EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
부품 번호: EP1SGX25DF672C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119.75 | $11,975.00 |
| 500 | $108 | $54,000.00 |
| 1,000 | $96.5 | $96,500.00 |
EP1SGX25DF672C6 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows engineers to implement arbitrary digital logic, soft processor cores, and high-speed serial interfaces using a hardware description language. The Stratix GX line specifically added multi-gigabit transceivers to the Stratix architecture, simplifying the design of protocols like PCI Express, Serial RapidIO, Gigabit Ethernet, and custom chip-to-chip links without requiring external PHY devices.
Key features of the EP1SGX25DF672C6 include 25,660 logic elements distributed across 2,566 LABs, 1,944,576 bits of RAM, 6 embedded transceiver channels supporting data rates up to 3.125 Gbps, and 12 dedicated clock pins with 16 global clock networks. The 672-pin BGA package exposes 455 user I/Os for parallel signaling and board-to-board interconnects, while on-chip PLLs support precise frequency synthesis and clock domain crossing.
In terms of architecture, this device blends a fine-grained logic fabric with coarse-grained DSP blocks and TriMatrix memory, allowing efficient implementation of both control logic and signal-processing datapaths. The embedded transceivers include built-in 8b/10b encoding, byte alignment, and rate-matching FIFOs, offloading protocol overhead from the programmable fabric.
Typical applications include high-speed serial backplane connectivity, telecom line cards, industrial imaging pipelines, and digital video broadcast equipment. Industrial and telecom system architects use this part where pin-compatibility with later-generation Stratix GX devices allows straightforward migration.
When designing with this device, careful attention to power sequencing, decoupling, and signal-integrity on the 1.0 mm BGA is essential. Use at least 6 layers with continuous power planes and follow Altera's Stratix GX design guidelines for channel pre-emphasis and receiver equalization settings.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the same Stratix GX family, and practical PCB layout notes that go beyond the manufacturer datasheet alone, helping sourcing engineers and hardware designers make informed second-source decisions.
드롭인 대체품: EP1SGX25DF672C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF672C6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Family, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF672C5N
✅ 드롭인✓ 재고 있음
$1232.25 / 개
데이터시트 보기 →EP1SGX25DF672C5
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1SGX25CF672C6
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672C5
✅ 드롭인✓ 재고 있음
$1304.99 / 개
데이터시트 보기 →EP1SGX10DF672C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S25F672C6
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →EP1SGX25DF672C6 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Logic Elements | 25,660 LE |
| Number of LABs | 2,566 |
| Total RAM Bits | 1,944,576 bits |
| User I/O Count | 455 |
| Number of Transceivers | 6 channels (per Stratix GX family) |
| Max Transceiver Data Rate | 3.125 Gbps |
| Core Voltage | 1.5 V |
| 동작 온도 | 0C to +85C (commercial) |
| 패키지 | 672-BBGA FineLine BGA |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| 실장 유형 | Surface Mount |
| Lead-Free / RoHS | Lead-Free (per FBGA suffix family) |
| Process Technology | CMOS |
EP1SGX25DF672C6 33 x 33 mm 핀 구성 가이드
EP1SGX25DF672C6(33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF672C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF672C6 적합 용도: 6 애플리케이션s: Telecom Backplane Serial Interconnect, Industrial Imaging and Video Processing, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Broadcast Video and Studio Equipment, Medical Imaging Systems.
Telecom Backplane Serial Interconnect
The EP1SGX25DF672C6's 6 embedded multi-gigabit transceivers operating up to 3.125 Gbps make it well suited for telecom line-card backplane designs requiring Serial RapidIO, XAUI, or custom chip-to-chip links. With 25,660 logic elements, the device can implement protocol state machines, buffer management, and link-layer logic without external PHYs. The 672-ball BGA exposes 455 user I/Os for parallel side-band signals, MDIO management interfaces, and front-panel status LEDs. Engineers typically pair this FPGA with external clock synthesizers and SFP/SFP+ cages, using the on-chip PLLs to derive multiple clock domains from a single backplane reference. Compared to discrete SERDES implementations, the integrated transceivers reduce board area by 30-40% and simplify signal-integrity validation. The 1.0 mm ball pitch allows routing on standard 6-layer FR-4 stackups with controlled-impedance differential pairs. Power consumption is dominated by the transceivers at full link utilization, so thermal analysis with the full 27 x 27 mm footprint is recommended.
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Industrial Imaging and Video Processing
Industrial camera systems and machine-vision pipelines benefit from the EP1SGX25DF672C6's combination of 25,660 LE and 1.94 Mbit embedded RAM. Designers implement Bayer-to-RGB conversion, gamma correction, edge detection, and JPEG compression directly in the FPGA fabric, offloading the host CPU. The 6 transceivers can drive Camera Link HS, CoaXPress, or custom LVDS links to downstream frame grabbers, while the 455 user I/Os interface to parallel image sensors, GPIO, and synchronization signals. The 1,944,576-bit TriMatrix memory provides line buffers and lookup tables for color-space conversion without consuming external SRAM. The commercial 0-85C operating range covers most factory-floor environments, and the lead-free 672-BGA package is compatible with standard reflow profiles. Compared to fixed-function image signal processors, this FPGA allows complete algorithm customization per product variant.
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Military and Aerospace Signal Processing
Defense and aerospace programs have historically adopted the Stratix GX family for radar signal processing, electronic warfare, and secure communication systems where the 6 multi-gigabit transceivers and 25K LE fabric provide the right balance of capacity and I/O bandwidth. The 672-BGA package supports ruggedized board assembly with underfill for high-vibration environments, and the mature silicon process offers extensive in-field reliability data. Designers implement FFT pipelines, digital down-conversion, and beamforming directly in the FPGA, with the transceivers streaming digitized RF data to and from analog front-ends. The 1.94 Mbit embedded memory supports windowing tables and intermediate sample buffers. For systems requiring wider temperature operation, the -I suffix variant EP1SGX25DF672I6 should be substituted. Compliance with ITAR export controls applies to specific part variants; sourcing through authorized distributors ensures chain-of-custody.
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Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the EP1SGX25DF672C6 to aggregate multiple high-speed data lanes into a single processing pipeline. The 6 transceivers provide enough serial bandwidth to capture 10 Gbps aggregate data streams, while the 25,660 logic elements implement trigger logic, pattern matching, and hardware-accelerated compression. The 455 user I/Os connect to front-panel displays, keypad matrices, and high-speed ADC/DAC devices on the same instrument board. Quartus II's TimeQuest timing analyzer accurately closes timing on the 1.0 mm BGA at 300 MHz internal clock rates. The 672-FBGA package's 1.0 mm pitch accommodates dense analog and digital routing on a single substrate, reducing the bill-of-materials versus two-chip FPGA-plus-GPU implementations. Engineers building automated test equipment benefit from the device's JTAG-based configuration, which supports field firmware updates over USB or Ethernet.
추천
Broadcast Video and Studio Equipment
Broadcast video routers, switchers, and contribution encoders rely on the EP1SGX25DF672C6's multi-gigabit transceivers to handle SDI over IP (SMPTE ST 2022, ST 2110) and uncompressed SDI streams up to 3 Gbps. The 25,660 logic elements implement multiviewer compositing, audio embedding/de-embedding, and ancillary data processing without external ASSPs. The 1.94 Mbit embedded memory provides frame buffers for video scaling and format conversion. With 455 user I/Os, the device connects to HDMI receivers, display port controllers, and audio CODECs via parallel LVCMOS interfaces. The commercial 0-85C temperature range and lead-free 672-BGA package meet broadcast equipment manufacturing requirements. Compared to dedicated video processors, this FPGA allows studios to support evolving codecs and IP standards through firmware updates rather than hardware replacement.
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Medical Imaging Systems
Ultrasound beamformers, CT reconstruction engines, and MRI digitizers use the EP1SGX25DF672C6 to process multiple parallel data channels with deterministic latency. The 6 transceivers aggregate data from analog front-end ADCs running at gigasample-per-second rates, while the 25K logic elements implement digital beamforming, envelope detection, and image reconstruction kernels. The 1,944,576-bit embedded memory supports channel-data ping-pong buffering during real-time processing. The 455 user I/Os connect to touch-panel interfaces, hospital-network PHYs, and storage controllers. Compliance with IEC 60601-1 medical safety standards requires careful isolation design around the 1.5 V core supply; Intel's medical reference designs include recommended bypass networks. The mature 1.5 V CMOS process offers extensive long-term-reliability data suitable for medical device qualification cycles.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF672C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF672C5N | EP1SGX25CF672C6 | EP1SGX10DF672C6N | EP1S25F672C6 |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel | Intel | Intel | Intel |
| Package | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA |
| Logic Elements | 25,660 LE | 25,660 LE | 25,660 LE | 10,570 LE | 25,660 LE (non-GX) |
| Transceiver Channels | 6 | 6 | 6 | 6 | 0 (no transceivers) |
| Max Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | N/A |
| Speed Grade | C6 | C5 (slower) | C6 | C6 | C6 |
| Total RAM Bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 940,032 bits | 1,944,576 bits |
| User I/O Count | 455 | 455 | 455 | 455 | 455 |
주요 차별점
- Embedded multi-gigabit transceivers (vs EP1S25F672C6)
- Full 25K LE density with transceivers (vs EP1SGX10DF672C6N)
- C6 speed grade for timing margin (vs EP1SGX25DF672C5N)
설계 노트
The 672-BGA package at full transceiver utilization (6 channels at 3.125 Gbps, PRBS31) dissipates approximately 4-6 W, dominated by the SERDES PMA blocks. The 27 x 27 mm package's 1.0 mm ball pitch limits direct PCB heat conduction to inner power planes; use at least a 6-layer stackup with two dedicated ground planes and continuous copper pours stitched with thermal vias under the BGA. For closed-enclosure systems, validate with worst-case industrial temperature models, since junction-to-ambient thermal resistance typically exceeds 12 C/W without airflow.
Route all 6 transceiver differential pairs with 100 ohm differential impedance on the top microstrip layer directly above an unbroken ground plane. Use 4 mil trace width and 7 mil trace spacing on standard 8 mil FR-4 prepreg to hit the 100 ohm target. Add ground stitching vias every 200 mil along the pair edges and at every layer transition. The reference clock input pins require the same controlled-impedance treatment, with series AC coupling capacitors placed within 250 mil of the FPGA ball.
Stratix GX power-on sequencing requires VCCINT (1.5 V) to ramp before or simultaneously with VCCPD, with no more than 200 mV of reverse current at any time. Failure to follow the sequencing diagram in the datasheet can cause long-term reliability degradation. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins before VCCINT ramps - leaving these pins floating triggers undefined behavior. Use the dedicated CLR/reset pulse of at least 10 us after configuration completes before releasing user I/O.
Separate analog and digital ground domains with a single-point tie under the BGA center to avoid ground-loop noise coupling into the transceiver analog supply pins. The transceiver PLL analog supply (VCCHIP) requires its own LC filter network with 1 uH ferrite and 10 uF + 0.1 uF decoupling. Keep all 672 balls' decoupling capacitors within 100 mil of their respective power pins; missing bulk decoupling is the most common cause of intermittent transceiver link failures in production.
규정 준수 정보
Lead-free per FBGA suffix family (DF/FineLine). RoHS and REACH compliant per Altera/Intel product documentation. Not AEC-Q100 qualified (commercial/industrial grade FPGA). Intel is a member of the Responsible Minerals Initiative.
