EP3SE260F1517C2G - 260K LE Stratix III FPGA | Altera | Intel
부품 번호: EP3SE260F1517C2G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2800 | $2,800.00 |
| 10 | $2650 | $26,500.00 |
| 100 | $2400 | $240,000.00 |
| 500 | $2200 | $1,100,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
EP3SE260F1517C2G 개요
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device whose fabric is composed of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, on-chip memory, and increasingly integrated transceivers and hard processor cores. FPGAs sit between general-purpose processors (CPUs) and application-specific integrated circuits (ASICs) in the compute hierarchy: like a CPU they can be reprogrammed in the field, but like an ASIC they implement custom hardware parallelism measured in hundreds of GHz-equivalent multiply-accumulates. Stratix III is positioned in the high-performance tier, ahead of Cyclone III for cost-sensitive applications and behind Stratix IV/V for the highest-end designs.
Key features of the EP3SE260 variant include eight fractional-phase PLLs, four clock multiplier PLLs, and clock networks with up to 220 MHz performance. The device supports external memory interfaces including DDR, DDR2, DDR3, QDR II, and RLDRAM II through dedicated PHY blocks. High-speed serial connectivity is provided through 12 transceiver channels up to 3.75 Gbps (C2 speed grade), supporting PCIe Gen1 x4/x8, Serial RapidIO, Gbps Ethernet, and basic mode (XAUI-ready).
Typical applications include ASIC prototyping, high-definition video processing, software-defined radio, wireline telecom aggregation, military radar, and test and measurement instrumentation. The large logic capacity and embedded multiplier density make the EP3SE260 well suited to baseband processing and FFT acceleration at sample rates above 200 MHz.
When designing with this device, plan power distribution carefully: the FCBGA package typically requires 16+ PCB power and ground plane layers and 4 to 6 voltage rails (VCC, VCCPD, VCCPGM, VCCA_PLL, VCCIO, VTT). Use the Quartus II PowerPlay early power estimator before schematic capture. The 1517-ball FCBGA demands precision assembly (1.0 mm ball pitch) and Xilinx/Intel-recommended PCB footprint with via-in-pad capability.
This page synthesizes distributor stock data, package-level pin compatibility information, and FPGA-class design considerations into a single reference that complements (does not duplicate) the Altera/Intel Stratix III Device Handbook.
드롭인 대체품: EP3SE260F1517C2G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1517C2G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature Grade, Process Node, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260F1517C2
✅ 드롭인✓ 재고 있음
$15800 / 개
데이터시트 보기 →EP3SE260F1517C2N
✅ 드롭인✓ 재고 있음
$4750 / 개
데이터시트 보기 →EP3SE260F1517C2G
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP3SE260F1152C2G
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP3SE260F1152C2
✅ 드롭인✓ 재고 있음
$2400 / 개
데이터시트 보기 →EP3SE260F1517C2G 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements | 254,400 |
| Adaptive Logic Modules (ALMs) | 81,760 |
| Total Memory Bits | 16,727,680 (16.67 Mbit) |
| Embedded Memory (M9K Blocks) | 864 |
| Embedded Multipliers (18x18) | 768 |
| User I/O Pins | 976 |
| Transceiver Channels | 12 |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU |
| Global Clock Networks | 20 |
| 패키지 | 1517-ball FCBGA, 40x40 mm |
| Speed Grade | C2 (commercial, ~6 ns) |
| 동작 온도 | 0C to 85C (commercial, "C" suffix) |
| Process Node | 40 nm TSMC |
| RoHS 상태 | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
EP3SE260F1517C2G 1517-ball fcbga, 40x40 mm 핀 구성 가이드
EP3SE260F1517C2G(1517-ball fcbga, 40x40 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1517C2G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260F1517C2G 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Definition Video Processing, Software-Defined Radio Baseband, Wireline Telecom Aggregation, Test and Measurement Instrumentation, Military Radar and Signal Intelligence.
ASIC Prototyping and Emulation
The EP3SE260F1517C2G is a strong fit for ASIC prototyping platforms where designers need to validate register-transfer-level (RTL) designs at near-silicon speed before committing to mask costs. With 254,400 logic elements organized into 81,760 ALMs and 16.67 Mbits of embedded memory in 864 M9K blocks, the device can map a 20-million-gate ASIC when paired with a multi-FPGA partitioning tool. The 768 18x18 multipliers support DSP-heavy pre-silicon validation. Quartus II provides prototyping flows for Stratix III E family with TimeQuest timing closure and SignalTap II embedded logic analyzer. The 1517-ball FCBGA exposes 976 user I/Os for bridging to ASIC emulation headers at 200+ MHz; plan PCB layer stack for the 6-rail power tree.
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High-Definition Video Processing
The EP3SE260F1517C2G serves high-definition video processing pipelines that require real-time pixel-rate handling for 1080p60 or 4K ready front-ends. The 768 embedded 18x18 multipliers implement FIR filters and motion-estimation engines; the 12 transceivers up to 3.75 Gbps aggregate SDI, HDMI, or DisplayPort 1.1 ingest/egress channels. The 864 M9K blocks at 16.67 Mbits provide line buffers for deinterlacing and chroma resampling. The 8 fractional PLLs generate independent video clocks (27 MHz, 74.25 MHz, 148.5 MHz) from a single 27 MHz reference. The C2 commercial speed grade supports 220 MHz fMAX, which exceeds the pixel clock of single-link DVI (165 MHz) and HD-SDI (148.5 MHz).
추천
Software-Defined Radio Baseband
Software-defined radio baseband processing on the EP3SE260F1517C2G benefits from the dense 18x18 multiplier array (768) and 16.67 Mbits of on-chip RAM for FFT scratch buffers and channel equalizer state. At a 220 MHz fabric rate, the device can implement a 2048-point complex FFT in under 10 microseconds and support LTE 20 MHz or WiMAX channelization. The 12 transceivers connect directly to wideband ADC/DAC pairs such as the TI ADC16DX370 and AD9789. The 976 user I/Os accommodate CPRI/OBSAI fabric, GPIO, and front-panel control buses. Use Quartus II DSP Builder for rapid FFT/FIR generation.
추천
Wireline Telecom Aggregation
The EP3SE260F1517C2G is used in wireline telecom aggregation line cards that combine multiple Gbps Ethernet, OTU1, or SDH/SONET streams onto higher-rate uplinks. The 12 transceiver channels at 3.75 Gbps support Gbps Ethernet (1G/2.5G), PCIe Gen1 x1/x4, and basic-mode (XAUI-ready) protocols. The 864 M9K blocks implement packet buffers and look-up tables for QoS classification. The C2 commercial speed grade (0C to 85C) suits temperature-controlled central-office environments. Stratix III E dedicated external memory interfaces support DDR3 at up to 533 MHz, enabling deep packet buffers with commodity DRAM.
추천
Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and bit-error-rate testers deploy the EP3SE260F1517C2G to capture, generate, and pattern-match high-speed serial buses. The 12 transceivers up to 3.75 Gbps aggregate multiple channels of SATA, SAS, PCIe, USB 3.0 (basic-mode), and Serial RapidIO traffic for non-intrusive monitoring. The 768 multipliers accelerate CRC, scrambling, and bit-error-rate computations in real time. The 16.67 Mbits of embedded memory stores capture traces and pattern sequences; the 976 user I/Os drive LCD/keypad front panels and external trigger buses. The C2 commercial speed grade is well suited to lab-grade instrumentation.
추천
Military Radar and Signal Intelligence
The EP3SE260F1517C2G can be specified for military radar and SIGINT applications when sourced through the equivalent industrial or military temperature grade (EP3SE260F1517I2 or EP3SE260F1517A2); the C2 commercial grade itself (0C to 85C) is intended for benign environments. With 768 multipliers the device supports pulse-Doppler FFTs, beamforming, and channelization across 200 MHz instantaneous bandwidth. The 12 transceivers connect to digital receivers and direct digital synthesizers; the 976 user I/Os interface to legacy data links. The 1517-ball FCBGA supports ruggedized board-stack assembly. Verify the temperature grade before deployment and apply the Stratix III radiation-mitigation guide for high-altitude or space use.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE260F1517C2G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260F1517C2 | EP3SE260F1517C2N | EP3SE260F1152C2G | EP3SE260F1152C2 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-ball FCBGA | 1517-ball FCBGA (same) | 1517-ball FCBGA (same) | 1517-ball FCBGA family (different pin map) | 1517-ball FCBGA family (different pin map) |
| Logic Elements | 254,400 | 254,400 (same die) | 254,400 (same die) | 254,400 (same die) | 254,400 (same die) |
| Speed Grade | C2 (commercial) | C2 | C2 | C2 | C2 |
| User I/O Pins | 976 | 976 | 976 | 736 (F1152 variant) | 736 (F1152 variant) |
| Transceiver Channels | 12 (3.75 Gbps) | 12 (3.75 Gbps) | 12 (3.75 Gbps) | 12 (3.75 Gbps) | 12 (3.75 Gbps) |
| Embedded Multipliers (18x18) | 768 | 768 | 768 | 768 | 768 |
| Embedded Memory (M9K) | 864 blocks / 16.67 Mbit | 864 blocks / 16.67 Mbit | 864 blocks / 16.67 Mbit | 864 blocks / 16.67 Mbit | 864 blocks / 16.67 Mbit |
| RoHS / Halogen-Free | Yes / Yes (G suffix) | Compliant / unknown | Compliant / unknown | Yes / Yes (G suffix) | Compliant / unknown |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- RoHS-compliant halogen-free Pb-free tray packaging (G suffix) (vs EP3SE260F1517C2)
- Same-die variant with smaller pin-count FCBGA available for cost-down (vs EP3SE260F1152C2G)
- Highest transceiver count in the Stratix III E family at this speed grade (vs EP3SE110F780C2)
설계 노트
The EP3SE260F1517C2G requires multiple supply rails per the Stratix III Device Handbook: VCC core (0.9 V), VCCPD (2.5 V/3.0 V), VCCIO (1.2-3.3 V per bank), VCCA_PLL (1.2 V), VCCPGM (1.8 V/3.3 V), and dedicated transceiver supplies (VCCE/VCCT/VCCR/VCCH). Use PowerPlay Early Power Estimator before schematic capture. Estimated: at 200 MHz fMAX, 50% toggle rate, 70% resource utilization, total power can reach 10-12 W with transceivers active; allocate 0.9 V core copper pour over at least 4 inner layers with via stitching for thermal relief.
The 1517-ball FCBGA package relies primarily on PCB copper heatsinking (no integrated heatsink). Estimated: at 12 W total dissipation the junction-to-ambient thermal resistance with the recommended 4-layer board stack is approximately 4-6 C/W. Without airflow, junction temperature can exceed 100 C; the C2 commercial grade is rated 0C to 85C ambient. For sealed enclosures, specify an industrial-temperature F1517I2N variant or apply forced-air cooling. Use thermal vias directly under the BGA with 0.3 mm drill and 1.0 mm pitch.
The 1517-ball FCBGA requires precision PCB construction with 1.0 mm ball pitch and via-in-pad (VIP) technology for signal breakout. Use the Altera-recommended footprint with NSMD pads 0.45 mm in diameter. Stackup must include at least 6 layers (4 for power, 2 for signal with impedance control 50 ohm SE / 100 ohm diff). Apply surface finish ENIG for reliable BGA assembly. Decoupling capacitors: place 0402 0.1 uF X7R on every VCC/VCCPD pin pair within 2 mm trace length; add bulk 22 uF X5R per VCCPD region.
Transceiver channels are highly sensitive to PCB layout: route differential pairs with 100 ohm differential impedance and length-matching within 150 mil. Reference transceiver channels to a clean ground plane with no splits; do not cross plane splits under the BGA. Place the reference clock (typically 156.25 MHz) within 200 mil of the clock pin. Follow the Stratix III Device Handbook PCB Design Guidelines chapter for complete transmitter/receiver board-layout recommendations.
Common pitfalls with the EP3SE260F1517C2G: (1) C2 speed grade is the SLOWEST commercial Stratix III - choose I2/I3/I4 for higher performance, but expect higher power; (2) do not populate the NRND part into new designs unless you have a long-term supply agreement; (3) verify MSL3 moisture sensitivity handling at assembly; (4) the FCBGA cannot be socketed - design for direct solder or use a high-speed Mezzanine connector only for sub-1 Gbps I/O; (5) the part is commercial-grade 0C-85C, not industrial - for harsh environments order F1517I2N or F1517A2N.
규정 준수 정보
RoHS and halogen-free compliance indicated by the G suffix per Altera/Intel ordering-code conventions. Reach SVHC declaration available via Intel product compliance portal. AEC-Q100 not applicable to FPGAs (automotive grade F1517A2N is for non-automotive industrial/military use only).
