EP1SGX25DF1020I5N - Stratix GX FPGA 25K LEs, 1.5V, FC-FBGA-1020 | Intel
부품 번호: EP1SGX25DF1020I5N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1285 | $1,285.00 |
| 5 | $1199.5 | $5,997.50 |
| 10 | $1140 | $11,400.00 |
| 25 | $1075 | $26,875.00 |
| 100 | $985 | $98,500.00 |
EP1SGX25DF1020I5N 개요
What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and high-speed I/O that engineers can reconfigure via an HDL bitstream. FPGAs sit within the broader semiconductor hierarchy as application-specific programmable logic, distinct from fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose microcontrollers. The Stratix GX family specifically targets high-speed serial interconnect applications where hardware parallelism and deterministic latency are essential.
Key features include embedded transceiver channels with clock-data recovery, dedicated PMA and PCS blocks per channel, on-chip phase-locked loops for multiple reference clock domains, and a TriMatrix memory architecture for distributed and block RAM. The high-speed differential I/O and low-jitter transceiver physical layer are tuned for backplane and chip-to-chip serial links.
Architecturally, the device combines a transceiver-rich edge with a programmable fabric optimized for protocol bridging, channel aggregation, and physical-layer adaptation. Hard IP cores reduce logic footprint for PCI Express ×1/×4 endpoints, XAUI, and SerialLite II, freeing fabric resources for application logic, while the 1.0 mm pitch BGA package preserves signal integrity for multi-gigabit serial channels.
Typical applications include high-speed serial bridge cards, telecom backplane aggregation, network interface controllers, test and measurement equipment, broadcast video routers, and embedded prototyping for proprietary serial protocols. Designers select this device when deterministic, low-latency serial I/O and proven transceiver silicon are required in production-grade hardware.
When designing with the EP1SGX25DF1020I5N, use the Altera Quartus II design suite (or its Stratix GX support package) for synthesis, place-and-route, and bitstream generation. Maintain controlled impedance for all serial channels, follow the Stratix GX handbook reference for PCB stack-up and decoupling, and respect the 1.0 mm BGA fanout and via-in-pad recommendations for clean multi-gigabit signal integrity.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix GX family, and practical design considerations not found in the manufacturer datasheet, helping engineers source a usable configuration for legacy Stratix GX designs.
드롭인 대체품: EP1SGX25DF1020I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020I5N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Package Type, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25DF1020I5
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX25DF1020C7ES
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP1SGX25DF1020C7
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP1SGX25DF1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020I5N 최대 정격 & 전기적 특성
| Logic Family | Stratix GX (FPGA) |
| Process Technology | 130 nm CMOS |
| Logic Elements / Cells | 25,660 |
| Core Supply Voltage | 1.5 V |
| 동작 온도 | 0 °C to 85 °C (industrial) |
| Package Type | FC-FBGA (Flip-Chip FineLine BGA) |
| Pin / Ball Count | 1,020 |
| Package Dimensions | 33 × 33 mm, 1.0 mm pitch |
| Transceiver Channels | Up to 20 CDR-based full-duplex channels |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Aggregate Serial Bandwidth | Up to 127.5 Gbps full-duplex |
| Hard IP Protocols | PCI Express, SerialLite II, XAUI, Serial RapidIO |
| 실장 유형 | Surface Mount |
| Lead Free | Yes |
| RoHS 상태 | Compliant (per distributor data) |
EP1SGX25DF1020I5N 33 × 33 mm, 1.0 mm pitch 핀 구성 가이드
EP1SGX25DF1020I5N(33 × 33 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020I5N 적합 용도: 6 애플리케이션s: PCI Express Endpoint Card, Telecom Backplane Aggregation, Test and Measurement Equipment, Broadcast Video Router, Network Interface Controller Card, Serial Protocol Bridge / FPGA Mezzanine Card.
PCI Express Endpoint Card
The EP1SGX25DF1020I5N is well suited for PCI Express endpoint cards in server, storage, and instrumentation applications. Its integrated CDR-based transceivers operating at 2.5 Gbps implement the PCIe Gen1 physical layer natively, while the hard PCI Express IP block (with x1 and x4 lane support) frees the 25,660-logic-element fabric for application-layer processing. The 1,020-ball FC-FBGA package exposes sufficient transceiver and general-purpose I/O to add a x4 Gen1 endpoint plus auxiliary GPIO for board management. Designers benefit from deterministic latency and the predictable timing closure of a hard PCIe IP core compared with soft IP running in fabric.
추천
Telecom Backplane Aggregation
Use the EP1SGX25DF1020I5N for telecom backplane aggregation cards that bridge multiple serial protocols. The device's 20 CDR transceivers at up to 3.1875 Gbps comfortably aggregate XAUI, SerialLite II, and Serial RapidIO links side-by-side, while the 25,660 LEs provide ample logic for traffic managers and cross-connect fabrics. The 1,020-ball FC-FBGA preserves signal-integrity headroom for multi-gigabit backplane routing with controlled-impedance striplines. Designers can run multiple protocol engines concurrently because the hard IP cores consume no soft logic resources, dramatically simplifying timing closure.
추천
Test and Measurement Equipment
The EP1SGX25DF1020I5N is a strong fit for test and measurement front ends, including serial bus analyzers, protocol exercisers, and multi-channel digitizers. Up to 20 multi-gigabit transceivers let the same FPGA capture and generate several lanes of high-speed serial traffic simultaneously, while the 25,660 LEs implement stimulus generation, response checking, and on-chip statistics. Industrial 0 °C to 85 °C operation supports lab and factory-floor environments without thermal derating. The 1,020-ball FC-FBGA package exposes the required reference-clock and trigger pins needed for deterministic multi-channel capture.
추천
Broadcast Video Router
In broadcast video routers, the EP1SGX25DF1020I5N serves as a non-blocking crosspoint controller and serial gateway for SDI-over-IP and proprietary video links. The 20 transceivers aggregate multiple uncompressed video streams while the 25,660 LEs provide the crosspoint switching matrix and embedded frame-buffer memory. Industrial temperature rating and lead-free FC-FBGA-1020 packaging suit long-life broadcast installations. Designers reuse Quartus II reference designs for HD-SDI and 3G-SDI bridges to shorten development time and reduce BOM risk in professional video equipment.
추천
Network Interface Controller Card
The EP1SGX25DF1020I5N functions as the heart of multi-protocol network interface cards (NICs), converting Ethernet, XAUI, and SerialLite II traffic to a host bus. Its hard IP cores handle XAUI at 3.125 Gbps per lane without consuming fabric logic, leaving 25,660 LEs free for protocol adaptation, MAC functions, and statistics engines. The 1,020-ball FC-FBGA footprint provides enough I/O to drive external memory and a host-side PCIe link simultaneously. Industrial temperature operation makes the device usable in telco-grade NICs that must operate in loosely controlled environments.
추천
Serial Protocol Bridge / FPGA Mezzanine Card
Use the EP1SGX25DF1020I5N on FPGA mezzanine cards (FMCs) that bridge custom serial links to standard backplanes or processors. The transceiver-rich fabric and 1,020-ball FC-FBGA package make it ideal for FMC designs that need up to 20 multi-gigabit lanes plus abundant general-purpose I/O. Engineers can load different bitstreams to repurpose the card for Serial RapidIO, XAUI, or proprietary protocols, maximizing reuse across programs. The 1.5 V core supply is compatible with the standard Stratix GX power architecture documented in Altera reference designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C7N | EP1SGX25DF1020I5 | EP1SGX25DF1020C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) |
| Temperature Grade | Industrial (0 C to 85 C) | Commercial (0 C to 70 C) | Industrial (0 C to 85 C) | Commercial (0 C to 70 C) |
| Speed Grade | -5 | -7 | -5 | -6 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| RoHS Compliant | Yes | Yes | Yes | Yes |
주요 차별점
- Industrial 0 C to 85 C temperature grade at speed grade -5 (vs EP1SGX25DF1020C7N)
- Same-package drop-in option in higher speed grade -5 (vs EP1SGX25DF1020C6N)
- Higher density than EP1SGX10 with same transceiver family (vs EP1SGX10DF672C7)
설계 노트
Maintain controlled 100 ohm differential impedance for all transceiver channels on PCB. Use the Stratix GX Device Handbook reference stack-up with low-loss dielectric for 3.125 Gbps XAUI and SerialLite II signaling. The 1.0 mm pitch BGA requires via-in-pad or microvia fanout to preserve signal integrity on multi-gigabit lanes; follow Altera reference layouts to avoid skew between the P and N half of a differential pair.
Use the Stratix GX power distribution network documented in Altera application notes: dedicated 1.5 V core rail plus separate supplies for PLL analog, transceiver PMA, and I/O banks. Place decoupling capacitors close to the BGA balls, and use a power plane cutout to isolate noisy switching currents from the analog PLL supply. Without proper decoupling, transceivers will exhibit elevated jitter and reduced eye margin.
The 1,020-ball FC-FBGA has a relatively large thermal envelope, but transceiver-rich designs can still dissipate significant power under heavy channel utilization. Estimated: with 20 channels active at 3.125 Gbps and 25% toggle rate, total device power is roughly 8 to 12 W, requiring a thermal interface material or heatsink for industrial 0 C to 85 C operation. Always validate with the Quartus II PowerPlay analyzer.
Do not mix EP1SGX25 DF and CF package variants on the same PCB footprint; the CF672 and DF1020 packages are NOT pin-compatible. For transceiver-based designs, ensure reference-clock jitter meets the requirements in the Stratix GX handbook, and avoid routing noisy signals across transceiver channel pins. Finally, do not assume commercial-grade -C7 parts satisfy industrial spec; for 0 C to 85 C environments select -I5 or -I6 variants only.
규정 준수 정보
RoHS compliant and lead free per distributor listings. AEC-Q100 not applicable for an FPGA. REACH and halogen status were not confirmed in the provided web data; designers requiring these should request documentation from the supplier.
