EP20K400CF672C9N - APEX 20KC 400K Gates FPGA | Intel (Altera)
부품 번호: EP20K400CF672C9N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP20K400CF672C9N 개요
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy: ASIC -> programmable SoC -> FPGA -> CPLD -> PLD. APEX 20KC devices in particular introduced copper interconnect to Altera's high-density PLD roadmap, providing 25-35% higher performance than the APEX 20KE family while remaining pin-compatible.
Key features include 16,640 logic elements, 212,992 bits of embedded memory distributed across embedded system blocks, 502 user I/O pins, and propagation delay of approximately 2.5 ns per logic element. The MultiCore architecture integrates LUT-based logic and dual-port RAM blocks within the same fabric, allowing designers to implement complex state machines, FIFOs, and datapath functions without external memory.
The APEX 20KC family is built on a 0.18-micron six-layer copper-metal CMOS process. The 1.8V core supply reduces power consumption compared with the 2.5V APEX 20KE family while supporting LVCMOS, LVTTL, SSTL, and HSTL I/O standards through configurable I/O banks. The Fine-pitch Chip-Scale BGA package maximizes logic-to-pin density for high-I/O designs.
Typical applications include telecommunications infrastructure, high-speed data buffering, glue logic replacement, protocol bridging, and digital signal processing front-ends. The combination of high logic density and substantial embedded memory makes the EP20K400CF672C9N well suited to data-path aggregation and packet-processing pipelines.
When designing with this device, plan power sequencing carefully. The 1.8V core requires a low-noise LDO such as a TPS7A4701; the I/O banks need separate 3.3V or 2.5V rails depending on the chosen I/O standard. Decoupling capacitors must be placed as close as possible to each power pin on the BGA.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical FPGA design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: EP20K400CF672C9N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400CF672C9N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Propagation Delay, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400CF672C9
✅ 드롭인✓ 재고 있음
$390.4 / 개
데이터시트 보기 →EP20K400CF672C8N
✅ 드롭인✓ 재고 있음
$68.4 / 개
데이터시트 보기 →EP20K400CF672C7N
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K400CF672C9ES
✅ 드롭인✓ 재고 있음
$168 / 개
데이터시트 보기 →EP20K400CF672C8
✅ 드롭인✓ 재고 있음
$108 / 개
데이터시트 보기 →EP20K400CF672C8ES
✅ 드롭인✓ 재고 있음
$158.4 / 개
데이터시트 보기 →EP20K400CF672C9N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Series | EP20K400 |
| Logic Elements | 16,640 |
| System Gates | 400,000 |
| Maximum Operating Frequency | 250 MHz |
| Propagation Delay | 2.5 ns |
| User I/O Pins | 502 |
| Total I/O Lines | 480 |
| Dedicated Inputs | 4 |
| Embedded Memory | 212,992 bits |
| Core Voltage | 1.8 V |
| Process Technology | 0.18 µm all-layer copper CMOS |
| 패키지 | 672-ball FC-FBGA |
| 동작 온도 | 0 °C to 85 °C (commercial) |
| RoHS 상태 | Compliant |
EP20K400CF672C9N 672-ball fc-fbga 핀 구성 가이드
EP20K400CF672C9N(672-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400CF672C9N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400CF672C9N 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, High-Speed Data Buffering and FIFO Aggregation, Glue Logic Replacement and Board Integration, Industrial Control and Factory Automation, Legacy Compute System / PCI Bridge Logic, Test and Measurement Equipment Front-End.
Telecommunications Infrastructure
The EP20K400CF672C9N's 16,640 logic elements and 502 user I/Os make it well suited to telecom backplane bridging, where wide parallel buses, ATM/SONET framers, and TDM switching fabrics need high gate counts and abundant I/O. Its 1.8V core and 250 MHz fabric deliver enough throughput for OC-48 framing glue logic, while the FC-FBGA 672-ball footprint supports the many LVDS pairs typically required for backplane serial links. Designers place the part on a multi-layer PCB with split power planes and per-bank VCCIO for 3.3V/2.5V/1.8V I/O standards.
추천
High-Speed Data Buffering and FIFO Aggregation
With 212,992 bits of embedded memory distributed across ESBs (Embedded System Blocks), the EP20K400CF672C9N can implement large multi-channel FIFOs and packet buffers without external SRAM. The MultiCore architecture combines LUT logic with dual-port RAM in the same fabric, so designers can build 36-bit-wide FIFOs and store-and-forward datapaths in a single device. The 250 MHz fabric clock and 2.5 ns propagation delay support line-rate aggregation of multiple parallel data streams in networking line cards.
추천
Glue Logic Replacement and Board Integration
The EP20K400CF672C9N replaces multiple discrete PAL/GAL and 74-series glue-logic devices on legacy backplanes, integrating address decoding, bus arbitration, wait-state generation, and interrupt steering in a single programmable IC. Its 502 user I/Os accommodate many parallel interfaces simultaneously, and its 1.8V core reduces board power. The 672-ball FC-FBGA package suits high-density backplanes where board real-estate is constrained.
추천
Industrial Control and Factory Automation
Industrial controllers benefit from the EP20K400CF672C9N's large gate count and many I/Os to integrate multi-axis motion control, encoder decoding, and high-speed machine-vision preprocessing. The commercial 0-85 °C operating range suits factory-floor enclosures with controlled climate, and the abundant I/O allows direct connection to quadrature encoders, stepper/direction drivers, and parallel ADC/DAC buses without external buffers.
추천
Legacy Compute System / PCI Bridge Logic
Before modern soft-IP cores, the APEX 20KC family was commonly deployed as a PCI-to-local-bus bridge and DMA controller in single-board computers and embedded x86 designs. The EP20K400CF672C9N's 502 I/Os accommodate 32-bit PCI plus local bus plus auxiliary peripherals in one device. The 1.8V core, 250 MHz fabric, and 2.5 ns internal delay allow zero-wait-state bridges up to 66 MHz PCI.
추천
Test and Measurement Equipment Front-End
Test-equipment manufacturers used the EP20K400CF672C9N as a digital pattern generator, timing engine, or waveform pre-processor in bench-top instruments. Its 16,640 logic elements and high I/O count allow hundreds of digital channels with per-channel timing control, while embedded memory supports deep capture buffers. The 672-ball FC-FBGA package routes cleanly to fine-pitch test connectors and high-density mixed-signal daughtercards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K400CF672C9N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400CF672C9 | EP20K400CF672C8N | EP20K400CF672C7N | EP20K400CF672C9ES | EP20K400CF672C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| User I/Os | 502 | 502 | 502 | 502 | 502 | 502 |
| Speed Grade | -9 (C9) | -9 | -8 (~10% slower) | -7 (~20% slower) | -9 ES | -8 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest speed grade in the EP20K400 family (vs EP20K400CF672C8N)
- Lead-free and Pb-free terminal finish (N suffix) (vs EP20K400CF672C9)
- Same-footprint compatibility with the APEX 20KE family (vs EP20K400EFC672-1N)
설계 노트
The APEX 20KC family requires a low-noise 1.8V core supply for VCCINT plus independently configurable VCCIO rails per I/O bank (commonly 3.3V, 2.5V, or 1.8V). Use a low-dropout regulator such as the TPS7A4701 for VCCINT and per-bank LDOs (e.g., TPS73633) for VCCIO. Bulk-decoupling with 100 µF tantalum plus 0.1 µF/10 nF ceramics per power pin is recommended. Estimated: at full toggle rate with 502 I/Os switching, the device can draw 1.5-2.5 A from VCCINT.
The 672-ball FC-FBGA package uses 1.0 mm ball pitch and requires microvia or via-in-pad technology for reliable breakout. Place at least one 0402 decoupling cap per power pin on the opposite PCB side directly under the BGA array. Use a 1 oz copper power plane for VCCINT and split VCCIO planes per bank to isolate noise. Maintain a continuous ground plane on layer 2 to provide low-impedance return paths for high-speed LVDS pairs.
Do not confuse the APEX 20KC (C-suffix, 1.8V core) with the APEX 20KE (E-suffix, 2.5V core). Although the 672-ball FC-FBGA pinout is shared between families, the core voltage and configuration bitstream are not interchangeable - applying 2.5V to a C-suffix part will damage it. Also confirm that the configuration device (typically an EPC2 or EPC16) matches the chosen speed grade, otherwise JTAG configuration may fail intermittently at temperature extremes.
규정 준수 정보
The 'N' suffix in EP20K400CF672C9N indicates a Pb-free (lead-free) terminal finish compliant with RoHS. The part is now obsolete and not recommended for new designs; commercial 0-85 °C temperature grade only. AEC-Q100 is not applicable since this is an FPGA, not a discrete automotive IC.