10CX220YF672E5G - Cyclone 10 GX 220K LE FPGA | Intel | 672-FBGA
부품 번호: 10CX220YF672E5G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $421 | $42,100.00 |
| 500 | $378 | $189,000.00 |
| 1,000 | $342 | $342,000.00 |
10CX220YF672E5G 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital logic functions after manufacturing. FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) and far higher-performance than microcontrollers for parallel data-path workloads. Cyclone 10 GX specifically targets FPGA-accelerated industrial, video, and connectivity designs requiring transceivers and DSP blocks at low power.
Key features include integrated PCI Express Gen2 x4 hard IP, up to 12.5 Gbps transceivers, hard memory controllers supporting DDR3/DDR4/LPDDR3, and 8-input fracturable ALMs delivering up to 7.0 Gbps LVDS performance. The device supports configuration via active serial x4, fast passive parallel x8, and JTAG modes. Hardened floating-point DSP blocks accelerate IEEE 754 single-precision arithmetic at block-level, reducing soft-logic utilization for signal-processing pipelines.
The Cyclone 10 GX architecture combines a 20 nm process node with hardened protocol IP, achieving lower static power than the previous Cyclone V generation while supporting 12.5 Gbps multi-gigabit transceivers. The 672-ball FBGA package enables high I/O density on a 27 mm x 27 mm footprint with 1.0 mm ball pitch, suitable for mid-complexity PCIe cards, industrial machine vision, and broadcast video bridging.
Typical applications include industrial machine vision frame grabbers, broadcast video interfaces (SDI/DisplayPort/HDMI bridging), PCIe Gen2 endpoint cards, motor control and industrial Ethernet, and low-power wireless backhaul. The integrated transceivers and PCIe hard IP make 10CX220YF672E5G particularly suited for video capture cards and protocol-bridging designs.
When designing with this device, ensure the PCB stackup supports 1.0 mm BGA pitch with appropriate via-in-pad or dog-bone fanout. Power estimation should be performed using Intel's Early Power Estimator (EPE) before logic design begins, as 12.5 Gbps transceiver channels significantly affect thermal budget. Decoupling requires a minimum of 24 low-ESL ceramic capacitors distributed across the FPGA's core supply rails.
This page synthesizes distributor pricing, pin-compatible Cyclone 10 GX family alternatives with shared 672-FBGA footprint, and practical PCB layout considerations not found in the standalone manufacturer datasheet, enabling faster engineering decisions for new designs and BOM risk mitigation for legacy boards.
드롭인 대체품: 10CX220YF672E5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX220YF672E5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Operating Temperature, Embedded Memory, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CX150YF672E5G
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →10CX105YF672E5G
✅ 드롭인✓ 재고 있음
$310 / 개
데이터시트 보기 →10CX085YF672E5G
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →10CX220YF672E5G 최대 정격 & 전기적 특성
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 LE |
| Adaptive Logic Modules (ALMs) | 80,330 ALM |
| Embedded Memory | 11.46 Mbit |
| MLAB Memory | 5.7 Mbit |
| Number of I/Os | 236 I/O |
| DSP Blocks (18x19 Multipliers) | 48 |
| Transceivers | Up to 12.5 Gbps |
| Hard Memory Controllers | 4 (DDR3/DDR4/LPDDR3) |
| PCIe Hard IP | Gen2 x4 |
| Process Technology | 20 nm |
| 패키지 | 672-ball FBGA (F672) |
| Ball Pitch | 1.0 mm |
| Package Dimensions | 27 mm x 27 mm |
| 동작 온도 | 0 C to +100 C (industrial extended) |
| Speed Grade | 5 (E5G - mid-speed, industrial) |
| 실장 유형 | Surface Mount |
| Configuration Modes | AS x4, FPP x8, JTAG |
| RoHS 상태 | Compliant |
10CX220YF672E5G 27 mm x 27 mm 핀 구성 가이드
10CX220YF672E5G(27 mm x 27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX220YF672E5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX220YF672E5G 적합 용도: 7 애플리케이션s: Industrial Machine Vision Frame Grabber, Broadcast Video Protocol Bridging, PCI Express Endpoint Add-In Card, Industrial Motor Control and Servo Drive, Wireless Backhaul and Small Cell Baseband, Medical Imaging Signal Processing, Test and Measurement Instrumentation.
Industrial Machine Vision Frame Grabber
The 10CX220YF672E5G suits industrial machine vision frame grabbers because its 220,000 logic elements support Camera Link HS and CoaXPress video decoding pipelines while 11.46 Mbit embedded memory buffers image lines before DMA transfer. The PCIe Gen2 x4 hard IP provides up to 2 GB/s host throughput without consuming FPGA fabric. Designers place the FPGA on a PCIe x4 card with the F672 672-ball FBGA package enabling co-layout of 4 transceiver channels for multi-camera aggregation. Compared to a soft-IP PCIe implementation, the hardened blocks free approximately 15-20K LE for application-specific image processing. Industrial vision systems benefit from the 0 C to +100 C operating range supporting factory floor enclosures.
추천
Broadcast Video Protocol Bridging
The 10CX220YF672E5G fits broadcast video protocol bridging between SDI, HDMI, and DisplayPort because its 12.5 Gbps transceivers handle SDI 6G and 12G rates natively while the 220K LE fabric supports color-space conversion and audio de-embedding. The 80,330 ALMs allow parallel processing of 4K video streams at 60 fps without timing closure issues. Designers place the FPGA between source and display with HDMI 2.0 transmitters downstream. The F672 footprint supports 8 transceiver channels enabling multi-port SDI routing matrices. Compared to ASSP video processors, the FPGA architecture allows firmware-level protocol updates for emerging broadcast standards without PCB redesign.
추천
PCI Express Endpoint Add-In Card
The 10CX220YF672E5G targets PCIe Gen2 x4 endpoint add-in cards because the hard PCIe blocks deliver up to 2 GB/s throughput without soft-logic overhead. Its 220K LE count supports data acquisition preprocessing, custom DMA engines, and on-card buffering in 11.46 Mbit embedded memory. Designers integrate the FPGA on standard PCIe x4 form factor cards with the F672 672-ball FBGA co-located to the edge connector for optimal signal integrity. The 12.5 Gbps transceivers enable simultaneous PCIe and SATA or 10GbE connectivity on a single card. Compared to discrete PCIe controller solutions, the FPGA consolidation reduces BOM cost by 40-60% for multi-protocol cards.
추천
Industrial Motor Control and Servo Drive
The 10CX220YF672E5G serves industrial motor control and servo drive applications because its 48 18x19 DSP blocks execute multiple field-oriented control (FOC) loops concurrently while 236 user I/Os support multi-axis encoder feedback and PWM generation. The 20 nm process delivers low static power suitable for continuous-operation factory equipment. Designers implement torque, speed, and position loops in the FPGA fabric with sub-microsecond control periods. The F672 package provides adequate I/O for 4-axis servo drives with encoder interfaces. Compared to microcontroller-based servo controllers, the FPGA parallel architecture enables higher switching frequencies (up to 100 kHz) reducing motor audible noise.
추천
Wireless Backhaul and Small Cell Baseband
The 10CX220YF672E5G supports wireless backhaul and small cell baseband processing because its 12.5 Gbps transceivers handle CPRI rates up to option 6 while 220K LE fabric implements PHY-layer functions and 48 DSP blocks accelerate FFT/iFFT and channel estimation. The PCIe Gen2 hard IP connects to baseband SoCs for higher-layer processing. The 1.0 mm BGA pitch enables compact outdoor radio unit form factors. Compared to ASIC-based small cell solutions, the FPGA architecture allows protocol updates for 5G NR migration without hardware replacement. The 0 C to +100 C industrial temperature grade supports outdoor deployment in weatherized enclosures.
추천
Medical Imaging Signal Processing
The 10CX220YF672E5G fits medical imaging signal processing applications such as ultrasound beamforming and endoscopy because its 220K LE fabric supports parallel processing of multiple transducer channels while 48 DSP blocks execute FFT and matched-filter operations for image reconstruction. The 11.46 Mbit embedded memory buffers raw RF sample data before beamforming. Designers place the FPGA on PCIe imaging cards with the F672 footprint accommodating full ultrasound channel counts. Compared to GPU-based image processing, the FPGA deterministic latency eliminates real-time variability critical for diagnostic equipment. The industrial temperature range supports medical cart and bedside equipment deployments.
추천
Test and Measurement Instrumentation
The 10CX220YF672E5G targets test and measurement instrumentation including protocol analyzers, logic analyzers, and arbitrary waveform generators because its 12.5 Gbps transceivers capture and generate high-speed serial data while 220K LE fabric implements protocol-aware analysis logic. The 11.46 Mbit embedded memory buffers captured traces before host transfer. Designers place the FPGA on instrument mainboards with the F672 footprint supporting multi-channel probe interfaces. Compared to ASIC-based T&M equipment, the FPGA flexibility allows firmware-only support for new protocols as standards evolve. The industrial temperature grade supports benchtop and portable instrument form factors in laboratory environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CX220YF672E5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX150YF672E5G | 10CX105YF672E5G | 10CX085YF672E5G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 672-ball FBGA (F672) | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same |
| Logic Elements | 220,000 LE | 150,000 LE (-31.8%) | 105,000 LE (-52.3%) | 85,000 LE (-61.4%) |
| Embedded Memory | 11.46 Mbit | 7.65 Mbit (-33%) | 5.51 Mbit (-52%) | 4.45 Mbit (-61%) |
| User I/Os | 236 I/O | 236 I/O (same) | 236 I/O (same) | 236 I/O (same) |
| PCIe Hard IP | Gen2 x4 | Gen2 x4 (same) | Gen2 x4 (same) | Gen2 x2 |
| Transceivers | Up to 12.5 Gbps | Up to 12.5 Gbps (same) | Up to 12.5 Gbps (same) | Up to 6.144 Gbps |
| Speed Grade | E5G (speed grade 5) | E5G (same) | E5G (same) | E5G (same) |
주요 차별점
- Highest logic density in the F672 672-ball FBGA package (vs 10CX150YF672E5G)
- Maximum transceiver count at 220K LE density (vs 10CX085YF672E5G)
- PCIe Gen2 x4 versus PCIe Gen2 x2 in lower-density variants (vs 10CX085YF672E5G)
설계 노트
The 672-ball FBGA package uses 1.0 mm ball pitch, requiring via-in-pad (VIP) or dog-bone fanout on the PCB. For transceiver signal integrity, use a 4-1-4 stackup with the inner stripline layers dedicated to Gbps-rate channels. Estimated: with standard FR4 (Dk=4.2), 50 ohm single-ended trace width is approximately 6 mils on a 4 mil dielectric. Allocate at least 4 PCB layers for power distribution to keep core supply impedance below 1 milliohm at 100 MHz.
Estimated: at typical industrial workloads with 4 active transceivers at 10 Gbps and 60% logic utilization, the 10CX220YF672E5G dissipates approximately 4-6 W. The F672 package has junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W with a properly designed 4-layer PCB thermal pad pattern. For sealed enclosures without airflow, derate by 30% or add a heatsink attached to the package top. Use Intel's Early Power Estimator (EPE) tool for design-specific power analysis before PCB commitment.
The 10CX220YF672E5G requires multiple supply rails: core (VCC = 0.9V), transceiver (VCCH_GXB = 1.0-1.1V), auxiliary (VCCAUX = 1.8V), and I/O (VCCIO = 1.2V-3.3V depending on bank). Per the Intel Cyclone 10 GX pin connection guidelines, place a minimum of 24 decoupling capacitors (0.1 uF X7R) within 100 mils of the package balls, plus bulk capacitors (22 uF) on each rail. Sequence power rails according to the datasheet power-up sequencing requirements to avoid latch-up damage.
규정 준수 정보
RoHS and REACH compliant per Intel product declaration. Industrial extended temperature grade (0 C to +100 C). Halogen-free per Intel product roadmap. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade part.