EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
부품 번호: EP3SE260F1517I4LN ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3650 | $36,500.00 |
| 100 | $3380 | $338,000.00 |
| 500 | $3120 | $1,560,000.00 |
| 1,000 | $2895 | $2,895,000.00 |
EP3SE260F1517I4LN 개요
An FPGA is a reconfigurable digital integrated circuit in which the logic function is defined by user-supplied configuration bitstream rather than hard-wired mask layers. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, sequential execution) and ASICs (custom silicon, highest performance, no NRE amortization). Stratix III E specifically targets high-throughput DSP, ASIC prototyping, and datapath-heavy signal-processing designs where the combination of large on-chip memory, dedicated DSP blocks, and high I/O count delivers application-level throughput that discrete ASSPs cannot match. Within Intel's portfolio, the EP3SE260 sits between the Stratix III GX (transceiver-equipped) and the Stratix IV E (next-generation 40 nm low-power enhancement).
Key differentiating features include 24 full-duplex transceivers operating up to 8.5 Gbps (Stratix III E supports up to 12.5 Gbps variants in the family), on-chip termination (OCT), dedicated DSP blocks with up to 384 18x18 multipliers, and partial reconfiguration support that allows a portion of the device to be reprogrammed while the rest remains active. The Programmable Power Technology enables per-LAB power gating at idle, which is why Stratix III E achieves up to 50% lower dynamic power than Stratix II at the same performance. Memory interfaces up to DDR3-1600 are supported via hardened PHY blocks.
Typical applications include high-end ASIC prototyping, multi-channel digital signal processing (radar, software-defined radio), high-speed image processing pipelines, network packet processing at 10G/40G line rates, and military/aerospace command-and-control systems where the industrial temperature range and high logic density justify the BGA footprint. The 1517-ball FCBGA has a 40 mm x 40 mm body with a 1.0 mm ball pitch, requiring HDI PCB stackup with microvia-in-pad assembly.
When designing with this device, allocate sufficient PCB layers for power/ground planes and signal breakout. The 1.0 mm BGA pitch is at the practical limit for cost-effective 4-layer designs - a 6-layer or 8-layer stackup with buried vias is recommended for routing-out all 976 user I/O plus power balls. Thermal management should account for case temperatures up to 100C; the exposed-die FCBGA requires either a heatsink or forced-air cooling at sustained high utilization.
드롭인 대체품: EP3SE260F1517I4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1517I4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260F1517I4L
✅ 드롭인✓ 재고 있음
$2800 / 개
데이터시트 보기 →EP3SE260F1517I4
✅ 드롭인✓ 재고 있음
$10750 / 개
데이터시트 보기 →EP3SE260F1517I3N
✅ 드롭인✓ 재고 있음
$2275 / 개
데이터시트 보기 →EP3SE260F1517I3
✅ 드롭인✓ 재고 있음
$10500 / 개
데이터시트 보기 →EP3SE260F1517I3G
✅ 드롭인✓ 재고 있음
$3520 / 개
데이터시트 보기 →EP3SE260F1517C4LN
✅ 드롭인✓ 재고 있음
$1450 / 개
데이터시트 보기 →EP3SE260F1517C4L
✅ 드롭인✓ 재고 있음
$15100 / 개
데이터시트 보기 →EP3SE260F1517I4LN 최대 정격 & 전기적 특성
| Logic Elements | 255,000 |
| Embedded Memory Bits | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | 10,200 |
| User I/O Count | 976 |
| 패키지 | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Process Technology | 40 nm CMOS |
| Family | Stratix III E (Enhanced) |
| Speed Grade | I4 (industrial, 4th tier) |
| Power Option | L (low-power) |
| 동작 온도 | -40C to +100C (case, industrial) |
| Lead-Free / RoHS | Yes (N suffix) |
| Transceivers | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | Supported |
| Memory Interface Support | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
EP3SE260F1517I4LN 1517-ball fcbga (40 mm x 40 mm, 1.0 mm pitch) 핀 구성 가이드
EP3SE260F1517I4LN(1517-ball fcbga (40 mm x 40 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1517I4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260F1517I4LN 적합 용도: 7 애플리케이션s: ASIC Prototyping and Emulation, High-Throughput Digital Signal Processing, High-Speed Networking Equipment, Military and Aerospace Signal Processing, Medical Imaging Systems, Industrial Test and Measurement Equipment, Broadcast Video Processing.
ASIC Prototyping and Emulation
The EP3SE260F1517I4LN is well suited for ASIC prototyping thanks to its 255,000 Logic Elements, 10,200 LABs, and 16,672,768 bits of embedded memory, which allow partitioning a multi-million-gate ASIC across one or two Stratix III E devices. Designers map ASIC RTL directly into the FPGA fabric and validate timing, throughput, and functional correctness before committing to mask production. The 24 embedded transceivers (up to 8.5 Gbps) enable real-world I/O modeling at PCIe Gen2, Serial RapidIO, 10G Ethernet, and SATA line rates, avoiding behavioral-only emulation. The 1.0 mm-pitch FCBGA exposes 976 user I/O for breakout to multi-FPGA debug boards; HDI stackups are required. Compared to ASIC validation in simulation, FPGA prototyping runs 100-1000x faster at the cost of 5-10x area overhead and 3-5x power consumption.
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High-Throughput Digital Signal Processing
The EP3SE260F1517I4LN's hardened 18x18 multiplier blocks (up to 384 across the family) deliver DSP throughput exceeding 200 GMACs at the I4 speed grade, suitable for multi-channel radar baseband, software-defined radio, and real-time video processing pipelines. The combination of 16,672,768 bits embedded memory plus external DDR3 interface support at 1600 MT/s allows line-rate buffering of FFT windows, FIR filter states, and image frames without off-chip SRAM. For a 64-channel 1024-point FFT at 250 MHz sample rate, the EP3SE260 absorbs all logic, multipliers, and coefficient storage on-die. Industrial temperature grade (-40C to +100C) allows deployment in outdoor base-station and avionics enclosures. Trade-off: the 40 nm process means lower performance-per-watt than 28 nm Stratix V/10 or Agilex alternatives.
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High-Speed Networking Equipment
With 24 transceivers capable of 8.5 Gbps and 976 user I/O plus external PHY interfaces, the EP3SE260F1517I4LN serves as a network processor for 10G/40G line cards, packet classifiers, and traffic managers in carrier-grade routers and switches. The fabric implements CAM-based lookup engines, deep queue managers (leveraging the 2 MB on-chip memory), and protocol-specific state machines for MPLS, VLAN, and IPsec offload at line rate. The Industrial temperature grade and lead-free finish suit NEBS-compliant telecom chassis. Hardened PCI Express Gen2 IP blocks enable direct host CPU attachment without external bridge chips. Compared to dedicated NPUs (Ezchip, Broadcom XLP), the FPGA wins on flexibility and time-to-market but loses on cost-per-port at high volumes.
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Military and Aerospace Signal Processing
The EP3SE260F1517I4LN's industrial operating range (-40C to +100C case), lead-free RoHS-compliant terminal finish, and large logic/memory capacity make it a candidate for ruggedized military and aerospace signal-processing subsystems including electronic warfare (EW), SIGINT, and radar front-end preprocessing. The 1517-ball FCBGA is vibration-resistant and provides the thermal mass for conduction-cooled VPX chassis deployments. Conformal coating and underfill are typically added at board level. Firmware can implement adaptive beamforming, channelization, and pulse compression in the FPGA while the host processor handles mission-level state. Trade-off: aerospace programs increasingly mandate Rad-Hard-by-Design (RHBD) silicon; the EP3SE260 is commercial-grade and typically used in non-critical or redundant subsystems only.
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Medical Imaging Systems
The EP3SE260F1517I4LN's high logic density and embedded memory make it suitable for real-time image reconstruction in CT, MRI, and ultrasound scanners where multiple parallel processing pipelines must meet sub-second latency budgets. 18x18 multipliers accelerate back-projection and iterative reconstruction algorithms (SART, MBIR) at full sensor data rate. The 8.5 Gbps transceivers accept raw data from line-array or area-array CMOS sensors over LVDS or sub-LVDS links without intermediate buffers. Industrial temperature grade supports continuous-operation imaging suites. The 1517-FCBGA package integrates the high pin count required for 16-32 channel parallel sensor interfaces plus external DDR3 sample buffers. Consider medical-grade reliability documentation and IEC 60601-1 compliance at the system level, not at the silicon level.
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Industrial Test and Measurement Equipment
ATE (Automatic Test Equipment), protocol analyzers, and high-speed oscilloscopes use the EP3SE260F1517I4LN to implement pattern generation, waveform capture, and protocol-decode logic at multi-gigabit rates. The 8.5 Gbps transceivers handle PCIe, USB 3.0, SATA, and 10G Ethernet stimulus/response; the 976 user I/O accommodate parallel LVDS buses for legacy ATE pin electronics channels. The 16,672,768 bits embedded memory buffers capture traces before offload to host; external DDR3-1600 interface extends capture depth for long pattern runs. Industrial temperature grade allows deployment in production-floor environments without climate control. The 1.0 mm-pitch FCBGA requires HDI PCB design and microvia-in-pad assembly, raising BOM cost but enabling compact ATE head assemblies.
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Broadcast Video Processing
The EP3SE260F1517I4LN's combination of large logic capacity, embedded memory, and high I/O count suits broadcast video switchers, format converters, and 4K/UHD processing pipelines. The 18x18 multipliers implement polyphase scalers and color-space conversion kernels; the embedded memory buffers line/field delays for deinterlacing and frame-rate conversion. SDI, HDMI, and DisplayPort interfaces are implemented via external PHY plus FPGA-side protocol logic, with transceivers supporting 3G-SDI and emerging 12G-SDI standards. Industrial temperature range handles studio and headend environments. Compared to ASSP video processors, the FPGA wins on format flexibility (any resolution, any frame rate) but loses on cost and power efficiency for fixed-format consumer-grade products.
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추천 제품 요약
엔지니어링 참조 데이터: EP3SE260F1517I4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260F1517I4L | EP3SE260F1517I4 | EP3SE260F1517I3N | EP3SE260F1517I3 | EP3SE260F1517I3G | EP3SE260F1517C4LN | EP3SE260F1517C4L |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1517-FCBGA (40x40 mm, 1.0 mm pitch) | 1517-FCBGA (same) | 1517-FCBGA (same) | 1517-FCBGA (same) | 1517-FCBGA (same) | 1517-FCBGA (same) | 1517-FCBGA (same) | 1517-FCBGA (same) |
| Logic Elements | 255,000 | 255,000 (same) | 255,000 (same) | 255,000 (same) | 255,000 (same) | 255,000 (same) | 255,000 (same) | 255,000 (same) |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 (same) | 16,672,768 (same) | 16,672,768 (same) | 16,672,768 (same) | 16,672,768 (same) | 16,672,768 (same) | 16,672,768 (same) |
| User I/O Count | 976 | 976 (same) | 976 (same) | 976 (same) | 976 (same) | 976 (same) | 976 (same) | 976 (same) |
| Speed Grade | I4 (industrial) | I4 (industrial) | I4 (industrial) | I3 (industrial, faster) | I3 (industrial, faster) | I3 (industrial, faster) | C4 (commercial, slower) | C4 (commercial, slower) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Low-Power Option (L) | Yes (L suffix) | Yes | No (standard power) | No (standard power) | No (standard power) | No (standard power) | Yes | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Highest-tier speed grade (I4) at low-power (L) with industrial temp and lead-free finish (vs EP3SE260F1517C4LN)
- Industrial temperature range with lead-free finish (vs EP3SE260F1517C4L)
- Maximum logic and I/O density in the Stratix III E family (vs EP3SE110F1152I4LN)
설계 노트
The 1517-ball FCBGA with 1.0 mm ball pitch demands an HDI PCB stackup of at least 6 layers with microvia-in-pad construction. Use sequential lamination with 1+1+1+1+1 or 2+2+2 build-up. Route signal breakout on the top layer, escape to inner layers through microvias, and dedicate at least two internal planes to GND and two to core/IO VCC. Power planes must be solid copper (no cross-hatching) under the BGA field to deliver the high transient currents of 24 transceivers simultaneously switching at 8.5 Gbps.
The FCBGA package requires thermal management for industrial operation up to +100C case. With all 24 transceivers active and high logic utilization, junction power can exceed 15 W. Attach a heatsink with thermal interface material (TIM) to the package top, or use a thermal-conduction lid via the PCB. Forced-air cooling at 200-400 LFM is recommended for chassis-mounted designs; convection-only designs should de-rate utilization below 70% to stay within the case-temperature envelope. Use the Stratix III PowerPlay early power estimator before final layout.
Configure on-chip termination (OCT) for LVDS and HSTL I/O standards to eliminate external resistor networks. For 8.5 Gbps transceiver channels, follow the Stratix III High-Speed Differential I/O Layout Guide: maintain 100 ohm differential impedance with 8 mil trace width on a 4 mil dielectric to inner GND, length-match within 5 mil, and avoid right-angle bends. Use AC-coupling capacitors (100 nF X7R 0402) on each P and N line of transceiver channels.
Do not use the EP3SE260F1517I4L (drop-in alternative without the LN suffix) if your design relies on lead-free RoHS compliance specifically tested for the LN variant - the L suffix denotes low-power option but the N suffix denotes the specific lead-free finish. Verify both suffixes match your board assembly profile. Also note that the I4 vs I3 vs C4 speed grade affects timing closure: if you migrate from I4 to I3 you gain margin but consume more power.
규정 준수 정보
RoHS-compliant per 'N' suffix in MPN per Altera/Intel product page. Last-time-buy status confirmed via distributor channels. Halogen-free status not explicitly stated in provided data - set to 'unknown'. AEC-Q100 not applicable (FPGA, not automotive discrete).
