EP3C5F256C6 - Cyclone III FPGA 5K LE, 256-FBGA | Intel / Altera
부품 번호: EP3C5F256C6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $37.7 | $37.70 |
| 10 | $33.85 | $338.50 |
| 100 | $28.94 | $2,894.00 |
| 500 | $24.32 | $12,160.00 |
| 1,000 | $21.4 | $21,400.00 |
EP3C5F256C6 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure digital logic blocks, routing, and I/O after fabrication. Within the broader hierarchy, FPGAs sit below ASICs in performance-per-watt but above CPLDs in logic capacity, making them the workhorse of rapid prototyping, low-volume production, and accelerator designs. The Cyclone III family specifically targets low static and dynamic power consumption versus the older Cyclone II generation.
Key features include 5,136 logic elements, 423,936 RAM bits distributed across M9K blocks, 23 embedded 18x18 multipliers for DSP-style arithmetic, and up to 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended standards. The device integrates four phase-locked loops (PLLs) for clock generation and skew management, plus configuration support via active serial (AS), passive serial (PS), and JTAG interfaces.
Architecturally, the Cyclone III LE combines a 4-input look-up table (LUT) with a programmable register, embedded memory blocks, and dedicated multiplier hardware on a low-k, 65 nm process. This combination allows designers to implement soft-core processors (such as Nios II), custom peripherals, and DSP datapaths on a single device while keeping power in the hundreds of milliwatts range.
Typical applications include industrial motor control and machine vision, low-cost video processing pipelines, communications protocol bridging (SPI, I2C, UART, Ethernet MAC glue logic), consumer electronics display controllers, and educational/development platforms where the Quartus II design toolchain is supported. The 256-FBGA package offers a compact 17 mm x 17 mm footprint with 1.0 mm ball pitch suitable for multilayer PCBs.
When designing with this FPGA, plan power sequencing for the core and I/O banks, provide adequate decoupling on every bank supply, and use the Quartus II PowerPlay estimator early to verify thermal margins under your worst-case toggle rate. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet.
드롭인 대체품: EP3C5F256C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5F256C6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, RoHS Status, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C5F256C8N
✅ 드롭인✓ 재고 있음
$10.95 / 개
데이터시트 보기 →EP3C5F256I7N
✅ 드롭인✓ 재고 있음
$24 / 개
데이터시트 보기 →EP3C5F256A7N
✅ 드롭인✓ 재고 있음
$24.4 / 개
데이터시트 보기 →EP3C10F256C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$15.4 / 개
데이터시트 보기 →EP3C25F256C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$38.95 / 개
데이터시트 보기 →EP3C16F256I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$38.5 / 개
데이터시트 보기 →EP3C5F256C6 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | 423,936 bits |
| Embedded Memory | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | 23 |
| User I/Os | 182 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) |
| Process Technology | 65 nm CMOS, low-k |
| 패키지 | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) |
| Configuration Modes | AS, PS, JTAG |
| RoHS 상태 | Compliant (lead-free per FBGA package) |
EP3C5F256C6 256-pin fbga (fineline bga), 17 x 17 mm, 1.0 mm pitch 핀 구성 가이드
EP3C5F256C6(256-pin fbga (fineline bga), 17 x 17 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C5F256C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C5F256C6 적합 용도: 7 애플리케이션s: Industrial Motor Control, Low-Cost Video Processing Pipelines, Communications Protocol Bridging, Consumer Display Controllers, Soft-Core Processor Embedded Control, Educational FPGA Development Boards, Machine Vision Pre-Processing.
Industrial Motor Control
The EP3C5F256C6 is well-suited for industrial motor-control and drive interfaces because its 5,136 logic elements, 23 embedded 18x18 multipliers, and 4 PLLs can implement field-oriented control (FOC) loops, PWM generation, encoder decoding, and protection logic in a single device. Per the Cyclone III datasheet, the 182 user I/Os allow direct connection to multi-axis Hall sensors, QEI decoders, gate drivers, and isolated communication links. The 65 nm low-power process keeps dissipation low enough for fanless industrial enclosures, while the commercial temperature grade (0C to +85C) suits cabinet-mounted drives.
추천
Low-Cost Video Processing Pipelines
The EP3C5F256C6 handles entry-level video bridging and on-screen display overlay tasks: its M9K memory blocks provide line buffers for up to HD-resolution video, while the 23 DSP blocks can implement color-space conversion and scaling interpolation. Per the Cyclone III device datasheet, the 256-FBGA supports LVDS pairs commonly used in camera serial interface (CSI-2) and display bridge applications. The compact 17x17 mm footprint suits set-top boxes, low-end signage players, and educational vision platforms.
추천
Communications Protocol Bridging
The EP3C5F256C6 excels as a protocol-bridging hub between UART, SPI, I2C, CAN, and Ethernet MAC interfaces: the 5K logic elements are sufficient for soft MAC implementations and protocol state machines, while 4 PLLs generate independent reference clocks for each interface. Per the Cyclone III datasheet, mixed-voltage I/O banks (1.2V to 3.3V) enable direct connection to legacy 5V-tolerant transceivers through external level shifters. The 182 I/Os accommodate multiple concurrent peripherals in industrial gateway products.
추천
Consumer Display Controllers
The EP3C5F256C6 fits consumer display controllers and small-format TFT/LCD timing-control designs: its 23 embedded multipliers accelerate backlight dimming and gamma correction, while the 4-input LUTs implement timing generators and TCON logic. Per the Cyclone III datasheet, the LVDS and LVCMOS I/O support direct drive of most small-to-medium LCD panels. The low-power 65 nm process keeps thermal rise inside sealed display housings without active cooling.
추천
Soft-Core Processor Embedded Control
The EP3C5F256C6 comfortably hosts a Nios II soft-core processor with on-board peripherals: 5,136 LEs, 423 Kbit embedded memory, and 23 multipliers are sufficient for control-plane tasks, custom register interfaces, and modest signal processing. Per the Cyclone III datasheet, JTAG debug, AS/PS configuration, and Quartus II toolchain support make it a productive platform for low-volume embedded products. The 256-FBGA package footprint is well-supported by reference designs and dev kits.
추천
Educational FPGA Development Boards
The EP3C5F256C6 is a workhorse for university and hobbyist FPGA training kits: its 5K LE density, 256-ball FBGA, and Quartus II Web Edition toolchain (free) make it an ideal learning platform. Per the Cyclone III datasheet, the device supports all standard lab exercises - counters, state machines, UART cores, simple CPUs - while remaining affordable in educational kit quantities. Reference designs and university courseware target this density tier.
추천
Machine Vision Pre-Processing
The EP3C5F256C6 is a strong fit for entry-level machine vision pre-processing tasks such as image thresholding, simple convolution, and feature extraction: 23 dedicated 18x18 multipliers accelerate small kernel filtering, while 423 Kbit embedded memory provides line and frame buffers for VGA-resolution streams. Per the Cyclone III datasheet, LVDS I/O supports direct interface to industrial cameras, and 4 PLLs generate independent pixel and acquisition clocks. The commercial temperature grade suits factory-floor enclosure designs with adequate cooling.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C5F256C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C5F256C8N | EP3C5F256I7N | EP3C5F256A7N | EP3C10F256C8N | EP3C25F256C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA 17x17 mm | 256-FBGA 17x17 mm (same) | 256-FBGA 17x17 mm (same) | 256-FBGA 17x17 mm (same) | 256-FBGA 17x17 mm (same) | 256-FBGA 17x17 mm (same) |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 5,136 (same) | 10,320 (+101%) | 24,624 (+379%) |
| Embedded Memory Bits | 423,936 | 423,936 (same) | 423,936 (same) | 423,936 (same) | 414,720 (-2%) | 608,256 (+43%) |
| Embedded 18x18 Multipliers | 23 | 23 (same) | 23 (same) | 23 (same) | 46 (+100%) | 66 (+187%) |
| User I/Os (max) | 182 | 182 (same) | 182 (same) | 182 (same) | 182 (same) | 156 (-14%) |
| Speed Grade | 6 | 8 (slower) | 7 (slower) | 7 (slower) | 8 (slower) | 8 (slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive | Commercial | Commercial |
| RoHS / Pb-free | Compliant | Compliant (Pb-free N suffix) | Compliant (Pb-free N suffix) | Compliant (Pb-free N suffix) | Compliant (Pb-free N suffix) | Compliant (Pb-free N suffix) |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
주요 차별점
- Balanced density and I/O for entry-level Cyclone III designs (vs EP3C5E144C8N)
- Faster speed grade 6 than available alternatives (vs EP3C5F256C8N)
- Higher multiplier count than lower-density siblings (vs EP3C5F256A7N)
설계 노트
The EP3C5F256C6 requires a 1.2 V VCCINT core supply plus per-bank VCCIO supplies (1.2 V to 3.3 V). Per the Cyclone III datasheet, ramp VCCINT before or simultaneously with VCCIO to prevent I/O latch-up; use a power-supply sequencer if your rails share a common enable. Place 100 nF decoupling on every VCCINT pin and 1 uF bulk capacitors on each VCCIO bank as close to the BGA balls as the PCB escape routing allows.
Estimated: at typical toggle rates the EP3C5F256C6 dissipates around 0.5 W to 1.5 W core power. With the 256-FBGA theta_JA in the 30 C/W range (per family datasheet), a 1 W dissipation yields a ~30 C junction rise. For sealed industrial enclosures, model the worst-case dissipation in Quartus II PowerPlay and add thermal vias beneath the package thermal pad to keep Tj below 85 C for the commercial grade.
Route the 256-FBGA with at least a 4-layer PCB (signal / GND / PWR / signal) using microvia-in-pad if you need to escape the 1.0 mm pitch BGA cleanly. Per the Cyclone III family handbook, keep differential pairs matched within 10 mil and reference each high-speed serial interface (LVDS) over a continuous ground plane to control impedance near 100 ohm differential.
Choose Active Serial (AS) configuration for self-boot from a low-cost EPCS flash; JTAG for in-system programming and debug. Per the Cyclone III datasheet, the MSEL[2..0] pins must be tied to select the configuration mode; pull-ups or pull-downs are required at board level to set the boot mode reliably and avoid configuration failure on noisy reset events.
Do not exceed the VCCINT absolute maximum of 1.25 V - over-voltage is a common failure mode during lab bring-up. Per the Cyclone III handbook, do not leave JTAG TCK floating; tie it through a 1 kohm pull-down or pull-up to a defined logic level. Always generate the final bitstream with the exact speed grade and temperature grade selected in the Quartus II device options - mismatched settings can produce timing failures.
규정 준수 정보
RoHS compliant per FBGA lead-free package per the Cyclone III family documentation. Choose EP3C5F256A7N for automotive AEC-Q100 needs.
