EP20K1000CB652I8 - APEX 20KC 1M Gates FPGA | Intel | BGA-652
부품 번호: EP20K1000CB652I8 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248 | $24,800.00 |
| 250 | $232 | $58,000.00 |
| 500 | $218 | $109,000.00 |
EP20K1000CB652I8 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells can be programmed after manufacture using an SRAM-based configuration bitstream. APEX 20KC belongs to the PLD (Programmable Logic Device) hierarchy: programmable logic > PLD > CPLD/FPGA > high-density SRAM-based FPGA. The 'K' family variant adds MultiVolt I/O support and improved ESB density versus the original APEX 20K, while remaining pin-compatible in common packages such as the 652-ball BGA used here.
Key features include 480 user I/O pins (plus 4 dedicated inputs), 488 total I/O, 4 Phase-Locked Loops (PLLs) for clock conditioning, MultiVolt I/O supporting 1.8 V / 2.5 V / 3.3 V interface levels, and in-system programmability via the IEEE 1149.1 JTAG port. The architecture supports up to 540 kbit of embedded RAM and provides high-speed LVDS, PCI, and GTL+ I/O standards. Configuration is loaded from a PROM or via JTAG.
Typical applications include telecommunications line-card glue logic, industrial motor-control and factory automation, military/aerospace signal processing, ASIC prototyping, and high-speed datapath bridging. The industrial-grade -40C to +100C operating range enables deployment in outdoor telecom, transportation, and defense systems where commercial-temperature FPGAs are unsuitable.
When designing with this part, plan the power-decoupling network around the dedicated VCCINT and VCCIO rails with bulk plus high-frequency ceramics near each ball. The 652-ball BGA requires X-ray or advanced optical inspection during assembly, and signal-integrity simulation is recommended for LVDS/GTL+ interfaces operating above 100 MHz.
This page aggregates verified distributor pricing, same-brand drop-in alternatives already on the XAIPART catalog, and practical layout guidance drawn from the APEX 20KC datasheet family - information engineers need but cannot find on a single manufacturer page.
드롭인 대체품: EP20K1000CB652I8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K1000CB652I8 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Package, Configuration Interface, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K1000CB652C9ES
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EP20K1000CB652C8ES
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →EP20K1000CB652C7NJ
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K1000EBC652-2X
✅ 드롭인✓ 재고 있음
$99 / 개
데이터시트 보기 →EP20K1000CF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$158 / 개
데이터시트 보기 →EP20K1000CB652I8 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Logic Elements / Cells | 38,400 |
| System Gates | 1,000,000 |
| Maximum Operating Frequency | 301.21 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.8 V |
| Number of Terminals | 652 |
| Package Type | FCBGA (LBGA, ball grid array) |
| Package Code | LBGA / S-PBGA-B652 |
| Dedicated Inputs | 4 |
| User I/O Pins | 480 |
| Total I/O Count | 488 (4 dedicated inputs + 484 I/O) |
| Number of PLLs | 4 |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / CAM) |
| Embedded Memory | 540 kbit maximum (per family datasheet) |
| MultiVolt I/O Support | 1.8 V / 2.5 V / 3.3 V |
| Configuration Interface | JTAG (IEEE 1149.1) / serial / parallel |
| Operating Temperature (Industrial) | -40C to +100C |
| Temperature Grade Suffix | I (Industrial) |
EP20K1000CB652I8 lbga / s-pbga-b652 핀 구성 가이드
EP20K1000CB652I8(lbga / s-pbga-b652 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K1000CB652I8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K1000CB652I8 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Motor Control and Factory Automation, ASIC Prototyping and Pre-Silicon Validation, Military and Aerospace Signal Processing, Test and Measurement Instrumentation Backplane, Legacy Board Replacement and Sustainment.
Telecommunications Line-Card Glue Logic
The EP20K1000CB652I8 fits telecom line-card glue logic because its 38,400 logic elements and 540 kbit embedded RAM provide the FIFO, framing, and clock-domain-crossing resources needed between network processors and SERDES framer ICs. The four integrated PLLs allow jitter-clean clock synthesis from a single backplane reference, while MultiVolt I/O (1.8/2.5/3.3 V) interfaces directly to legacy bus levels without external level shifters. The industrial -40C to +100C temperature grade supports outdoor cabinet and central-office deployments. Designers typically pair the FPGA with a TCM/JTAG configuration PROM and use the 480 user I/O to bridge processor buses and backplane connectors.
추천
Industrial Motor Control and Factory Automation
For motor control and factory-automation platforms, the EP20K1000CB652I8 supplies the deterministic PWM generation, encoder decoding, and fieldbus glue that off-the-shelf microcontrollers cannot. The 38,400 cells and embedded dual-port RAM enable multi-axis current-loop control with sub-microsecond update rates, and the 480 I/O support parallel ADC/DAC chains for current sensing and inverter drive. Industrial-grade -40C to +100C operation tolerates cabinet temperatures near motor drives, while the 652-ball BGA provides ample ground balls for low-noise analog sampling. Typical pairings include precision op-amps for current shunts and isolated gate drivers downstream.
추천
ASIC Prototyping and Pre-Silicon Validation
The EP20K1000CB652I8 is widely used as an ASIC prototyping vehicle because the APEX 20KC MultiCore architecture allows one-to-one mapping of LUT-based ASIC netlists onto 38,400 logic cells with predictable timing closure. The four PLLs let designers replicate multi-clock ASIC domains, while 480 I/O pins expose wide bus interfaces for ASIC traffic monitoring. Industrial temperature support means prototypes can be validated in real-world environments rather than lab-only. Engineers typically partition the ASIC by function across multiple APEX 20KCs and use JTAG chain stitching for unified debug.
추천
Military and Aerospace Signal Processing
Defense signal-processing subsystems historically use the EP20K1000CB652I8 because of its industrial temperature range and the APEX 20KC family's documented long-term support for legacy programs. The 540 kbit of embedded RAM suits digital-IF downconversion, beamforming weight storage, and radar-pulse buffering at sample rates up to 100 MHz in LVDS I/O mode. The four PLLs allow independent clock trees for ADC sampling, DSP datapath, and host interface. Programs requiring modern security features or radiation hardness should migrate to a current Intel Agilex or Microsemi RTG4 device instead.
추천
Test and Measurement Instrumentation Backplane
The EP20K1000CB652I8 fits instrumentation backplanes where a single device must aggregate multiple test channels, route triggers, and bridge to a controller CPU. Its 488 I/O provide direct connections to ADC front ends, DAC calibrators, and trigger fan-out buffers, while the embedded RAMs act as deep capture buffers or pattern generators. The industrial temperature grade supports bench-to-chamber transitions without re-characterization, and JTAG-based configuration enables remote firmware updates in deployed testers. Design-in practice pairs the FPGA with low-jitter clock PLLs and LVDS serializers.
추천
Legacy Board Replacement and Sustainment
The most common application for the EP20K1000CB652I8 today is sustaining legacy boards where the original Altera FPGA has failed and the OEM is no longer active. Because the 652-ball FCBGA footprint is shared across APEX 20KC and 20KE families, direct reball or hot-air rework can swap the I8 temperature grade for the commercial C7/C8/C9 or the 20KE upgrade. Designers should re-validate timing closure if changing speed grades, and re-validate thermal performance if switching from industrial to commercial temperature. Procurement teams should request lot date codes and traceability documentation for brokers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K1000CB652I8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K1000CB652C9ES | EP20K1000CB652C8ES | EP20K1000CB652C7NJ | EP20K1000EBC652-2X | EP20K1000CF672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FCBGA-652 (LBGA) | FCBGA-652 - same | FCBGA-652 - same | FCBGA-652 - same | FCBGA-652 - same | FCBGA-672 - larger |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KE (enhanced) | APEX 20KC |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | -8 | -9 (faster) | -8 | -7 (slower) | -2X | -7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature grade at the same speed grade (-8) as commercial variants (vs EP20K1000CB652C8ES)
- Same 652-ball FCBGA footprint across the entire APEX 20KC 1M-gate lineup (vs EP20K1000CF672C7)
- Four PLLs and MultiVolt I/O consolidated in one 1M-gate device (vs EP20K400CB652C7)
설계 노트
The EP20K1000CB652I8 separates VCCINT (1.8 V core) and VCCIO (1.8/2.5/3.3 V I/O banks). Place a minimum of one 100 uF bulk tantalum plus ten 0.1 uF X7R 0402/0603 ceramics per VCCIO bank, distributed around the BGA perimeter. PLLs require their own filtered analog supply (VCC_PLL) with a ferrite bead and 10 uF + 0.1 uF RC decoupling; sharing PLL analog VCC with digital VCCIO introduces jitter.
The 652-ball FCBGA requires a 1.0 mm or finer pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for reliable assembly. Match BGA pad diameter to the APEX 20KC package specification (typically 0.5 mm ball on 1.0 mm pitch). Stack-up must provide continuous ground planes under the BGA; route all high-speed signals on stripline layers referenced to those grounds. Microvia-in-pad is recommended for inner balls.
Estimated: at 301 MHz internal clock with 480 LVDS I/O switching simultaneously, expect ~3-5 W dynamic power plus ~1 W static; budget 6-8 W total worst-case dissipation. Derate the BGA's theta_JA (~15-20 C/W with proper thermal via array under the exposed die) accordingly. Without a thermal via array, junction temperature may exceed 100C even at industrial ambient - place at least a 4x4 thermal via farm (0.3 mm drill, 1.0 mm pitch) under the package center.
The 'I8' suffix denotes industrial temperature AND -8 speed grade; ordering a 'C8' commercial-temperature part as a substitute without re-qualifying will fail thermal testing in cold-start scenarios. The APEX 20KC configuration bitstream is NOT compatible with APEX 20KE (despite same package); use the correct Quartus version for the target family. JTAG pins (TCK/TMS/TDO/TDI) must not be left floating - tie TMS and TDI through 10 kohm pull-ups to VCCIO.
LVDS and GTL+ I/O standards on the EP20K1000CB652I8 require 100 ohm differential (LVDS) or 25 ohm single-ended (GTL+) termination near the receiver. Run length matching within 150 mils for LVDS pairs. Place series AC-coupling capacitors (0.1 uF) on LVDS receive pairs when connecting to a separate-voltage driver. Simulate with IBIS models from Intel; field-deployed designs without SI simulation commonly fail at >200 MHz LVDS.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not documented in the Verified Web Data retrieved 2026-09-07; manufacturer disclosure for the obsolete APEX 20KC family predates current compliance-reporting formats. Request the lot-specific certificate of compliance from the seller for any RoHS- or REACH-mandated order.
