EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
부품 번호: EP3SE260F1517C4LN ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1545 | $154,500.00 |
| 500 | $1450 | $725,000.00 |
EP3SE260F1517C4LN 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, configurable interconnect, and dedicated memory/DSP blocks into a single die. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the semiconductor hierarchy of integrated circuits (ICs) > logic ICs > programmable logic. The Stratix III E family is the enhanced logic-and-memory variant of Stratix III, optimized for high logic density and large embedded memory bandwidth in networking, broadcast, and compute-acceleration applications.
Key features of the EP3SE260F1517C4LN include 10,200 LABs (Logic Array Blocks), embedded memory of approximately 16.67 Mbit, support for high-speed transceivers (per Stratix III E family capability), and a fabric architecture engineered for high DSP throughput. The 1517-ball FC-FBGA package uses a flip-chip land-grid construction suitable for high-pin-count, high-bandwidth designs; PCB layout requires multi-layer routing with microvia technology. The 'C4' speed grade and 'LN' suffix combination places this part in the commercial-temperature, lead-free, industrial-grade supply chain.
Typical use cases for this density of Stratix III E FPGA include high-end wireline telecom line cards, broadcast video processing, ASIC prototyping, military/aerospace signal processing, and high-performance DSP pipelines where 255K logic elements and embedded memory bandwidth are required.
When designing with this device, allocate adequate PCB layers (typically 8+) for the FC-FBGA breakout, follow the Altera/Intel power-supply sequencing guidelines for Stratix III, and verify thermal management against the package theta-JA. Cyclone-series parts are pin-compatible only within the same ball-out; Xilinx Virtex-series drop-in alternatives do not exist for this package.
드롭인 대체품: EP3SE260F1517C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1517C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Family, Process Node.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260F1517C4L
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$15100 / 개
데이터시트 보기 →EP3SE260F1517C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8400 / 개
데이터시트 보기 →EP3SE260F1517C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9850 / 개
데이터시트 보기 →EP3SE260F1517C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10800 / 개
데이터시트 보기 →EP3SE260F1517C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4750 / 개
데이터시트 보기 →EP3SE260F1517C2G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP3SE260F1517C2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$15800 / 개
데이터시트 보기 →EP3SE260F1517C4LN 최대 정격 & 전기적 특성
| Series | Stratix III E |
| Family | Stratix III E (Enhanced) |
| Logic Elements | 255,000 |
| Number of LABs/CLBs | 10,200 |
| Total Memory Bits | 16,672,768 (16.67 Mbit) |
| Number of I/O | 976 |
| Voltage - Supply | 0.9 V to 1.1 V core |
| Operating Frequency | 375 MHz to 450 MHz (per family) |
| Process Technology | 65 nm |
| 패키지 / 케이스 | 1517-BBGA, FCBGA (FC-FBGA) |
| 실장 유형 | Surface Mount (flip-chip) |
| 동작 온도 | 0C to +85C (commercial grade per 'C' suffix) |
| 습도 민감도 레벨 (MSL) | 3 (168 Hours) |
| Packaging | Tray |
| Speed Grade | C4 |
| Lead-Free / Halogen-Free | Yes (LN suffix) |
| RoHS 상태 | Compliant |
EP3SE260F1517C4LN 1517-bbga, fcbga (fc-fbga) 핀 구성 가이드
EP3SE260F1517C4LN(1517-bbga, fcbga (fc-fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1517C4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260F1517C4LN 적합 용도: 6 애플리케이션s: Wireline Telecom Line Card Processing, Broadcast Video Processing and Format Conversion, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-Performance DSP and Compute Acceleration, Test and Measurement Instrumentation.
Wireline Telecom Line Card Processing
The EP3SE260F1517C4LN's 255K logic elements and 16.67 Mbit embedded memory make it well suited to high-density wireline telecom line cards that require packet classification, queuing, and forwarding at multi-gigabit rates. With 976 user I/Os, designers can interface directly to multiple SFP/SFP+ optical modules, external TCAMs, and DDR3/QDR memory subsystems. The Stratix III E fabric supports high-throughput on-chip bus architectures (e.g., Avalon, SerialLite II) that telecom designs rely on, and the 1517-ball FC-FBGA package accommodates the dense pin count required for multi-port line cards. Compared to ASIC implementation, this FPGA allows late-stage protocol changes (e.g., OTN, Ethernet, MPLS) without re-spining silicon.
추천
Broadcast Video Processing and Format Conversion
Broadcast video routers and format converters benefit from the EP3SE260F1517C4LN's 255K logic elements for implementing real-time de-interlacers, scalers, and color-space converters at 3G-SDI / HD-SDI rates. The 16.67 Mbit of embedded memory provides frame-buffer and line-buffer storage for video pipelines without requiring external SRAM, reducing BOM cost and PCB complexity. The 976 I/Os accept multiple parallel video data paths plus control/status channels. Designers use the variable-precision DSP blocks in the Stratix III E fabric to accelerate video scaling and chroma-keying operations, achieving broadcast-grade throughput in a single FPGA.
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ASIC Prototyping and Emulation
ASIC prototyping platforms often map multi-million-gate ASIC designs onto one or more EP3SE260F1517C4LN FPGAs because the 255K logic elements, 16.67 Mbit embedded memory, and 976 I/Os provide a high-capacity fabric that scales to large ASIC RTL. The 1517-ball FC-FBGA package exposes enough user I/Os to map debug probe points, clock-domain crossings, and external memory interfaces required for real-world ASIC verification. With the Quartus II design flow and TimeQuest timing analysis, designers partition and synthesize ASIC RTL at speeds close to silicon-emulation performance, allowing pre-tapeout software validation at MHz-scale real-time speeds.
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Military and Aerospace Signal Processing
Defense signal-processing systems leverage the EP3SE260F1517C4LN's 255K logic elements for radar, electronic-warfare (EW), and SIGINT pipelines where high DSP throughput is critical. The variable-precision DSP blocks in the Stratix III E family operate at up to 550 MHz and implement FIR filters, FFTs, and beam-forming algorithms. The 976 I/Os interface to multi-channel ADC/DAC arrays (e.g., EV8AQ160, AD9680) used in radar digitizers. The industrial temperature grade variant (LN suffix) supports the extended thermal envelope typical of MIL-STD-810 applications, though full MIL-spec qualification requires additional screening.
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High-Performance DSP and Compute Acceleration
Compute-acceleration cards and high-performance DSP systems use the EP3SE260F1517C4LN as a co-processor that offloads compute kernels (e.g., FFT, convolution, encryption) from CPUs. The Stratix III E fabric's variable-precision DSP blocks support fixed and floating-point arithmetic at 550 MHz, with hundreds of DSP blocks in this density class. The 16.67 Mbit embedded memory acts as a high-bandwidth on-chip scratchpad reducing external memory accesses. With 976 I/Os, designers connect to host interfaces (PCIe, Serial RapidIO) and to multiple DDR3/QDR memory channels for streaming data.
추천
Test and Measurement Instrumentation
High-end test and measurement instruments (e.g., logic analyzers, protocol analyzers, bit-error-rate testers) leverage the EP3SE260F1517C4LN's 255K logic elements and 976 I/Os to implement deep capture memory and parallel stimulus channels. The 16.67 Mbit embedded memory acts as capture-buffer storage; the LVDS-capable I/Os support multi-Gbps probe interfaces. Designers use the Stratix III E fabric to implement protocol-aware decode logic (e.g., PCIe Gen2, USB 3.0, SATA) directly in the FPGA, eliminating the need for external protocol-analyzer ASICs and enabling late-protocol additions.
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추천 제품 요약
엔지니어링 참조 데이터: EP3SE260F1517C4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260F1517C4L | EP3SE260F1517C4 | EP3SE260F1517C3N | EP3SE260F1517C3 | EP3SE260F1517C2N |
|---|---|---|---|---|---|---|
| Package | 1517-BBGA FC-FBGA | 1517-BBGA FC-FBGA (same) | 1517-BBGA FC-FBGA (same) | 1517-BBGA FC-FBGA (same) | 1517-BBGA FC-FBGA (same) | 1517-BBGA FC-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 255,000 | 255,000 (same die) | 255,000 (same die) | 255,000 (same die) | 255,000 (same die) | 255,000 (same die) |
| Embedded Memory | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit |
| User I/Os | 976 | 976 | 976 | 976 | 976 | 976 |
| Speed Grade | C4 | C4 (same) | C4 (same) | C3 (-1 bin, slower) | C3 (-1 bin, slower) | C2 (-2 bins, slowest) |
| Temperature Grade | Commercial (C-suffix, no N) | Commercial | Commercial | Industrial (N suffix) | Commercial | Industrial (N suffix) |
| Lead-Free / RoHS | Yes (LN suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Highest-density Stratix III E variant with 1517-ball FC-FBGA (vs EP3SE260F1152C4LN)
- C4 speed grade gives highest performance in this density class (vs EP3SE260F1517C3N)
- Lead-free LN suffix enables RoHS/REACH compliance (vs EP3SE260F1517C4 (non-LN))
- Single-FPGA solution for 255K-LE designs (vs Multi-FPGA partitioning with smaller Cyclone/Stratix parts)
설계 노트
The 1517-ball FC-FBGA package has a theta-JA in the 12-15 C/W range depending on PCB stack-up and airflow. At full fabric utilization (estimated 8-12 W typical power consumption for the 255K-logic-element die), the junction temperature rise above ambient is approximately 100-180 C - well within the commercial 0C to +85C operating range if the PCB has adequate thermal vias and copper pours. Estimated: assumed 10 W typical power, theta-JA = 12 C/W. Place a thermal via array under the exposed pad/die flag per the Stratix III E package guidelines.
The 1517-ball FC-FBGA package requires an 8+ layer PCB stack-up with microvia technology (laser-drilled stacked vias) to break out the 1.0 mm pitch BGA. Recommended: 1 oz copper outer layers, 0.5 oz inner layers, 4 mil dielectric between layers. Follow the Intel/Altera Stratix III E board-design guidelines for high-speed transceiver routing (controlled impedance 100 dΩ differential, length matching within 5 mil for TX/RX pairs). Use the Altera Pin Planner to assign pins before laying out the PCB.
The Stratix III E core operates from 0.9 V to 1.1 V and requires a sequenced power-supply ramp per the manufacturer datasheet. Use an Intel/Altera-recommended power-supply sequencer (e.g., LTC3265, ISL6117) to enforce the VCCIO-before-VCCINT-before-VCCAUX ordering during power-up and the reverse ordering during power-down. Estimated: typical supply currents are 5-15 A on VCCINT for full fabric utilization; the PLL/auxiliary rails draw 200-500 mA each.
Do not confuse the 'C4' speed grade with the temperature grade - 'C4' is speed grade only; the trailing 'N' in the part number is the industrial-temperature designator. The LN suffix is required for lead-free/RoHS compliance; non-LN variants are Pb-bearing for legacy aerospace programs. Configuration: this density requires an EPCS64 or larger configuration device; do not use EPCS16 with the 255K-LE die. JTAG chain: confirm the JTAG IDCODE matches Quartus II's expected ID before issuing PROGRAM instruction.
규정 준수 정보
RoHS/REACH compliance per LN (lead-free) suffix. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Stratix III E family does not carry AEC-Q100 qualification; for automotive applications use Cyclone IV/V or newer automotive-grade parts. Conflict-minerals status not explicitly published in the available web data - set to unknown.
