EP1S40F1020I6N - Stratix 41K LE FPGA 1020-FBGA | Intel (Altera)
부품 번호: EP1S40F1020I6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $365 | $365,000.00 |
EP1S40F1020I6N 개요
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets designers implement custom digital logic, memory, and DSP blocks after manufacture. FPGAs sit at the top of the programmable logic hierarchy - alongside CPLDs - and are classified as integrated circuits (ICs) within embedded computing. The Stratix family specifically targets high-performance signal processing, telecommunications, and ASIC prototyping workloads where logic density, on-chip memory bandwidth, and DSP throughput matter most.
Key features of the EP1S40F1020I6N include 4125 LABs grouped into the Stratix Logic Array architecture, embedded TriMatrix memory blocks totaling approximately 3.4 Mbits, dedicated DSP blocks for fixed-point arithmetic, and high-speed I/O supporting LVDS, LVTTL, SSTL, and other common signaling standards. The device also supports multiple configuration schemes including passive serial, passive parallel, and JTAG, allowing flexible in-system programming.
On the architectural side, the EP1S40F1020I6N uses SRAM-based configuration memory with dedicated routing resources optimized for timing closure. Embedded PLLs provide clock synthesis and skew management across the die. The integrated DSP blocks can be cascaded for high-throughput FIR filters and FFT engines, while the TriMatrix memory (MLAB, M512, M4K blocks) offers flexible on-chip buffering for streaming data paths.
Typical applications include ASIC prototyping and emulation, software-defined radio (SDR), high-speed image and video processing, telecom baseband processing, and military/aerospace signal processing. The 1020-BGA package supports dense board layouts while providing adequate signal integrity for multi-hundred-MHz parallel buses.
When designing with this part, plan power sequencing carefully - the Stratix family typically requires a 1.5 V core plus separate VCCIO banks, VCCPD, and VCCAUX rails. A multi-rail controller is recommended to ensure proper power-up and configuration hand-off. Thermal management should account for the BGA's thermal resistance under full DSP utilization.
This page synthesizes distributor inventory, lifecycle status, drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP1S40F1020I6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S40F1020I6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Family, Process Technology, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S40F1020I6GB
✅ 드롭인✓ 재고 있음
$310 / 개
데이터시트 보기 →EP1S40F1020I6AA
✅ 드롭인✓ 재고 있음
$92.5 / 개
데이터시트 보기 →EP1S40F1020I6
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →EP1S40F1020C7N
✅ 드롭인✓ 재고 있음
$926.78 / 개
데이터시트 보기 →EP1S40F1020C6N
✅ 드롭인✓ 재고 있음
$695 / 개
데이터시트 보기 →EP1S40F1020I6N 최대 정격 & 전기적 특성
| Family | Stratix |
| Series | Stratix I |
| Logic Elements (LE) | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Total Memory Bits | 3,423,744 |
| User I/Os | 773 |
| Core Voltage | 1.5 V |
| 공급 전압 | 1.5 V |
| 동작 온도 | 0 C to 85 C (commercial) |
| Package Type | FC-FBGA |
| Package Pins/Balls | 1020 |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Unknown - pre-RoHS Altera-era part |
EP1S40F1020I6N 33 x 33 mm 핀 구성 가이드
EP1S40F1020I6N(33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S40F1020I6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S40F1020I6N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband, High-Speed Image and Video Processing, Telecom Baseband and Protocol Processing, Industrial Control and Motor Drive, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP1S40F1020I6N delivers 41,250 logic elements with 3.4 Mbits of embedded TriMatrix memory, making it well-suited for ASIC prototyping and in-circuit emulation of mid-complexity ASIC designs. Engineers typically map RTL blocks one-to-one to LAB clusters and use the abundant M4K/M512 RAM blocks for transaction recording and bus-level monitoring. Compared with gate-array emulation, the 4,125 LABs offer roughly 500K-1M usable gates at typical 70% utilization. The 1020-FBGA footprint supports 773 user I/Os, enabling full visibility on ASIC pins up to ~600 signal count designs.
추천
Software-Defined Radio (SDR) Baseband
The EP1S40F1020I6N's dedicated DSP blocks and high-density logic make it a strong fit for SDR baseband processing, including DDC/DUC, channelization, and FFT-based OFDM demodulation. The 3.4 Mbits of on-chip memory support multi-symbol buffering without external SRAM, and 773 user I/Os accommodate parallel ADC/DAC interfaces such as LVDS at 400+ MSPS. The 1.5 V core plus selectable VCCIO banks (1.5/1.8/2.5/3.3 V) allow direct connection to common RF ADC/DAC logic levels. SDR reference designs typically achieve 70-80% DSP block utilization on this part.
추천
High-Speed Image and Video Processing
With 41,250 logic elements, embedded DSP blocks, and 3.4 Mbits of fast on-chip memory, the EP1S40F1020I6N supports real-time image processing pipelines including 2D convolution, Sobel edge detection, and H.264 motion estimation at CIF to VGA resolutions. The 773 user I/Os easily interface to 16-bit parallel camera links and DDR memory controllers for frame buffering. The LVDS-capable I/O banks can run video serializers/deserializers at 400-600 Mbps per pair, enabling direct connection to CameraLink or FPD-Link channels. Designers typically hit 80-100 MHz pixel clock on this part.
추천
Telecom Baseband and Protocol Processing
The EP1S40F1020I6N's logic density, embedded memory bandwidth, and multi-standard I/O support make it applicable for telecom baseband and protocol processing nodes, including Ethernet MAC aggregation, SONET/SDH framer implementations, and HDLC/PPP protocol engines. The 1020-BGA package supports up to 773 user I/Os, enough for parallel UTOPIA / POS-PHY interfaces to network processors. With embedded PLLs and abundant routing resources, designers commonly achieve 200+ MHz on critical paths in Stratix I telecom reference designs, leveraging the TriMatrix memory for cell/packet buffering.
추천
Industrial Control and Motor Drive
The EP1S40F1020I6N suits industrial control and multi-axis motor drive controllers where deterministic logic and high I/O count are required. With 773 user I/Os the part interfaces directly to multi-encoder feedback lines, gate driver PWM outputs, and fieldbus transceivers (EtherCAT, Profibus, CAN). The embedded TriMatrix memory allows current/torque loop tables to be stored on-chip for sub-microsecond access. Industrial applications commonly run this part at 100-150 MHz system clock, leveraging the dedicated PLLs for synchronized PWM generation across multiple axes.
추천
Military and Aerospace Signal Processing
For legacy military and aerospace programs, the EP1S40F1020I6N remains a viable COTS DSP engine for radar signal processing, electronic warfare (EW) receivers, and secure communications modems. The 41,250 LE density supports beamforming weights for 16-32 element arrays and chirp generation for FMCW radar at L/S-band frequencies. While the part does not meet MIL-STD-883 or rad-hard requirements on its own, programs typically pair it with ruggedized board-level screening and sealed FC-FBGA assemblies. Aerospace users value the abundant LVDS pairs for high-speed ADC/DAC interfaces in digital receivers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S40F1020I6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S40F1020I6GB | EP1S40F1020I6AA | EP1S40F1020I6 | EP1S40F1020C7N | EP1S40F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-FBGA (33 x 33 mm) | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same |
| Logic Elements | 41,250 LE | 41,250 LE | 41,250 LE | 41,250 LE | 41,250 LE | 41,250 LE |
| LABs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/Os | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to 85 C (industrial 'I') | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C |
| RoHS / Lead-Free | Unknown (pre-RoHS Altera era) | Yes (lead-free matte-Sn) | Unknown | Unknown | Unknown | Unknown |
주요 차별점
- Only drop-in replacement with confirmed lead-free ball finish (vs EP1S40F1020I6GB)
- Same die as other EP1S40F1020 variants (vs EP1S40F1020C7N)
- Higher logic density than smaller Stratix I variants (vs EP1S30F1020I6N)
- Higher I/O count vs smaller Stratix I variants (vs EP1S40F1020C6N)
설계 노트
The EP1S40F1020I6N requires a multi-rail power architecture: VCCINT 1.5 V core, VCCIO bank voltages (1.5/1.8/2.5/3.3 V), VCCPD, VCCA_PLL (2.5 V), and VCCAUX. According to the Stratix I datasheet, all rails must ramp in a defined sequence during power-up to avoid configuration failure and latch-up. Recommended practice: use a sequencing controller such as LTC2974 or UCD90120A, with VCCINT last to ramp (after VCCAUX) so configuration logic is stable before the core array is powered.
Estimated: at full DSP utilization (80% DSP blocks active) with 200 MHz toggling, the EP1S40F1020I6N dissipates approximately 3-5 W typical and up to 7-8 W worst case. The 1020-FBGA package has theta_JA around 15-20 C/W with 4-layer PCB and adequate thermal vias. Design the PCB with a full thermal via array under the central ground balls and connect to an inner ground plane; consider a top-side heatsink for sustained full-utilization workloads in enclosed industrial enclosures.
The 1020-FBGA 33 x 33 mm package at 1.0 mm pitch requires a 4-layer or higher PCB with microvia-in-pad or via-on-pad technology. Outer signal layers should be 4 mil trace/space with 8 mil drill. Match all LVDS pairs to 100 ohm differential impedance and length-match within 50 mil. Per the Stratix I hardware reference, place at least 4 decoupling capacitors (0.1 uF + 10 uF bulk) within 0.25 inch of each VCCIO bank pin cluster to suppress switching transients.
Use AS (Active Serial) configuration mode with an EPC16 or EPCS16 boot flash for production boards - this lets the FPGA load its bitstream on power-up without an external controller. Keep MSEL[2:0] pins strapped to the correct mode (typically 000 for AS, 001 for AP, 010 for PS). Pull nCONFIG high via 10 kohm resistor to VCCPD and provide a 1 nF cap to ground for clean reset behaviour; missing this cap is a common cause of intermittent configuration failures on Stratix I designs.
Common pitfalls on EP1S40F1020I6N designs: (1) forgetting that Quartus II 13.1 is the last version supporting Stratix I - newer Quartus Prime will reject the device. (2) Driving JTAG TCK faster than 33 MHz during ISP, which can corrupt configuration SRAM. (3) Routing LVDS pairs across split reference planes, causing severe EMI and signal-integrity issues. (4) Powering VCCIO before VCCINT, which can trigger I/O latch-up. (5) Using the wrong speed grade - the -6 suffix here provides the fastest Fmax; -7 is ~15% slower.
규정 준수 정보
EP1S40F1020I6N is a pre-RoHS Altera-era part with SnPb eutectic ball finish (non-lead-free). RoHS-compliant equivalent is EP1S40F1020I6GB with matte-Sn lead-free balls. AEC-Q100 not applicable for FPGAs. Reach/halogen/conflict-mineral status not disclosed in available datasheets; consult XAIPART or the broker for up-to-date compliance documentation.
