EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
부품 번호: EP1SGX25DF672I5N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $118 | $118,000.00 |
EP1SGX25DF672I5N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs, and are widely used to implement digital signal processing, custom I/O protocols, and high-bandwidth data-path acceleration. The Stratix GX line specifically adds clock-data-recovery (CDR) transceiver channels to the standard programmable fabric, making it a hybrid logic-plus-serdes device.
Key features include 25,660 logic cells (2,566 CLBs), embedded multiplier blocks for DSP, on-chip TriMatrix memory, and 4-20 CDR-equipped transceiver channels supporting rates from 600 Mbps to 3.1875 Gbps. The device supports multiple I/O standards including LVDS, LVPECL, and 1.5V CMOS, with configurable on-chip termination. Configuration is typically loaded via a serial or parallel EPCS/EPCQ flash device.
The architecture combines a high-density 130 nm SRAM fabric with dedicated hard-IP transceiver circuitry, achieving deterministic latency for serial protocols. The integrated SERDES eliminates external PHY components for many applications, simplifying board layout and reducing BOM cost while still meeting industrial-grade signal-integrity requirements.
Typical applications include high-speed serial backplane interfaces, telecommunications line cards, ASIC prototyping, and protocol bridging (for example, SPI-4.2, SFI-4.1, 10 Gigabit Ethernet XAUI pre-processing). The combination of programmable fabric and 3.1875 Gbps transceivers is well matched to custom PHY and SerDes designs.
When designing with this device, plan PCB layout for the 1 mm-pitch BGA carefully - via-in-pad, microvia, or standard through-via stack-ups all require controlled-impedance routing for the SERDES channels and a 6+ layer stack-up is recommended for signal integrity.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not duplicated from the manufacturer datasheet.
드롭인 대체품: EP1SGX25DF672I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF672I5N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Lead Free / RoHS, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF672I5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$355 / 개
데이터시트 보기 →EP1SGX25DF672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$245 / 개
데이터시트 보기 →EP1SGX25DF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$125.4 / 개
데이터시트 보기 →EP1SGX25DF672C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX25DF672C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$96.5 / 개
데이터시트 보기 →EP1SGX25DF672C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1232.25 / 개
데이터시트 보기 →EP1SGX25DF672C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1SGX25DF672I5N 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Cells (CLBs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| High-Speed Transceiver Channels | 4 to 20 (CDR/SERDES) |
| Max Transceiver Data Rate | 3.1875 Gbps |
| 패키지 | 672-ball FC-FBGA |
| Package Body Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| 동작 온도 | -40C to +85C (Industrial) |
| 실장 유형 | Surface Mount |
| Lead-Free | Yes |
| RoHS 상태 | Compliant |
| Logic Family | CMOS (SRAM-based FPGA) |
EP1SGX25DF672I5N 33 x 33 mm 핀 구성 가이드
EP1SGX25DF672I5N(33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF672I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF672I5N 적합 용도: 6 애플리케이션s: High-Speed Serial Backplane Interface, Telecommunications Line Card, ASIC Prototyping, Protocol Bridging and Conversion, High-Performance DSP and Signal Processing, Test and Measurement Instrumentation.
High-Speed Serial Backplane Interface
The EP1SGX25DF672I5N's 4-20 SERDES channels operating up to 3.1875 Gbps make it well-suited for serial backplane interface cards in telecom and data-communication switches. Each transceiver integrates clock-data-recovery and 8B/10B encoding, eliminating the need for external PHY silicon and simplifying board layout. With 25,660 logic elements and dedicated DSP blocks, the fabric can implement MAC-layer processing, queue management, and protocol bridging alongside the SERDES - all on one device. Designers benefit from deterministic latency and per-channel pre-emphasis settings for backplane channels up to 40 inches of FR-4.
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Telecommunications Line Card
Line cards in SONET/SDH, OTN, and Ethernet aggregation equipment frequently deploy the EP1SGX25DF672I5N because its 1.5 V core, industrial -40C to +85C range, and SERDES density fit the multi-channel aggregation role. Per the Stratix GX datasheet, the on-chip transceiver channels support protocols including SFI-4.1, SPI-4.2, and XAUI, which are common in telecom line-card designs. With 2,566 CLBs of logic, designers can implement framer/mapper functions, traffic management, and OAM processing on the same device. The 33 x 33 mm 672-ball FC-FBGA is also familiar territory for telecom board layout engineers.
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ASIC Prototyping
ASIC prototyping teams use the EP1SGX25DF672I5N as a logic-and-translation substrate for verifying ASIC RTL before tape-out, taking advantage of its 25,660 logic elements and embedded SERDES. Per Intel FPGA documentation, the Stratix GX architecture supports common ASIC prototyping flows including TLM-based transactors, transactor-based memory modeling, and JTAG-driven debug. The integrated SERDES makes it suitable for prototyping ASICs that include embedded SerDes, custom I/O protocols, or high-bandwidth memory controllers. Multiple FPGAs can be combined on a prototyping board to reach higher ASIC gate counts.
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Protocol Bridging and Conversion
Designers deploy the EP1SGX25DF672I5N in protocol-bridging applications such as SPI-4.2 to XAUI, SFI-4.1 to XAUI, or custom serializer/deserializer translation. The on-chip SERDES with embedded 8B/10B encoding and clock-data-recovery allows parallel-to-serial and serial-to-parallel conversion at line rates up to 3.1875 Gbps. Per the manufacturer datasheet, the transceiver channels can be configured in 1x, 2x, or 4x bonded modes for XAUI-style aggregation. With 25,660 LEs available, the fabric can implement protocol-aware state machines, statistics counters, and adapter logic between the two sides.
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High-Performance DSP and Signal Processing
The EP1SGX25DF672I5N's embedded multiplier blocks and DSP-optimized fabric make it suitable for high-performance DSP applications such as channelized receivers, digital up/down-converters, and baseband processing. Per the Stratix GX datasheet, the device includes dedicated 18x18 multipliers and DSP blocks capable of hundreds of GMACs of DSP throughput. Combined with the 3.1875 Gbps SERDES, the part can stream digitised RF or baseband data directly into the DSP fabric for real-time processing in radar, electronic-warfare, or software-defined-radio platforms.
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Test and Measurement Instrumentation
Test and measurement equipment manufacturers deploy the EP1SGX25DF672I5N in protocol analyzers, BERT testers, and high-bandwidth oscilloscope capture paths. The 4-20 SERDES channels support live traffic capture and generation across common telecom and datacom rates, while the 25,660 logic elements implement real-time protocol decoding, triggering, and statistics. Per the manufacturer datasheet, the on-chip transceivers support loopback modes that simplify BERT and link-training designs. Industrial temperature range and lead-free FC-FBGA packaging make the part acceptable for production test equipment deployed in lab and field environments.
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추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF672I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF672I5 | EP1SGX25DF672C7N | EP1SGX25DF672C6N | EP1SGX25DF672C5N | EP1SGX25DF672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Package Body | 33 x 33 mm, 1 mm pitch | 33 x 33 mm, 1 mm pitch - same | 33 x 33 mm, 1 mm pitch - same | 33 x 33 mm, 1 mm pitch - same | 33 x 33 mm, 1 mm pitch - same | 33 x 33 mm, 1 mm pitch - same |
| Speed Grade | I5 (industrial) | I5 | C7 (faster) | C6 (faster) | C5 (faster) | C7 (faster) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| SERDES Channels | 4-20 | 4-20 | 4-20 | 4-20 | 4-20 | 4-20 |
| Max SERDES Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Lead-Free | Yes (N suffix) | No (no N) | Yes | Yes | Yes | No |
| Lifecycle | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
주요 차별점
- Integrated SERDES up to 3.1875 Gbps eliminates external PHY (vs EP1S25F672C7N (non-GX Stratix))
- Mid-density 25,660 LE tier balances cost and capacity (vs EP1SGX40F1020I6N (40K LE / 1020-ball))
- Industrial temperature range and lead-free finish (vs EP1SGX25DF672C7N (commercial speed grade))
설계 노트
The 672-ball FC-FBGA at 33 x 33 mm with 1 mm pitch requires via-in-pad technology for reliable assembly. Per Stratix GX layout guidelines, use microvias on the BGA pads to escape the inner balls, and provide a 6-layer or thicker PCB stack-up to route SERDES differential pairs and clock networks with controlled 100 ohm differential impedance. Decoupling: place 0.1 uF + 10 uF capacitors under the package within 100 mils of each power pin pair.
SERDES channels at 3.1875 Gbps require careful attention to differential pair routing, length matching (within 5 mils intra-pair, within 100 mils inter-pair), and continuous reference planes. Per the Stratix GX datasheet, AC-coupling capacitors are required on each SERDES TX output and should be 0402-size, placed within 200 mils of the FPGA pin. Pre-emphasis settings must be tuned per channel to meet the target protocol's eye-mask requirements.
The 33 x 33 mm FC-FBGA offers a thermal pad on the bottom that must be soldered to the PCB thermal land and connected to inner ground planes with thermal vias (0.3 mm pitch recommended). Estimated: at 1.5 V core, ~25K LEs switching at 50% toggle, total power can reach 5-8 W; without a proper thermal land the junction temperature can exceed the 85C industrial limit. Add forced-air cooling or a heat spreader for high-utilization designs.
Do not substitute the EP1SGX25DF672I5N with the EP1SGX25CF672 variant - the CF pinout assigns transceivers differently and the ball map is not pin-to-pin compatible despite both using 672-ball FC-FBGA. Also note that the I5N suffix is industrial + lead-free; industrial without lead-free uses the I5 (no N) marking per the Stratix GX ordering guide. Configuration flash selection: use EPCS16 or EPCS64 for serial-mode configuration; JTAG-only debug configurations should add the JTAG header per IEEE 1149.1.
규정 준수 정보
RoHS-compliant per Intel FPGA product page. Industrial temperature -40C to +85C. Lead-free per 'N' suffix. AEC-Q100 not applicable (telecom/industrial-grade device, not automotive). Halogen-free status not specified in available data.