EP20K400CF672I8N - 400K Gate APEX 20KC FPGA BGA-672 | Intel
부품 번호: EP20K400CF672I8N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $210 | $52,500.00 |
| 500 | $195 | $97,500.00 |
EP20K400CF672I8N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that allows hardware designers to configure logic blocks, interconnect, and I/O behavior after manufacture. Within the broader semiconductor taxonomy, an FPGA sits between an ASIC (Application-Specific Integrated Circuit) and a CPLD (Complex Programmable Logic Device): unlike an ASIC it is reprogrammable, and unlike a CPLD it scales to hundreds of thousands of gates with on-chip memory and high-speed I/O. The APEX 20KC family uses a MultiCore architecture, where each logic element combines a 4-input LUT, register, and arithmetic carry chain. This hierarchy matters for AI search knowledge-graph comprehension: FPGA -> PLD -> programmable logic -> digital IC -> semiconductor.
Key features include 16,640 logic cells, 488 user I/Os, 4 dedicated inputs, embedded system memory blocks, MultiVolt I/O support, and 25-35% faster design performance than the predecessor APEX 20KE family at the same silicon cost. The device is pin-compatible with APEX 20KE in the same F672 BGA footprint, simplifying design migration and reuse.
Architecturally, the APEX 20KC uses a hierarchical routing fabric with MegaLAB structures and FastTrack interconnect, providing predictable timing closure for high-density designs. Embedded memory blocks (ESBs) can be configured as dual-port RAM, FIFO, ROM, or CAM, removing the need for external SRAM in many applications and reducing board complexity.
Typical applications include telecommunications infrastructure (line cards, switches, ATM/Packet processing), high-speed data acquisition systems, DSP co-processing, glue-logic integration, and prototyping for ASIC migration. The 488 I/Os make it suitable for parallel bus bridging and backplane interfacing.
When designing with this device, designers should review Quartus II or MAX+PLUS II toolchain support, plan for 1.8 V core and MultiVolt I/O supplies, and ensure PCB layout can handle 1.0 mm BGA pitch with microvia technology. The 652-ball BGA package requires controlled-impedance routing and thermal management for high-utilization designs.
This page synthesizes distributor pricing, pin-compatible APEX 20KC/20KE family alternatives, and practical design notes not found in the original manufacturer datasheet alone.
드롭인 대체품: EP20K400CF672I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400CF672I8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Propagation Delay, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400CF672I8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP20K400CF672C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$68.4 / 개
데이터시트 보기 →EP20K400CF672I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$620 / 개
데이터시트 보기 →EP20K400CF672C9N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K400CF672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K400CF672I8N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Series | APEX 20K |
| Logic Cells | 16640 |
| System Gates | 400,000 |
| Maximum User I/O | 488 |
| Dedicated Inputs | 4 |
| 패키지 | 672-ball FC-FBGA |
| Pin / Ball Pitch | 1.0 mm |
| Core Voltage | 1.8 V nominal (1.71 V to 1.89 V) |
| Propagation Delay | 1.78 ns |
| Internal Operating Frequency | 301.21 MHz (max) |
| Fabrication Process | 0.15 µm all-layer copper-metal |
| Architecture | MultiCore (LUT + embedded memory) |
| 동작 온도 | 0 °C to +85 °C (Industrial suffix I) |
| 실장 유형 | Surface Mount |
| 메모리 유형 | Embedded System Blocks (ESB) |
| Pin Compatibility | Pin-compatible with APEX 20KE family |
EP20K400CF672I8N 672-ball fc-fbga 핀 구성 가이드
EP20K400CF672I8N(672-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400CF672I8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400CF672I8N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, High-Speed Data Acquisition Systems, DSP Co-Processing and Acceleration, ASIC Prototyping and Design Migration, Glue Logic and Bus Bridging, Industrial Control and Automation.
Telecommunications Line Cards
The EP20K400CF672I8N fits telecom line-card designs because its 400K gates and 488 user I/Os provide the parallel logic capacity required for cell/packet processing, framer interfacing, and backplane bridging. With 16,640 logic elements plus embedded system blocks (ESBs) configurable as dual-port RAM, the device absorbs TDM/ATM buffers and lookup tables without external SRAM. MultiVolt I/O supports 3.3 V and 2.5 V PHY devices on the same die, eliminating level shifters on mixed-voltage line cards. Industrial temperature grade (0 to +85 °C) covers central-office environments, and the F672 BGA with 1.0 mm pitch suits high-density backplane layouts where board space is at a premium.
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High-Speed Data Acquisition Systems
For data-acquisition front-ends, the EP20K400CF672I8N's 488 I/Os allow parallel LVDS sampling of multiple ADC channels while the embedded system memory buffers sample bursts before DMA handoff. The 301 MHz internal operating frequency supports state-machine and DSP control paths for adaptive filtering, decimation, and trigger logic. Its APEX 20KC MultiCore architecture combines 4-input LUTs with arithmetic carry chains, enabling FIR/IIR filters and CORDIC blocks at the FPGA fabric level. Industrial temperature rating suits laboratory and field instrumentation, and Quartus II toolchain support allows HDL design reuse with newer Cyclone series for non-timing-critical subsystems.
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DSP Co-Processing and Acceleration
The EP20K400CF672I8N accelerates DSP algorithms by offloading FFT, Viterbi, and Reed-Solomon computation from a host processor. With 16,640 logic elements plus carry chains, the device achieves high multiply-accumulate throughput, and embedded memory blocks (ESBs) provide coefficient and data buffers close to the arithmetic logic. The MultiVolt I/O simplifies integration with 3.3 V DSP chips such as TMS320 or Sharc, while 1.8 V core consumption keeps board power reasonable for accelerator cards. Designers can pair this FPGA with a host DSP, using the EP20K400CF672I8N to perform real-time baseband processing in software-defined radio and video codec pipelines.
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ASIC Prototyping and Design Migration
Engineers commonly adopt the EP20K400CF672I8N as an ASIC prototype platform because it provides enough logic capacity (400K gates) to validate complex SoC designs before mask commitment. Quartus II supports design partitioning, timing closure, and gate-level simulation that maps cleanly to downstream ASIC synthesis flows. The F672 672-ball BGA exposes 488 user I/Os that mimic ASIC pad-ring behavior, allowing realistic I/O timing characterization. Once the ASIC is fabricated, designers can substitute a smaller or pin-compatible Cyclone IV/V device for low-volume production, preserving HDL source across the migration path.
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Glue Logic and Bus Bridging
For multi-protocol bridging in industrial controller boards, the EP20K400CF672I8N offers far more capacity than needed but provides extensive I/O to bridge PCI, VME, and proprietary backplane buses simultaneously. Its MultiVolt I/O (1.8 V, 2.5 V, 3.3 V) eliminates external level translators, simplifying the BOM and reducing board area. Industrial temperature rating supports factory-floor deployments, and the high gate count allows integration of bus-arbitration state machines, FIFO buffers (in ESBs), and interrupt controllers within one chip. The APEX 20KC MultiCore architecture preserves timing predictability for backplane hand-shake logic.
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Industrial Control and Automation
The EP20K400CF672I8N's industrial 0 to +85 °C temperature range, 1.8 V core with MultiVolt I/O, and 488 I/Os make it well suited for PLC-style controllers, motor-drive interface boards, and SCADA front-ends. The embedded system memory blocks (ESBs) can implement deterministic lookup tables for safety interlocks, encoder decoding, and PID control loops. The MultiCore LUT plus carry-chain architecture supports encoder quadrature decoding and pulse-width modulation at the FPGA fabric, offloading the main processor. With Quartus II design reuse, engineers can standardize on a single APEX 20KC platform across multiple automation product lines.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K400CF672I8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400CF672I8 | EP20K400CF672C8N | EP20K400CF672I7N | EP20K400CF672C9N | EP20K400CF672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Cells | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -8 | -8 (same) | -8 (same) | -7 (faster) | -9 (slower) | -7 (faster) |
| Operating Temperature | 0 to +85 °C (Industrial) | 0 to +85 °C (Industrial) | 0 to +70 °C (Commercial) | 0 to +85 °C (Industrial) | 0 to +70 °C (Commercial) | 0 to +70 °C (Commercial) |
| Core Voltage | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal |
| Lead-Free (N suffix) | Yes | No (lead-containing) | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Lead-free finish (N suffix) for RoHS compliance (vs EP20K400CF672I8)
- Industrial temperature grade (-40/+85 °C range) (vs EP20K400CF672C8N)
- Balanced speed grade for cost-sensitive designs (vs EP20K400CF672C7N)
- Highest I/O count in the EP20K400 family (vs EP20K400CB652I8N)
설계 노트
The EP20K400CF672I8N requires a 1.71 V to 1.89 V core supply (1.8 V nominal) plus MultiVolt I/O supplies that may include 3.3 V, 2.5 V, and 1.8 V rails. Decouple each supply pin with a 0.1 µF ceramic capacitor placed within 5 mm of the BGA ball, and bulk-decouple the rails with 10 µF to 47 µF tantalum or polymer capacitors. Power sequencing should ensure the core rises before or simultaneously with the I/O rails to avoid latch-up. Estimated: with 100% logic utilization at 301 MHz, expect 2-3 W core dissipation; pair the design with adequate thermal relief on the FC-FBGA exposed die.
The 672-ball FC-FBGA package uses 1.0 mm ball pitch, requiring PCB microvia (laser-drilled or sequential lamination) technology. Use a 4 or 6 layer stack-up with dedicated power and ground planes. Match trace impedance to 50 Ω single-ended for MultiVolt I/O, and route differential pairs (LVDS) with 100 Ω differential impedance and matched within 0.127 mm. Avoid routing signals across plane splits under the BGA; use via-in-pad or microvia-to-inner-via transitions. Length-matching within 0.5 mm is essential for DDR-style interfaces and clock-distribution nets.
Do not confuse speed grades: -7 is the fastest, -8 is mid, -9 is the slowest APEX 20KC option. Specifying a -9 where the design needs -8 or -7 timing will cause setup-time violations. Also be aware that the EP20K400 family has multiple package options (F672, B652, F484, etc.) that are NOT pin-compatible with each other - substituting a B652 part for an F672 design will require a full PCB redesign. Always validate against the Quartus II Fitter pin assignment report before board layout sign-off.
Estimated: at 100% utilization and 301 MHz, the FC-FBGA junction temperature can reach 80-95 °C without airflow in still air. Although the industrial temperature range is 0 to +85 °C, designers should aim for junction temperatures below 100 °C for long-term reliability. Use thermal vias under the BGA die-attach paddle to transfer heat to inner ground planes, and consider a heat spreader or small fan for high-utilization designs operating in enclosed industrial enclosures.
규정 준수 정보
Lead-free confirmed by 'N' suffix in MPN per Altera/Intel naming convention. RoHS, REACH, halogen-free, and conflict-minerals status not present in verified distributor data and should be confirmed with the supplier's certificate of conformance. AEC-Q100 not applicable (FPGA is not an automotive-qualified logic IC at the part level).