EP20K1000CF672I9 - APEX 20KC 1M-Gate FPGA, 672-BGA | Intel
부품 번호: EP20K1000CF672I9 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265.5 | $2,655.00 |
| 100 | $240 | $24,000.00 |
| 500 | $218.4 | $109,200.00 |
| 1,000 | $195 | $195,000.00 |
EP20K1000CF672I9 개요
An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device in the programmable-logic IC hierarchy, sitting between complex PLDs and full custom ASICs. The APEX 20KC family combines Look-Up-Table (LUT)-based logic, embedded system blocks (ESBs) for memory and product-term logic, and a continuous, SRAM-based interconnect fabric, allowing designers to implement glue logic, datapath, memory, and bus interfaces on a single device. Positioned between CPLDs and structured ASICs, APEX 20KC was used in networking, telecom, and DSP-heavy designs of its era.
Key features of the EP20K1000CF672I9 include 1,000,000 typical gates, 38,400 logic cells, 250 MHz internal performance, embedded array blocks for distributed RAM and ROM, and MultiVolt I/O support for interfacing with 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic. The 'I' speed grade and industrial temperature suffix (-40 °C to +85 °C) suit industrial embedded applications. The 672-ball FineLine BGA package provides high board density and ample signal breakout for the 508 I/O count.
Architecturally, the device uses a four-level hierarchical interconnect (MegaLAB, LAB, ESB, LE) with dedicated carry chains and cascade paths for arithmetic and high-speed datapath operations. Each embedded system block can be configured as a dual-port RAM, FIFO, or CAM, providing up to 540 Kibits of embedded memory without consuming logic resources. The 0.15 µm CMOS process was Intel's high-density node for APEX generation devices.
Typical applications include high-speed data-path bridging, telecom backplane interfaces, DSP co-processing cards, industrial control boards, and ASIC prototyping. The high logic capacity and embedded memory make it suitable for multi-channel protocol converters, RAID controllers, and legacy networking line-card designs where pin compatibility with the APEX 20K family is required.
When designing with the EP20K1000CF672I9, plan for multi-rail power sequencing (1.8 V core plus I/O banks), provide a JTAG header for in-system programming, and follow Altera AN-114 (Guidelines for APEX 20K Board Layout) for BGA escape and decoupling. The 672-ball FC-FBGA requires a 4-6 layer PCB with microvia or via-in-pad fan-out to maintain signal integrity at high toggle rates.
This page synthesizes distributor pricing, APEX 20KC drop-in alternatives from the same family, and practical board-layout guidance not aggregated on a single manufacturer page, helping engineers source and integrate this legacy FPGA quickly.
드롭인 대체품: EP20K1000CF672I9 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K1000CF672I9 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K1000CF672I8N
✅ 드롭인✓ 재고 있음
$198.4 / 개
데이터시트 보기 →EP20K1000CF672I8
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K1000CF672I7
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K1000CF672C9N
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K1000CF672C9ES
✅ 드롭인✓ 재고 있음
$385 / 개
데이터시트 보기 →EP20K1000CF672C8N
✅ 드롭인✓ 재고 있음
$178.4 / 개
데이터시트 보기 →EP20K1000CF672I9 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Typical Gates | 1,000,000 |
| Logic Elements (LEs) | 38,400 |
| Maximum User I/O | 508 |
| Dedicated Inputs | 4 |
| Embedded System Blocks (ESBs) | Available (RAM/ROM/CAM) |
| Core Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| Process Technology | 0.15 µm CMOS, SRAM-based |
| Internal Performance | 250 MHz |
| 동작 온도 | -40 °C to +85 °C (industrial) |
| 패키지 | 672-ball FC-FBGA (FineLine BGA) |
| 실장 유형 | Surface Mount (BGA) |
| MultiVolt I/O Support | 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Speed Grade | I (industrial, 9 suffix) |
| Configuration Method | SRAM (volatile, requires config device) |
EP20K1000CF672I9 672-ball fc-fbga (fineline bga) 핀 구성 가이드
EP20K1000CF672I9(672-ball fc-fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K1000CF672I9.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K1000CF672I9 적합 용도: 6 애플리케이션s: Telecom Backplane Interface, DSP Co-Processing Card, Industrial Control / Factory Automation, ASIC Prototyping, Multi-Channel Protocol Converter, Legacy Networking Line Card.
Telecom Backplane Interface
The EP20K1000CF672I9 fits telecom backplane bridging because its 1,000,000 system gates and 38,400 LEs can absorb wide parallel bus protocols and serial-to-parallel conversion logic on a single device. The 508 user I/O plus MultiVolt support lets it bridge 5 V legacy bus transceivers to 3.3 V / 2.5 V framers without external level shifters. Embedded System Blocks configured as dual-port RAM provide 540 Kibits of packet buffering, while the 250 MHz internal performance sustains 100+ MHz wide-bus throughput. Designers place the device between line-card PHY ASICs and the switch-fabric backplane, with JTAG for in-system reprogrammability.
추천
DSP Co-Processing Card
The EP20K1000CF672I9 is well-suited for DSP co-processing boards where host DSPs offload FIR/FFT pipelines. Its 38,400 LEs implement hundreds of 18x18 multipliers as soft logic, and the 250 MHz internal performance supports 100 MHz datapath clocks. The 1.8 V core plus MultiVolt I/O lets the FPGA connect directly to 3.3 V DSP host buses. Embedded System Blocks deliver zero-wait-state scratch RAM for coefficient storage. The 672-ball FC-FBGA provides enough I/O to expose dual 64-bit host ports plus four serial RapidIO links, fitting VME/CompactPCI payload cards.
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Industrial Control / Factory Automation
The EP20K1000CF672I9 supports factory-automation controllers with its industrial -40 °C to +85 °C temperature range and high I/O count for multi-axis motor control. Its 38,400 LEs implement up to 12 PID loops, encoder counters, and fieldbus protocol stacks (Profibus, CANopen) on one device. The 508 I/O drive 5 V optocoupler interfaces directly via MultiVolt without level shifters, simplifying safety-isolated designs. The 672-ball FC-FBGA withstands industrial vibration environments better than QFP. Legacy factories keep this part in service because long-running PLC programs are tied to APEX 20KC bitstreams.
추천
ASIC Prototyping
The EP20K1000CF672I9 is commonly used for ASIC prototyping where designers map million-gate ASICs into a single FPGA for pre-silicon validation. Its 1,000,000 typical gates accommodate medium-complexity SoCs, and the SRAM-based fabric allows rapid RTL revisions. Embedded System Blocks model SRAM macros, dual-port register files, and CAMs that ASIC designers expect to see at-speed. MultiVolt I/O bridges 5 V / 3.3 V / 1.8 V ASIC pad libraries to standard testbench instrumentation. The 672-ball FC-FBGA exposes enough I/O for full ASIC-pin visibility plus JTAG and trace ports.
추천
Multi-Channel Protocol Converter
The EP20K1000CF672I9 fits protocol-converter cards that bridge UART, SPI, I2C, and parallel buses to Ethernet or USB. Its 38,400 LEs implement multiple soft-core CPUs (Nios or custom), while the 508 I/O fan out to dozens of peripheral channels. Embedded System Blocks configured as FIFOs decouple channels with different clock domains. MultiVolt I/O lets one FPGA interface both 5 V RS-232 transceivers and 3.3 V / 1.8 V application processors. The industrial temperature grade makes it suitable for outdoor telecom and transportation protocol-conversion boxes.
추천
Legacy Networking Line Card
The EP20K1000CF672I9 powers legacy router and switch line cards where the original design used APEX 20KC and the OEM needs lifecycle support. Its 1,000,000 gates implement forwarding engines, ACL tables, and queue managers, while 508 I/O connect to PHY chips and switch fabric ASICs. MultiVolt I/O bridges 5 V / 3.3 V legacy PHYs to 2.5 V fabric ASICs. The 672-ball FC-FBGA fits the original line-card footprint, eliminating the need for board rework. The SRAM fabric is in-system reprogrammable, so network operators can field-upgrade bitstreams without RMA.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K1000CF672I9 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K1000CF672I8N | EP20K1000CF672I8 | EP20K1000CF672I7 | EP20K1000CF672C9N | EP20K1000CF672C9ES | EP20K1000CF672C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Typical System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Speed Grade | I9 (industrial, fastest I-grade) | I8 (slower than I9 by ~5%) | I8 (slower than I9 by ~5%) | I7 (slower than I9 by ~10%) | C9 (matches I9 timing) | C9 ES variant | C8 (slower than I9 by ~5%) |
| Operating Temperature | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Core Voltage | 1.71 V to 1.89 V (1.8 V nominal) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status (2026-09-07) | Last-Time-Buy | Obsolete (older speed grade) | Obsolete (older speed grade) | Obsolete (oldest industrial grade) | Obsolete (commercial) | Obsolete (engineering sample) | Obsolete (commercial) |
주요 차별점
- I9 speed grade = fastest industrial-grade timing in the APEX 20KC 1M family (vs EP20K1000CF672I8N)
- Industrial -40 °C to +85 °C temperature range (vs 0 °C to +85 °C commercial) (vs EP20K1000CF672C9N)
- 1,000,000 typical gates - highest density in the APEX 20KC 672-ball family (vs EP20K1000CF672C7GZ)
설계 노트
The EP20K1000CF672I9 requires a 1.8 V core rail plus one or more I/O bank voltages (1.8 V / 2.5 V / 3.3 V / 5.0 V via MultiVolt). Power sequencing must follow Altera AN-114: bring up VCCINT (1.8 V core) before or simultaneously with VCCIO banks. A bulk 220 µF tantalum plus 10 µF ceramic decoupling near each supply pin suppresses FPGA inrush transients during configuration. Estimated core current at 250 MHz with 100% utilization is 1.5-2 A; design the 1.8 V regulator for 3 A peak for margin.
The 672-ball FC-FBGA at 1.0 mm pitch requires a 4-6 layer PCB with microvia escape. Per Altera AN-114, fan-out the BGA with 8-mil via-in-pad microvias on the top layer and route signals on inner layers. Provide a continuous ground plane under the device to control return paths for 100+ MHz LVTTL signals. JTAG pins (TCK, TMS, TDI, TDO, TRST) must be brought out to a 2x5 or 1x10 header for in-system programming with a ByteBlaster or USB-Blaster download cable.
Estimated: APEX 20KC devices use SRAM-based configuration, so the bitstream is volatile - the device loses configuration on power-down and must be reloaded from a configuration EPROM (EPC16 or EPC2) on each power-up. Do not leave MSEL pins floating - they select configuration mode (AS, AP, PS, JTAG) and incorrect strapping leaves the device in an undefined state. The CONF_DONE pin must be pulled high with a 10 kΩ resistor and monitored by the system reset logic.
규정 준수 정보
RoHS/REACH/lead-free status not specified in the verified web data for EP20K1000CF672I9; the APEX 20KC family predates widespread RoHS adoption, so many variants are non-RoHS. AEC-Q100 is not applicable because the device is a general-purpose FPGA, not an automotive-grade IC.