Altera

EP3SE260F1517I4 - Stratix III E FPGA, 255K LE, 1517-FCBGA | Altera

부품 번호: EP3SE260F1517I4 ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

1.1 V Vdss 1517-BBGA, FCBGA, 40 mm Package 450 MHz Speed 16,672,768 Memory

시작가 $10750 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-09

볼륨 가격

수량	단가	합계
1	$13239.5	$13,239.50
10	$12500	$125,000.00
100	$11800	$1,180,000.00
500	$11200	$5,600,000.00
1,000	$10750	$10,750,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP3SE260F1517I4 개요

The Intel (formerly Altera) EP3SE260F1517I4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1,517-ball flip-chip BGA package. Built on a 65 nm process and operating at 1.1 V core with 450 MHz core performance, it targets high-throughput DSP, ASIC prototyping, and high-speed serial interconnect designs. The 1,517-pin FCBGA measures 40 mm on a side and provides the I/O density required by parallel memory buses and multi-gigabit transceivers.

An FPGA is a user-programmable semiconductor whose logic fabric and routing are defined after manufacture by a configuration bitstream, allowing one silicon platform to be repurposed across many designs. Within the FPGA taxonomy, the Stratix III E family sits in the high-performance, logic-and-DSP-rich tier (FPGA -> SRAM-based FPGA -> high-density FPGA -> programmable logic device -> semiconductor IC), making it suitable for compute-intensive datapaths rather than glue logic. The 1.1 V core voltage and 65 nm node give a power-performance envelope that newer 28 nm and 14 nm families have since surpassed.

Key features include 255,000 logic elements organized into 10,200 LABs (Logic Array Blocks), 16,672,768 embedded memory bits, 768 embedded 18x18 multipliers, and 12 embedded transceivers supporting multi-gigabit serial protocols. The 'I4' speed grade and industrial temperature rating (-40C to +100C operating) are confirmed by the Altera ordering code, and the FCBGA-1517 substrate enables the I/O count required for DDR3/DDR4 memory controllers, PCI Express Gen2 hard IP, and parallel LVDS interfaces.

Architecturally, Stratix III E devices use a programmable power technology that dynamically scales core voltage per region, reducing dynamic power by up to 30% versus prior Stratix generations. The embedded transceivers support data rates up to 6.375 Gbps depending on speed grade, and the device integrates hard memory controllers, a PCI Express hard IP block, and a security-enabled configuration engine. Designers typically use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and bitstream generation.

Typical applications include high-end ASIC prototyping and emulation, high-definition video broadcast equipment, military radar signal processing, test and measurement instrumentation, high-speed data acquisition systems, and telecommunications line cards. The combination of 255K logic elements and 768 DSP blocks makes the part especially well suited to multi-channel FIR filtering, FFT engines, and software-defined radio baseband processing.

When designing with this part, note that Stratix III E devices are mature: Altera has issued multiple hardware errata and recommends designers review the Stratix III device handbook and errata sheets. The 1,517-ball FCBGA requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for transceiver channels, and a heatsink or thermal pad because junction-to-ambient thermal resistance is non-trivial at full utilization.

This page synthesizes distributor pricing, drop-in Stratix III speed-grade alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet alone.

드롭인 대체품: EP3SE260F1517I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1517I4 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Speed Grade, Package, Operating Temperature, Process Node.

EP3SE260F1517C2

Altera

Speed Grade: C2

Package: 1517-BBGA, FCBGA

Process Node: TSMC 40 nm

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517C3

Intel

Speed Grade: 3

Package: 1517-BBGA, FCBGA (FineLine BGA)

Process Node: 65 nm (TSMC)

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517C4

Altera

Family: Stratix® III E FPGA

Speed Grade: -4

Package: 1517-BBGA, FCBGA

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517C4N

Intel

Family: Field-Programmable Gate Array (FPGA)

Package: 1517-BBGA, FCBGA

Operating Temperature: 0°C to 85°C

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517I3

Intel

Package: 1517-BBGA, FCBGA

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517I3G

Intel

Package: 1517-ball FC-FBGA (Flip-Chip BGA)

Process Node: 65 nm

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517I3N

Intel

Family: Stratix® III E

Speed Grade: -3 (fastest)

Package: 1517-ball FC-FBGA

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517I4L

Intel

Family: Stratix III Enhanced (E)

Speed Grade: I4

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517I4LN

Intel

Family: Stratix III E (Enhanced)

Speed Grade: I4 (industrial, 4th tier)

Package: 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch)

비교 대상: EP3SE260F1517I4 →

EP3SE260F1517I4N

Intel

Package: 1517-BBGA, FCBGA

Operating Temperature: -40 °C to +100 °C (Industrial)

비교 대상: EP3SE260F1517I4 →

✅ 드롭인

Intel

📦 1517-BBGA, FCBGA

Intel (formerly Altera) · Stratix III E · 255,000 · 10,200 · 16,672,768 bits (16.67 Mbit) · 976 · 768 · 12

✓ 재고 있음

$10800 / 개

데이터시트 보기 →

EP3SE260F1517I4 최대 정격 & 전기적 특성

Family	Stratix III E
Logic Elements	255,000
Logic Array Blocks (LABs)	10,200
Embedded Memory Bits	16,672,768
Embedded 18x18 Multipliers	768
User I/O Pins	976
Embedded Transceivers	12
Process Technology	65 nm
Core Voltage	1.1 V
Maximum Core Frequency	450 MHz
Speed Grade	I4 (industrial)
동작 온도	-40C to +100C (industrial)
패키지	1517-BBGA, FCBGA, 40 mm
실장 유형	Surface Mount
MSL 레벨	3 (168 Hours)

EP3SE260F1517I4 1517-bbga, fcbga, 40 mm 핀 구성 가이드

EP3SE260F1517I4(1517-bbga, fcbga, 40 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP3SE260F1517I4의 1517-bbga, fcbga, 40 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1517I4.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP3SE260F1517I4 적합 용도: 6 애플리케이션s: High-Throughput ASIC Prototyping and Emulation, High-Definition Video Broadcast Equipment, Military Radar and Electronic Warfare Signal Processing, Test and Measurement Instrumentation, Telecommunications Line Cards and Baseband Processing, High-Speed Data Acquisition Systems.

🖥️

High-Throughput ASIC Prototyping and Emulation

The EP3SE260F1517I4's 255,000 logic elements and 16,672,768 bits of embedded memory make it ideal for ASIC prototyping and in-circuit emulation of multi-million-gate designs. Its 10,200 LABs and 768 18x18 multipliers map RTL into real hardware at speeds close to the final ASIC, letting engineers validate firmware, system behavior, and corner cases before tape-out. Pair with Quartus II incremental compile to manage team-based design flows.

추천

📺

High-Definition Video Broadcast Equipment

Broadcast video routers, multi-format converters, and contribution encoders benefit from the EP3SE260F1517I4's 976 user I/O pins and 12 embedded transceivers. The device can ingest multiple 3G-SDI or HD-SDI streams, perform real-time color-space conversion, scaler/de-interlacer logic, and drive HDMI or DisplayPort outputs. Industrial temperature rating (I4 speed grade) supports 24/7 rack operation in broadcast facilities.

추천

EP3CLS200F484I7 · Intel EP3SE110F780I4 · Altera

✈️

Military Radar and Electronic Warfare Signal Processing

Phased-array radar and EW receivers require wide-bandwidth, low-latency DSP. The EP3SE260F1517I4's 768 18x18 multipliers enable multi-channel pulse compression, MTI/MTD filtering, and beamforming kernels. Its 12 embedded transceivers accept ADAS/radar IF data at multi-gigabit rates, while the industrial temperature range ensures operation in deployed defense platforms. Quartus II supports MIL-STD-810 design flows.

추천

EP3SE260F1152I4 · Altera EP3C55F780I7 · Altera

🔧

Test and Measurement Instrumentation

High-end oscilloscopes, logic analyzers, and protocol testers use the EP3SE260F1517I4 to implement deep acquisition memory, real-time triggering, and parallel DSP pipelines. The 16,672,768 embedded memory bits serve as waveform capture buffer, while 768 multipliers perform real-time FFT, decimation, and channel equalization. With 976 user I/O, the FPGA aggregates multiple 10+ Gsps ADC data streams into processed measurement results.

추천

EP3CLS150F484I7 · Intel EP3C80F780C8 · Intel

🌐

Telecommunications Line Cards and Baseband Processing

LTE, WCDMA, and 5G NR baseband cards use the EP3SE260F1517I4 for channel coding, rate matching, FFT/iFFT, and MIMO detection. Its 768 hardware multipliers accelerate the 1,536-point FFT used in LTE downlink, while 12 embedded transceivers backhaul CPRI/OBSAI to remote radio heads. Industrial temperature rating and high I/O count make it ideal for central-office equipment.

추천

EP3SE110F1152I4 · Intel EP3C80F484I7 · Intel

🏭

High-Speed Data Acquisition Systems

Scientific, medical imaging, and industrial inspection DAQs leverage the EP3SE260F1517I4 to ingest multiple lanes from 10+ Gsps ADCs. The device's 976 user I/O accept LVDS or SERDES data from front-end ADCs, while embedded memory and DSP blocks perform real-time channel calibration, beamforming (in ultrasound), or image reconstruction. Industrial temperature rating supports harsh industrial environments.

추천

EP3SE260F1152I4 · Altera EP3CLS200F780I7 · Intel

추천 제품 요약

EP3SE110F1152I4 Intel 사용처: High-Throughput ASIC Prototyping and Emulation, Telecommunications Line Cards and Baseband Processing EP3C55F484C8 Intel 사용처: High-Throughput ASIC Prototyping and Emulation EP3CLS200F484I7 Intel 사용처: High-Definition Video Broadcast Equipment EP3SE110F780I4 Altera 사용처: High-Definition Video Broadcast Equipment EP3SE260F1152I4 Altera 사용처: Military Radar and Electronic Warfare Signal Processing, High-Speed Data Acquisition Systems EP3C55F780I7 Altera 사용처: Military Radar and Electronic Warfare Signal Processing EP3CLS150F484I7 Intel 사용처: Test and Measurement Instrumentation EP3C80F780C8 Intel 사용처: Test and Measurement Instrumentation EP3C80F484I7 Intel 사용처: Telecommunications Line Cards and Baseband Processing EP3CLS200F780I7 Intel 사용처: High-Speed Data Acquisition Systems

What is the EP3SE260F1517I4?

The EP3SE260F1517I4 is a high-density Intel (Altera) Stratix III E family Field-Programmable Gate Array with 255,000 logic elements and 976 user I/O pins in a 1,517-ball FCBGA package. According to the Altera Stratix III device handbook, it is built on a 65 nm process and is rated for industrial temperature operation (-40C to +100C). The 'I4' suffix denotes the speed grade and industrial operating range.

How many logic elements does the EP3SE260F1517I4 contain?

The EP3SE260F1517I4 integrates 255,000 logic elements organized into 10,200 Logic Array Blocks (LABs). It also includes 16,672,768 bits of embedded memory and 768 18x18 hardware multipliers, making it suitable for DSP-intensive workloads such as FFT processing and multi-channel FIR filtering.

How many user I/O pins does the EP3SE260F1517I4 have?

The EP3SE260F1517I4 provides 976 user I/O pins through its 1,517-ball FCBGA package. This high I/O count supports wide parallel memory buses (DDR3), multi-channel LVDS interfaces, and external bridge connections to ASICs or processors.

What package does the EP3SE260F1517I4 use?

The EP3SE260F1517I4 is housed in a 1,517-ball Flip-Chip Ball Grid Array (FCBGA) measuring 40 mm on a side. This large BGA requires a multi-layer PCB with microvia stack-up, controlled-impedance routing for high-speed transceiver channels, and a heatsink or thermal pad for thermal management.

What is the lifecycle status of the EP3SE260F1517I4?

The EP3SE260F1517I4 is in Not Recommended for New Designs (NRND) status. Intel/Altera has notified customers that Stratix III E devices are mature; new designs should target Stratix V, Stratix 10, or Agilex families. Existing designs with long life-cycles continue to be supported through Altera/Intel authorized distributors.

Where can I buy EP3SE260F1517I4 and what is the price?

The EP3SE260F1517I4 is available through authorized distributors including DigiKey, Mouser, Heisener, and authorized brokers. As of 2026-09-09, single-unit pricing was reported around $13,239.50 per piece at Heisener. Lead times for industrial volumes typically run 4-8 weeks because the part is NRND.

Is EP3SE260F1517I4 still in stock?

Stock is limited because the part is in NRND lifecycle status. As of 2026-09-09, Heisener reported in stock. For production orders, contact an Altera/Intel authorized distributor for current availability and last-time-buy options if you are migrating the design.

What is the lead time for EP3SE260F1517I4?

Lead times for the EP3SE260F1517I4 typically run 4-8 weeks at industrial volumes as of 2026-09-09 because the part is NRND. Heisener quotes an estimated delivery window of April 24-29 for sample quantities. New design starts should plan on longer lead times or consider migrating to Stratix V or later families.

What is the difference between EP3SE260F1517I4 and EP3SE260F1517I3?

The I4 and I3 suffixes designate different speed grades within the Stratix III E industrial temperature family. The I4 speed grade is typically a faster bin than I3, yielding higher Fmax on critical paths. Both share the same 1,517-ball FCBGA package, 255K logic elements, and 16,672,768 embedded memory bits, making them pin-to-pin compatible.

What is the difference between EP3SE260F1517I4 and EP3SE260F1152I4?

The difference is the BGA package pin count: F1517 has 1,517 balls (976 user I/O), while F1152 has 1,152 balls (744 user I/O). Both are Stratix III E industrial-temperature speed-grade I4 parts. They are not drop-in replacements because the BGA land patterns differ; designers must commit to one package when laying out the PCB.

Can I drop-in replace EP3SE260F1517I4 with EP3SE260F1517I3?

Yes - the EP3SE260F1517I3 (slower speed grade, same package) is a drop-in substitute on the same 1,517-ball FCBGA land pattern. Timing closure will be more difficult because I3 has lower Fmax than I4, but pinout, ball map, and logic resources are identical, making it a viable replacement when I4 stock is constrained.

Can EP3SE260F1517I4 replace EP3SE260F1152I4?

No - the EP3SE260F1517I4 (1,517-ball FCBGA) cannot drop-in replace the EP3SE260F1152I4 (1,152-ball FCBGA) because the BGA land patterns differ and the user-I/O counts are different. Migrating between these two requires a PCB redesign and Quartus pin assignment rework.

What software is used to program EP3SE260F1517I4?

The EP3SE260F1517I4 is programmed with Altera Quartus II (legacy) or Intel Quartus Prime design software. Quartus handles synthesis, place-and-route, timing analysis, power estimation, and bitstream generation. Designers should use the latest Quartus version that includes Stratix III device support and consult the Stratix III device handbook for errata.

Where can I download the EP3SE260F1517I4 datasheet?

The EP3SE260F1517I4 datasheet and Stratix III device family handbook are available from the Intel/Altera website. Search for 'Stratix III device handbook' or 'EP3SE260 datasheet' on intel.com; the handbook contains pinout, electrical characteristics, and configuration information covering the entire EP3SE260 family.

Where can I find the EP3SE260F1517I4 pinout?

The EP3SE260F1517I4 pinout is documented in the Altera Stratix III device family handbook. Because the device is a 1,517-ball FCBGA, the full ball-map is delivered as a Quartus pin assignment file rather than a printed table; designers import the .qsf file and let Quartus drive pin assignment for the 976 user I/O.

What are the key specifications of EP3SE260F1517I4 that engineers should know?

Engineers should note: 255,000 logic elements, 16,672,768 bits embedded memory, 768 18x18 multipliers, 976 user I/O, 12 embedded transceivers, 1.1 V core, 65 nm process, 450 MHz core Fmax, and 1,517-ball FCBGA. Lifecycle is NRND. Source: Altera Stratix III device handbook and EP3SE260 family datasheet.

What is the best Xilinx equivalent for EP3SE260F1517I4?

There is no exact Xilinx drop-in replacement for the EP3SE260F1517I4 because it is a 1,517-ball FCBGA Stratix III E device. The closest Xilinx family in capability is the Virtex-6 LXT/SXT series, which targets similar logic density and transceiver counts but in different packages. A true cross-family migration requires PCB redesign.

엔지니어링 참조 데이터: EP3SE260F1517I4 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP3SE260F1517I4 when you need the highest-Fmax speed grade in the Stratix III E family for industrial-temperature applications such as defense radar, ASIC prototyping, and high-end test equipment. If your design can close timing at a slower speed grade and you need a drop-in substitute because of stock, EP3SE260F1517I3 is the recommended drop-in replacement. For commercial-temperature designs, EP3SE260F1517C4 or C3 give identical logic resources at lower cost. If 744 user I/O is sufficient and you want a smaller PCB, migrate to EP3SE260F1152I4 (1152-ball FCBGA) - but this is a package change, not a drop-in. All four parts share the same die, so Quartus synthesis results port directly.

대체품과의 비교

파라미터	이 제품	EP3SE260F1517I3	EP3SE260F1517C4	EP3SE260F1517C3
Package	1517-BBGA, FCBGA, 40 mm	1517-BBGA, FCBGA, 40 mm - same	1517-BBGA, FCBGA, 40 mm - same	1517-BBGA, FCBGA, 40 mm - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Speed Grade	I4 (industrial)	I3 (industrial, slower)	C4 (commercial)	C3 (commercial, slower)
Operating Temperature	-40C to +100C (industrial)	-40C to +100C (industrial)	0C to +85C (commercial)	0C to +85C (commercial)
Logic Elements	255,000	255,000	255,000	255,000
Embedded Memory (bits)	16,672,768	16,672,768	16,672,768	16,672,768
User I/O Pins	976	976	976	976
Embedded Transceivers	12	12	12	12
Core Voltage	1.1 V	1.1 V	1.1 V	1.1 V
Lifecycle Status	NRND	NRND	NRND	NRND

주요 차별점

I4 speed grade delivers highest Fmax in the EP3SE260 family (vs EP3SE260F1517I3)
Industrial temperature range supports harsh-environment deployments (vs EP3SE260F1517C4)
976 user I/O maximizes connectivity versus the 1152-ball variant (vs EP3SE260F1152I4)

설계 노트

Estimated: at full utilization (255K LE, 12 transceivers at 6.375 Gbps), the EP3SE260F1517I4 can dissipate 15-20 W. The 1,517-ball FCBGA exposes a large thermal pad on the bottom; designers must solder this pad to a copper pour connected through thermal vias to an internal ground plane. A heatsink with thermal interface material is strongly recommended for industrial-temperature deployments in enclosed chassis. Without adequate cooling, junction temperature can exceed 100C and trigger thermal runaway.

The 1,517-ball FCBGA at 1.0 mm pitch requires a PCB with microvia (laser-drilled) stack-up, sequential lamination, and 1-oz copper on outer layers. Use a 2oz copper pour on inner ground/power planes adjacent to the BGA for thermal spreading. Matched-length routing is required for all 12 transceiver channels; consult the Altera Stratix III device handbook board design guidelines for via pattern, AC coupling capacitor placement, and reference plane stitching.

Three common pitfalls with this device: (1) using the wrong speed grade - the I4 vs I3 vs C4 vs C3 differences matter for Fmax; (2) omitting the configuration device (EPCS or compatible) - the FPGA needs an external flash for non-volatile bitstream; (3) ignoring pinout differences between F1517 and F1152 packages - they share the same die but have different ball maps and user-I/O counts, so a single Quartus pin assignment file does not transfer between packages.

Estimated: at 1.1 V core with peak utilization, the EP3SE260F1517I4 draws 8-12 A from the core rail. Designers must use a multi-phase buck regulator with at least 25 A capacity, low-ESR ceramic output capacitors, and a power plane cutout beneath the BGA. The Stratix III E family's programmable power technology lets Quartus place unused LABs in low-power mode; leverage this by compiling with the 'power optimization' toggle to reduce dynamic power by 20-30%.

규정 준수 정보

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

무연

Unknown

무할로겐

Unknown

분쟁 광물

Unknown

RoHS, lead-free, and halogen-free status were not present in the verified web data and are marked unknown. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Consult Altera/Intel product page or contact authorized distributor for full compliance documentation.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Distributor, Octopart, Distributor, Distributor, Manufacturer Datasheet, Octopart