Logic Family | CMOS |
| Speed Grade | C6 |
EP1SGX40DF1020C6N 1020-fbga (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1SGX40DF1020C6N(1020-fbga (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX40DF1020C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX40DF1020C6N 적합 용도: 6 애플리케이션s: Telecom Line Cards and SERDES Backplanes, Software Defined Radio (SDR) Baseband Processing, Broadcast Video Encoding and Processing, High-Performance ASIC Prototyping, Military and Secure Communications, Industrial Test and Measurement Instrumentation.
Telecom Line Cards and SERDES Backplanes
The EP1SGX40DF1020C6N fits telecom line-card designs because its integrated multi-gigabit transceivers and 624 user I/Os directly support SERDES-based backplane interconnect at OC-192 / 10G rates. With 41,250 logic elements and 3.4 Mbits of embedded RAM, it handles packet classification, framing, and forwarding logic without external ASSPs. The 1020-FBGA package exposes enough SERDES channels and parallel I/O for multi-port line cards. Placed on a multi-layer PCB with controlled-impedance traces, the device replaces what would otherwise be a discrete SERDES chip plus glue logic. Designers should follow the Stratix GX handbook's reference design for transceiver channel placement to minimize jitter.
추천
Software Defined Radio (SDR) Baseband Processing
The EP1SGX40DF1020C6N suits SDR baseband designs because its 41,250 logic elements, 3.4 Mbit embedded RAM, and dedicated DSP blocks deliver sufficient processing throughput for wideband digital down-conversion, channelization, and demodulation. The 5000 MHz internal clock supports multi-stage FIR filtering and FFT pipelines in a single device. Combined with the integrated high-speed transceivers, the FPGA streams digitized RF data directly into the fabric for real-time processing. The 1020-FBGA exposed-die package enables heatsink attachment for sustained DSP workloads. Reference designs from the Altera DSP Builder flow accelerate development of SDR baseband IP cores.
추천
Broadcast Video Encoding and Processing
The EP1SGX40DF1020C6N fits broadcast video encoder/decoder applications because its 41,250 logic elements and 3.4 Mbit embedded RAM enable real-time SD/HD video processing, compression, and overlay composition in a single device. The 624 user I/Os handle multiple video streams, audio interfaces, and control channels simultaneously. The integrated transceivers support SDI (Serial Digital Interface) at 270 Mbps / 1.485 Gbps / 2.97 Gbps rates standard in broadcast studios. Compared with ASSP encoders, the FPGA offers post-deployment codec upgrades. Designers should use the Quartus II video IP suite and consult broadcast reference designs for SDI physical-layer implementation.
추천
High-Performance ASIC Prototyping
The EP1SGX40DF1020C6N is well-suited to ASIC prototyping because its 41,250 logic elements, 3.4 Mbit embedded RAM, and 624 I/Os provide enough capacity to map mid-complexity ASIC designs at production clock rates. Multi-FPGA partitioning is possible via the high-speed transceivers for prototyping ASICs too large for one device. The 1020-FBGA package exposes wide buses for bridging to memory and external test equipment. Designers benefit from the Quartus II synthesis flow supporting direct migration of synthesizable ASIC RTL. Use the Stratix GX handbook's ASIC prototyping reference flow for clock-domain crossing and I/O mapping.
추천
Military and Secure Communications
The EP1SGX40DF1020C6N fits military secure-communications equipment where its 41,250 logic elements, integrated transceivers, and 1020-FBGA package support cryptographic processing, signal conditioning, and multi-channel data aggregation. The extended-temperature variant EP1SGX40DF1020C6ES supports ruggedized deployment in temperature-stressed environments. The FPGA's reconfigurability allows post-deployment cryptographic algorithm updates critical for lifecycle management. Designers should consult the Altera industrial/military temperature datasheet supplement for derating guidance. The Quartus II development flow includes IP cores for AES, SHA, and public-key acceleration common in secure-radio designs.
추천
Industrial Test and Measurement Instrumentation
The EP1SGX40DF1020C6N fits high-end test and measurement instruments because its 41,250 logic elements, 3.4 Mbit embedded RAM, and 624 user I/Os enable real-time DSP, parallel ADC/DAC interfacing, and complex triggering logic in a single chip. The integrated transceivers handle high-speed serial protocols such as PCIe, Serial RapidIO, and 10G Ethernet used in modern ATE platforms. The 1020-FBGA package supports the dense ball-out required for parallel LVDS ADC interfaces. Designers can leverage Altera's DSP Builder and IP library for FFT, FIR, and arbitrary waveform generation, reducing time-to-market for new instruments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40DF1020C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX40GF1020C6N | EP1SGX40GF1020C7N | EP1SGX40DF1020C6ES | EP1SGX40DF1020C6BN | EP1SGX40DF1020C5N | EP1SGX40DF1020C |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33 x 33 mm, 1 mm pitch) | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Variant | DF (Differential SERDES) | GF (Giga-bit Fibre) | GF (Giga-bit Fibre) | DF (Differential SERDES) | DF (Differential SERDES) | DF (Differential SERDES) | DF (Differential SERDES) |
| Speed Grade | C6 | C6 | C7 (faster) | C6 | C6 | C5 (slower) | Unsuffixed |
| Number of I/O | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Total RAM Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Drop-in compatible with multiple Stratix GX 40K variants on the same 1020-FBGA PCB (vs EP1SGX40GF1020C6N)
- Mid-density tier of Stratix GX family with high logic and RAM balance (vs EP1S40F1020C6N (Stratix non-GX))
- Speed grade flexibility across C5/C6/C7 with same die (vs EP1SGX40DF1020C5N (C5 speed grade))
설계 노트
The 1020-ball FC-FBGA package at 1 mm ball pitch requires a multi-layer PCB stack-up with laser-drilled microvias in the top layer and conventional through-vias in inner layers. Per the Altera Stratix GX handbook, the 33 x 33 mm footprint demands at least 4-6 PCB layers to fan out the BGA and route controlled-impedance SERDES traces. Use the manufacturer's land-pattern and via-in-pad recommendations verbatim; deviations cause solder joint defects and SERDES signal-integrity loss at multi-gigabit rates.
Estimated: at maximum toggle activity across all 41,250 logic elements running at 5000 MHz with the 1.5 V core, the device can dissipate 10-15 W. The 1020-FBGA package exposes the silicon die for direct heat-sink attachment; without a heat-spreader, junction temperature can exceed 100 C in still air. Designers should attach a thermal interface material (TIM) plus heat sink or use a PCB copper pour with thermal vias per the Stratix GX thermal design guide. Industrial variants (C6ES) extend the operating range for harsh environments.
Do not migrate a Quartus II design targeting EP1SGX40DF1020C6N to a different speed grade (e.g., C5, C7) without re-running timing analysis. Speed-grade transitions change setup/hold margins for internal paths and SERDES channels, and may require I/O standard or PLL reassignment. Also verify that the chosen transceiver variant (DF vs GF) supports the protocol you need; mixing DF and GF parts on a previously-qualified PCB layout will pass pinout but fail link training at the SERDES level.
규정 준수 정보
RoHS / REACH / lead-free status not in verified web data - set to unknown; consult Altera/Intel product page for the specific EP1SGX40DF1020C6N ordering code. AEC-Q100 not applicable for FPGAs in automotive; consult AEC-Q100-qualified automotive-grade parts if required.
