EP2AGX125EF29I3 - Arria II GX FPGA, 118K LE, 780-FBGA | Intel
부품 번호: EP2AGX125EF29I3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1290 | $129,000.00 |
| 500 | $1180 | $590,000.00 |
| 1,000 | $1095 | $1,095,000.00 |
EP2AGX125EF29I3 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs sit between fixed-function ASICs and software-driven processors, offering hardware-timed parallelism, deterministic latency, and field-upgradable functionality. Within the broader hierarchy, FPGAs belong to programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, and are widely used to implement custom data-path, control, and interface functions before or instead of an ASIC.
Key features of the EP2AGX125EF29I3 include 49,640 adaptive logic modules (ALMs), 4,964 LABs, integrated hard PCIe Gen1 controllers, dedicated 6.144 Gbps-capable transceivers, and on-chip DSP blocks for high-throughput signal processing. The 780-BGA package provides the I/O density required for high-pin-count designs while supporting high-speed serial links and parallel memory interfaces. Designers typically target the Arria II GX family when they need multi-gigabit transceivers without paying the premium for higher-end Stratix devices.
Typical applications for this FPGA include high-speed serial interface bridging, video broadcast and processing equipment, telecom line cards, industrial imaging, and software-defined radio front-ends. The combination of PCIe hard IP and multi-gigabit transceivers also makes it suitable for protocol conversion cards and test-and-measurement instrumentation where deterministic, low-latency I/O is required.
When designing with this device, pay particular attention to power-rail sequencing and decoupling because the Arria II GX architecture requires multiple supply rails (core, I/O, transceiver, PLL). PCB layout should follow Intel/Altera pin-out guidelines for the FCBGA-780 footprint to maintain signal-integrity on the transceiver channels. Stock at major distributors is constrained because the part is now NRND - check distributor inventory and consider EP2AGX125EF29I5 for higher speed grade if availability is limited.
드롭인 대체품: EP2AGX125EF29I3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX125EF29I3 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Family, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX125EF29I5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX125EF29I3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX125EF29C6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1495 / 개
데이터시트 보기 →EP2AGX125EF29C5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1090 / 개
데이터시트 보기 →EP2AGX125EF29C4G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1100 / 개
데이터시트 보기 →XC6SLX150T-3FGG676
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX125EF29I3 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements (LE) | 118,143 |
| Adaptive Logic Modules (ALM) | 49,640 |
| Logic Array Blocks (LAB) | 4,964 |
| Embedded Memory | 7,892 Kbit (7.93 Mbit) |
| User I/Os | 372 |
| Number of Terminals | 780 |
| 패키지 / 케이스 | 780-BBGA, FCBGA |
| 장착 스타일 | SMD/SMT |
| 동작 공급 전압 | 1.5 V to 3.3 V |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 동작 온도 | -40C to +85C (Industrial) |
| Speed Grade | -3 (I3) |
| Transceivers | Up to 12 multi-gigabit transceivers |
| Packaging | Tray |
| RoHS 상태 | Compliant |
EP2AGX125EF29I3 780-bbga, fcbga 핀 구성 가이드
EP2AGX125EF29I3(780-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX125EF29I3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX125EF29I3 적합 용도: 7 애플리케이션s: Telecom Line Cards and Protocol Bridging, Video Broadcast and Image Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Software-Defined Radio Front-End, Industrial Control and Automation Controllers, Medical Imaging and Diagnostics Equipment.
Telecom Line Cards and Protocol Bridging
The EP2AGX125EF29I3 is well suited to telecom line cards requiring high-density serial I/O and parallel processing. Its 12 multi-gigabit transceivers deliver up to 3.75 Gbps per channel, supporting CPRI, OBSAI, and custom serial protocols commonly used between baseband units and remote radio heads. The 118K logic elements and 7.93 Mbit of embedded memory handle protocol stacks, framer/deframer logic, and data-path buffering simultaneously. PCIe hard IP enables direct host connectivity without consuming fabric resources, reducing latency for control-plane interfaces.
추천
Video Broadcast and Image Processing
Broadcast video routers and image-processing pipelines benefit from the EP2AGX125EF29I3's parallel fabric and high I/O count. The 372 user I/Os accept multiple parallel video streams (DVI/HDMI/SDI) and the 49,640 ALMs implement real-time video scaling, color-space conversion, and overlay composition. Embedded DSP blocks accelerate motion estimation and de-interlacing without off-chip processors. The industrial temperature range supports deployment in broadcast equipment rooms and outdoor camera control units.
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Industrial Imaging and Machine Vision
The EP2AGX125EF29I3 powers machine-vision systems where deterministic latency and high-speed sensor interfaces are critical. CoaXPress, Camera Link, and GigE Vision protocols map efficiently onto the transceiver channels, while the parallel fabric implements Bayer demosaicing, defect correction, and pre-DSP pipelines in real time. With 7.93 Mbit of embedded memory, frame buffers for up to several megapixel images fit on-chip, reducing external DDR pressure. Industrial temperature qualification ensures stable operation in factory-floor enclosures.
추천
Test and Measurement Instrumentation
The EP2AGX125EF29I3 fits mid-range test equipment that needs deterministic, low-latency signal generation and acquisition. Its transceivers drive high-speed DAC/ADC interfaces, while the parallel fabric implements protocol-aware stimulus generation, deep trigger sequencers, and on-the-fly DSP. PCIe Gen1 hard IP provides a clean host data path for streaming capture buffers. The 780-BGA package enables dense I/O layouts required by multi-channel instruments.
추천
Software-Defined Radio Front-End
SDR platforms leverage the EP2AGX125EF29I3's combination of multi-gigabit transceivers and DSP blocks for digital down/up-conversion, channelization, and modulation/demodulation. The transceivers interface directly to RF ADC/DAC front-ends while fabric logic implements FFTs, FIR filters, and crest-factor reduction in real time. Embedded memory holds time-domain and frequency-domain sample buffers, and PCIe Gen1 enables streaming to host processors for higher-layer processing. Industrial temperature qualification supports field-deployable radios.
추천
Industrial Control and Automation Controllers
The EP2AGX125EF29I3 serves as a high-density controller in industrial automation where deterministic response to multiple fieldbuses and deterministic real-time Ethernet protocols (EtherCAT, PROFINET) is required. The 118K logic elements implement protocol stacks, motion-control loops, and safety logic, while transceivers support industrial Ethernet PHYs at 100 Mbit/s or 1 Gbit/s. PCIe Gen1 hard IP enables integration with industrial PCs and HMIs. Industrial temperature rating allows deployment in factory-floor cabinets without additional conditioning.
추천
Medical Imaging and Diagnostics Equipment
Although not AEC-Q100 qualified, the EP2AGX125EF29I3's industrial temperature range and deterministic real-time processing make it suitable for medical imaging subsystems such as ultrasound beamformers and endoscopy processors. Multi-gigabit transceivers accept high-speed ADC data from transducer arrays, and the abundant ALMs implement digital beamforming, harmonic imaging, and speckle reduction. On-chip block RAM buffers scanline data, reducing external memory requirements. Long-term production stability through NRND/EOL transitions should be considered for medical certification paths.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX125EF29I3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX125EF29I5 | EP2AGX125EF29I3N | EP2AGX125EF29C6G | EP2AGX125EF29C5G | EP2AGX125EF29C4G | XC6SLX150T-3FGG676 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Package | 780-BBGA, FCBGA (EF29) | 780-BBGA, FCBGA (EF29) - same | 780-BBGA, FCBGA (EF29) - same | 780-BBGA, FCBGA (EF29) - same | 780-BBGA, FCBGA (EF29) - same | 780-BBGA, FCBGA (EF29) - same | 676-FBGA (FGG676) - different footprint |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 | 147,443 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | -3 (slowest industrial) | -5 (faster industrial) | -3 | -6 (slowest commercial) | -5 | -4 | -3 (Xilinx speed bin) |
| Transceivers | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 8 GTP (3.2 Gbps) |
| Embedded Memory | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit | 4.8 Mbit |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 45 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest speed grade available in industrial temperature (vs EP2AGX125EF29I3)
- Commercial-temperature pin-compatible variants available for lab/benchtop builds (vs EP2AGX125EF29C6G)
- Higher logic density available in same package family (vs EP2AGX260EF29I3)
설계 노트
The Arria II GX architecture requires multiple supply rails (VCCINT core 0.9 V, VCCIO banks at 1.5 V to 3.3 V, VCCA_PLL, VCCR/V CCT for transceivers, and VCCPD). Power-up sequencing must follow the Altera/Intel Arria II GX device handbook to avoid latch-up. Use a dedicated power-supply supervisor or sequencer IC, and ensure each rail ramps monotonically within the datasheet's tRAMP specification. Decoupling requires hundreds of nF/uF capacitors distributed across the BGA footprint.
The 780-ball FCBGA uses a 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for reliable breakout. Follow Intel's PCB layout guidelines for the EF29 package, including 50-ohm impedance control for transceiver channels, length matching within the transceiver pair skew budget, and reference-plane continuity under high-speed serial lanes. Use the Quartus Prime Fitter and Pin Planner to validate pin assignments before tape-out. Thermal vias under the BGA's central ground balls improve theta_JB.
Do not confuse the EP2AGX125EF29I3 with the higher-density EP2AGX260EF29I3 - the larger device shares the EF29 package family but has a different pinout and ball map, so a design migrated between them requires re-validation. Also note that the 'I3' suffix is industrial temperature -3 speed grade, while 'C5' is commercial -5; design tools and timing models differ between these grades. Always regenerate timing analysis after changing speed grade.
Transceiver channels up to 3.75 Gbps require careful channel loss budgeting - target 6 dB or less at the Nyquist frequency. Use 100-ohm differential routing, AC-coupling capacitors at the transceiver pins, and a continuous reference plane under the entire channel. Pre-emphasis and equalization settings should be configured using the Altera Transceiver Toolkit; calibration requires a known-good BERT or pattern source.
규정 준수 정보
RoHS compliant per DigiKey product listing and Intel/Altera product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - this is an FPGA, not an automotive IC, but the industrial temperature grade suits many industrial applications.