EP20K600CF672C7ES - APEX 20KC FPGA 600K Gates 672-FBGA | Altera
부품 번호: EP20K600CF672C7ES ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460 | $4,600.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $360 | $360,000.00 |
EP20K600CF672C7ES 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, routing interconnects, and I/O cells that can be electrically programmed after manufacture. FPGAs sit hierarchically under programmable logic -> logic devices -> digital integrated circuits. APEX 20KC is Altera's multi-core architecture combining Look-Up Table (LUT) logic with embedded ESB (Embedded System Block) memory, optimized for high-throughput datapath and bus-interface designs in the late-1990s / early-2000s design era.
The EP20K600CF672C7ES provides up to 504 user I/O pins with 508 maximum input lines, four phase-locked loops (PLLs) for clock synthesis, and embedded RAM blocks totaling hundreds of kilobits. The architecture supports 32-bit datapath widths at 66 MHz PCI, LVDS I/O at >400 Mbps, and hot-socketing for board-level integration. Compared with older EPF10K parts, the APEX 20KC adds True-LVDS drivers, faster I/O registers, and lower core power at 1.8 V.
Designers favor the EP20K600CF672C7ES for high-density glue-logic, custom RISC/DSP co-processors, telecom line-card aggregation, and bus-protocol bridges. The 672-ball FC-FBGA package offers superior electrical performance over PQFP at high toggle rates due to its controlled-impedance ball grid and short bond wires. The 'ES' grade is typically specified when designers want to lock down a single silicon revision for the life of a program without PCN-driven obsolescence.
When designing with the EP20K600CF672C7ES, plan for a multi-rail power tree (1.8 V VCCINT, 2.5 V/3.3 V VCCIO per bank, separate VCCP for PLL) and use the Altera Quartus II design suite (versions 4.2 through 9.0 support the APEX 20K family). The 672-ball FC-FBGA requires ENIG or OSP PCB surface finish and controlled-collapse reflow profiles (JEDEC J-STD-020 MSL-3 typical).
This page synthesizes distributor pricing, verified datasheet parameters, and engineering notes specifically for the EP20K600CF672C7ES ES-grade variant to help sourcing engineers avoid confusion with the broader EP20K600 family.
드롭인 대체품: EP20K600CF672C7ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CF672C7ES (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Operating Temperature, Speed Grade, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CF672C7
✅ 드롭인✓ 재고 있음
$2267.89 / 개
데이터시트 보기 →EP20K600CF672C-7ES
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP20K600CF672C6
✅ 드롭인✓ 재고 있음
$480 / 개
데이터시트 보기 →EP20K600CF672-2
✅ 드롭인✓ 재고 있음
$680 / 개
데이터시트 보기 →EP20K600CEF672C7
✅ 드롭인✓ 재고 있음
$98.4 / 개
데이터시트 보기 →EP20K600CF33C7ES
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →EP20K600CF672C7ES 최대 정격 & 전기적 특성
| Series | APEX 20KC |
| Family | APEX 20K |
| Logic Elements / Cells | 24320 |
| System Gates | 600000 |
| Maximum User I/O | 504 |
| Maximum Input Lines | 508 |
| Number of Macrocells | 504 |
| Maximum Operating Frequency | 375.94 MHz (per FPGAkey listing) |
| Propagation Delay | 1.6 ns |
| Internal Reference Clock | 1666.6 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| Package Type | FC-FBGA |
| Pin / Ball Count | 672 |
| Grade Suffix | ES (engineering sample / extended screening) |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Memory | SRAM-based (volatile) |
EP20K600CF672C7ES fc-fbga 핀 구성 가이드
EP20K600CF672C7ES(fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CF672C7ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CF672C7ES 적합 용도: 7 애플리케이션s: Telecom Line-Card Aggregation FPGA, Custom RISC / DSP Co-Processor, Industrial Protocol Bridge (Profibus / DeviceNet / CAN), Legacy Mil/Aero Avionics Datapath, High-Speed Test & Measurement Instrumentation, Medical Imaging Pre-Processor, Display Controller / Video Wall Driver.
Telecom Line-Card Aggregation FPGA
The EP20K600CF672C7ES is well suited for telecom line-card aggregation roles where 600K system gates and 504 user I/O can absorb TDM bus multiplexing, HDLC controllers, and glue logic previously spread across multiple CPLDs. Its 1.6 ns propagation delay and 375.94 MHz internal fMAX let designers run STS-1/STM-0 framers at full rate, while the four PLLs synthesize the multiple 19.44 MHz / 38.88 MHz / 77.76 MHz clocks needed for a SONET/SDH backplane. The 672-ball FC-FBGA's controlled-impedance balls keep LVDS links at 400+ Mbps clean, critical when aggregating dozens of E1/T1 or 155 MHz ATM links on a single card.
추천
Custom RISC / DSP Co-Processor
The 24,320 logic elements and embedded system block (ESB) RAM of the EP20K600CF672C7ES let engineers implement custom multi-cycle RISC cores or DSP co-processors alongside standard interfaces. With a 1.8 V core and 0.15 µm CMOS process, dynamic power stays manageable in long duty-cycle workloads typical of industrial control or sensor processing. Designers can place 32-bit datapaths at 66 MHz PCI rates or build Galois-field multipliers for encryption, leveraging the architecture's dedicated carry chains and the 504 I/O for wide memory buses.
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Industrial Protocol Bridge (Profibus / DeviceNet / CAN)
Industrial protocol bridges benefit from the EP20K600CF672C7ES's combination of 504 I/O and 600K gates, which can host a soft-core CPU plus multiple independent fieldbus controllers in one device. The 1.6 ns propagation delay supports 12 Mbps Profibus DP and DeviceNet bit rates without timing closure pain. The ES grade locks silicon revision, important for factories that must re-qualify the same FPGA part for decades. The 672-ball FC-FBGA tolerates industrial -40 °C to +85 °C ambient when the correct industrial temp-grade part number is selected.
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Legacy Mil/Aero Avionics Datapath
The EP20K600CF672C7ES serves well in legacy military and avionics datapath applications where its ES engineering-sample / extended-screening grade provides the locked silicon revision required for long-life programs. Designers implement ARINC 429 / MIL-STD-1553 interfaces, radar preamble detectors, or navigation sensor fusion in the 600K-gate fabric, while the FC-FBGA package's short bond wires deliver low jitter on the high-speed ADC/DAC interfaces. Pairing with radiation-tolerant companion parts keeps the system viable for upgrade programs spanning 15+ years.
추천
High-Speed Test & Measurement Instrumentation
Test-and-measurement instruments such as logic analyzers, protocol exercisers, and digitizer front-ends use the EP20K600CF672C7ES to capture, timestamp, and pre-process data at rates the host CPU cannot keep up with. The 504 user I/O accepts parallel ADC banks, and the ES-grade locked silicon ensures capture timing does not drift across reorders. The 375.94 MHz fMAX and 1.6 ns propagation delay provide the deterministic timing margin essential for compliance testers where sample jitter directly translates to measurement uncertainty.
추천
Medical Imaging Pre-Processor
The EP20K600CF672C7ES fits medical imaging pre-processor boards where 600K gates and 504 I/O can ingest raw ultrasound, endoscopy, or X-ray detector data and apply real-time filtering before handing off to a DSP or host processor. The 1.8 V core and 0.15 µm process keep per-channel power low enough for portable cart-based systems, while the FC-FBGA package meets the controlled-impedance requirements of LVDS detector links. The ES grade supports FDA-cleared device revalidation by guaranteeing a stable silicon revision through production life.
추천
Display Controller / Video Wall Driver
The EP20K600CF672C7ES can drive large multi-panel video walls by combining 24,320 logic elements with 504 LVDS-capable I/O to implement multi-link DVI/HDMI aggregation and pixel clock synthesis. The four PLLs generate independent pixel clocks per output, eliminating external clock generators. Designers targeting digital signage or command-and-control video walls benefit from the ES-grade silicon lock when qualified display panels require revalidation against any FPGA timing change.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CF672C7ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CF672C7 | EP20K600CF672C-7ES | EP20K600CF672C6 | EP20K600CF672-2 | EP20K600CEF672C7 | EP20K600CF33C7ES |
|---|---|---|---|---|---|---|---|
| Package | FC-FBGA-672 | FC-FBGA-672 (same) | FC-FBGA-672 (same) | FC-FBGA-672 (same) | FC-FBGA-672 (same) | FC-FBGA-672 (same) | FC-FBGA-672 (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Max User I/O | 504 | 504 | 504 | 504 | 504 | 504 | 504 |
| Speed Grade | -7 / ES grade | -7 / non-ES | -7 / ES | -6 (slower) | -2 (slowest) | -7 / E-RoHS | -7 / ES / CF33 |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| RoHS / Lead-Free | Non-RoHS (legacy) | Non-RoHS | Non-RoHS | Non-RoHS | Non-RoHS | RoHS (E prefix) | Non-RoHS |
| Lifecycle Status (2026-09-08) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete | Last-time-buy | Last-time-buy |
주요 차별점
- Engineering-sample / extended-screening (ES) grade for locked silicon revision (vs EP20K600CF672C7 (non-ES))
- Highest commercial speed grade (-7) in the APEX 20K CF672 family (vs EP20K600CF672C6 (-6 speed grade))
- APEX 20KC architecture with 0.15 µm process and embedded ESB memory (vs EP20K200/EP20K300 family members)
설계 노트
The EP20K600CF672C7ES requires a multi-rail power tree: VCCINT = 1.8 V for the core logic, VCCIO = 2.5 V or 3.3 V per I/O bank, and a separate VCCP rail for the PLLs. Use a star-ground topology and place 10 µF + 0.1 µF ceramic decoupling within 5 mm of each power-ball cluster. Estimated: at 50% toggle rate and 50% I/O switching, ICCINT is typically 1-2 A on the -7 speed grade; verify with a current probe on first prototype.
The 672-ball FC-FBGA package has a 1.0 mm ball pitch typical of the APEX 20K CF672 family. PCB land pads must be NSMD (non-solder mask defined) with ENIG or OSP finish for reliable assembly. The flip-chip die bumps require controlled-collapse reflow with peak temperature 245 °C ±5 °C (SnPb) or 250 °C ±5 °C (SAC305 lead-free). X-ray inspection after reflow is mandatory because all joints are hidden under the package.
Place configuration flash (EPC16 or EPC8 in the APEX 20K CF672 family) within 50 mm of the nCONFIG / DATA / DCLK balls to keep JTAG and passive-serial configuration traces short. Use 50 Ω impedance-controlled microstrip for clock pairs (CLK0/CLK1) feeding the PLL inputs. Avoid routing LVDS signals across plane splits; reference each LVDS pair to a continuous ground plane for the full length of the trace.
Do not confuse the EP20K600CF672C7ES with the EP20K600CB652C7ES - the CB652 has a 652-ball FBGA and is NOT a drop-in for the CF672 672-ball footprint. Also, the Quartus II design suite last supported the APEX 20K family at version 9.0 SP2; newer Quartus releases will not synthesize APEX 20K designs. Finally, verify the temperature grade in the part number suffix before deploying - commercial (0 to +70 °C) and industrial (-40 to +85 °C) variants exist within the same family.
규정 준수 정보
The EP20K600CF672C7ES is a legacy APEX 20KC part (released 1999-2001) generally supplied with SnPb (lead-bearing) ball finish, hence non-RoHS. For RoHS-compliant drop-in equivalents on the same 672-ball FC-FBGA footprint, evaluate the EP20K600CEF672C7 (E-prefix = lead-free) or EP20K600EBC652-series. AEC-Q100 not applicable for FPGA. REACH, halogen-free, and conflict-mineral statements are not in the verified web data - contact Altera/Intel FPGA compliance team for documentation.
