Intel

EP3SL340F1517I4LN - Stratix III L FPGA 337K Cells 1517-FCBGA | Intel

부품 번호: EP3SL340F1517I4LN ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

0.9 V Vdss 1517-BBGA, FC-FBGA (Flip-Chip) Package I4 (industrial, fast) Speed 18,821,144 bits Memory

시작가 $11820.75 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-09

볼륨 가격

수량	단가	합계
1	$19701.25	$19,701.25
10	$18716.18	$187,161.80
100	$16549.05	$1,654,905.00
500	$13880.88	$6,940,440.00
1,000	$11820.75	$11,820,750.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP3SL340F1517I4LN 개요

The Intel (formerly Altera) EP3SL340F1517I4LN is a high-density Stratix III L Field-Programmable Gate Array (FPGA) with 337,500 logic elements, fabricated on a 65 nm process node with a 0.9 V core voltage, housed in a 1517-ball FC-FBGA package with 976 user I/Os. It belongs to the Stratix III low-power (L) variant family, which combines high logic density with a reduced static power envelope compared to the standard Stratix III.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit in the broader taxonomy of programmable logic -> logic semiconductor -> integrated circuit. Unlike ASICs, FPGAs can be reconfigured in-system, enabling rapid prototyping, hardware acceleration, and low-volume custom silicon replacement.

Key features include 337,500 logic elements, 18,822,144 bits of embedded memory, 13,500 LABs (Logic Array Blocks), 384 embedded 18x18 multipliers, integrated high-speed transceivers, and 976 user I/O pins. The device supports up to 8 PLLs and includes hard memory controller blocks, supporting DDR/DDR2/DDR3 external memory interfaces. The 1517-FCBGA package provides high I/O count with multi-row ball array on a 40x40 mm substrate.

Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables (LUTs), delivering higher effective logic density than the previous Stratix II generation. The device supports hot-socketing, allowing insertion into a live backplane without damage, and offers multiple temperature grades (commercial, industrial, military) with the I4 industrial speed grade targeting -40C to +100C operation.

Typical applications include high-performance digital signal processing, telecom baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), video processing and broadcast equipment, and military/aerospace signal processing. The Stratix III L family was Altera's mainstream high-density FPGA family before being superseded by Stratix IV and Stratix V.

Design consideration: Stratix III FPGAs require Quartus II design software (legacy, EOL replaced by Quartus Prime with limited Stratix III support). Power estimation requires the Playback Power Analyzer tool, and PCB designers must follow Intel's flip-chip BGA layout guidelines including microvia stack-up and 1.0 mm pitch escape routing.

드롭인 대체품: EP3SL340F1517I4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340F1517I4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Mounting Type.

EP3SL340F1517C2N

Intel

Package: 1517-ball FCBGA (FineLine BGA)

Operating Temperature: 0 °C to +85 °C (commercial)

Speed Grade: C2

비교 대상: EP3SL340F1517I4LN →

EP3SL340F1517C3N

Altera

Package: 1517-ball FC-BGA

Operating Temperature: 0 C to 85 C (commercial)

Speed Grade: -3 (fastest commercial)

비교 대상: EP3SL340F1517I4LN →

EP3SL340F1517C4

Intel

Operating Temperature: 0 C to 85 C (Commercial)

Mounting Type: Surface Mount (BGA)

비교 대상: EP3SL340F1517I4LN →

EP3SL340F1517C4LN

Intel

Package: 1517-BBGA, FCBGA

Speed Grade: 4

Embedded Memory Bits: 18,821,144 bits

비교 대상: EP3SL340F1517I4LN →

EP3SL340F1517C4N

Altera

Package: 1517-BBGA, FCBGA (flip-chip)

Operating Temperature: 0C to +85C (commercial)

Speed Grade: C4

비교 대상: EP3SL340F1517I4LN →

EP3SL340F1517I3N

Intel

Package: 1517-BBGA, FCBGA, 1.0 mm ball pitch

Operating Temperature: -40C to +100C (industrial)

Embedded Memory Bits: 18822144 (approx. 18 Mbit)

비교 대상: EP3SL340F1517I4LN →

EP3SL340F1517I4

Altera

Package: 1517-BBGA, FCBGA (Flip-Chip BGA)

Operating Temperature: -40 C to +100 C (Industrial)

Speed Grade: 4

✅ 드롭인

Intel

📦 1517-FCBGA

Stratix III L · FPGA - Field Programmable Gate Array · 337,500 · 13,500 · 18,822,144 · 976 · 800 MHz · 500 MHz

✓ 재고 있음

$3300 / 개

데이터시트 보기 →

EP3SL340F1517I4LN 최대 정격 & 전기적 특성

Family	Stratix III L (low power variant)
Logic Elements	337,500
Embedded Memory	18,821,144 bits
Logic Array Blocks (LABs)	13,500
User I/Os	976
패키지	1517-BBGA, FC-FBGA (Flip-Chip)
Process Technology	65 nm
Core Voltage	0.9 V
동작 온도	-40C to +100C (industrial, I4 grade)
Speed Grade	I4 (industrial, fast)
Embedded Multipliers (18x18)	384
PLLs	Up to 8
Package Pitch	1.0 mm
실장 유형	Surface Mount
RoHS 상태	Compliant
Lead-Free	Yes
할로겐 프리	Yes (per package)
Design Software	Quartus II / Quartus Prime (legacy)

EP3SL340F1517I4LN 1.0 mm 핀 구성 가이드

EP3SL340F1517I4LN(1.0 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

다음에 대한 상세 핀아웃 데이터 없음: EP3SL340F1517I4LN.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP3SL340F1517I4LN 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Baseband Processing, Broadcast Video Processing, Military Radar and Signal Processing, High-Speed Serial Protocol Bridging, Industrial Machine Vision Systems.

🖥️

ASIC Prototyping and Emulation

The EP3SL340F1517I4LN with 337,500 logic elements and 18.8 Mbits of embedded memory provides sufficient density to partition and emulate multi-million-gate ASICs in modular arrays. Quartus II synthesis can map RTL from Synopsys Design Compiler or Cadence Genus into the Stratix III fabric, while 976 user I/Os support wide bus interfaces for ASIC netlist bring-up. Designers benefit from 384 embedded 18x18 multipliers for DSP-heavy ASIC blocks, and the 0.9 V core voltage plus L-variant low-power fabric reduces emulation-array thermal load versus standard Stratix III. Compared to ASIC respins costing $1M+, prototype validation on this FPGA can be amortized across tens of designs.

추천

EP3SL200F1517I4N · Intel EP4SL340F1517C4N (Stratix IV L upgrade path with same logic density and same package)

🌐

Telecom Baseband Processing

The EP3SL340F1517I4LN's combination of 13,500 LABs, 384 18x18 multipliers, and high LVDS bandwidth per I/O bank makes it suitable for WCDMA, LTE, and WiMAX baseband PHY layer implementation. The embedded memory supports large constellation demapping buffers, while hard PLLs generate the multi-rate clocks required for downlink OFDM demodulation. Industrial -40C to +100C operation covers outdoor base-station enclosures. Compared to DSP clusters, a single Stratix III L device replaces 4-6 discrete DSPs while consuming similar board area, with the L-variant low-static-power fabric reducing idle current between burst transmissions.

추천

EP3SL150F1152I3N · Intel EP3SL110F1152C4N · Intel

📺

Broadcast Video Processing

The EP3SL340F1517I4LN's 976 user I/Os and high embedded-memory bandwidth enable real-time processing of HD-SDI, 3G-SDI, and emerging 4K video streams. The 1517-FCBGA package exposes enough I/O pins to ingest multiple parallel SDI streams plus HDMI/DisplayPort interfaces for monitoring output. Designers implement color-space conversion, frame-rate conversion, and chroma keying in the ALM fabric, while the 18.8 Mbits of block RAM buffer entire HD frames for temporal processing. Compared to ASSP video processors, FPGAs allow format-agnostic designs that support new broadcast standards via firmware updates.

추천

EP3SL200F1517I4LN · Intel EP3SE260F1517I4N · Intel

✈️

Military Radar and Signal Processing

Industrial-grade -40C to +100C operation of EP3SL340F1517I4LN and its 65 nm low-static-power process variant suit deployed radar signal-processing systems where thermal envelope matters. The 384 18x18 multipliers enable parallel FFT and pulse-compression kernels, while 18.8 Mbits of block RAM holds range-Doppler maps. Hot-socketing support simplifies field-replaceable module designs in active radar arrays. Designers benefit from Altera's mature SignalTap II embedded logic analyzer for in-field firmware debugging, and the 1517-FCBGA package is rated for the vibration profiles of airborne and naval platforms.

추천

EP3SE110F780I4N · Intel EP3SL200H780I4N · Intel

🔧

High-Speed Serial Protocol Bridging

The EP3SL340F1517I4LN integrates multi-gigabit transceivers supporting PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and Interlaken at up to 6.375 Gbps per channel. Embedded hard IP blocks reduce soft-logic overhead and free ALMs for protocol conversion logic. The 976 I/O pins support multiple parallel PHY interfaces alongside the serial links, enabling bridging cards that translate between proprietary backplane protocols and standard fabrics. Compared to ASSP bridge chips, the FPGA-based design supports custom protocols and field updates via PCIe partial reconfiguration.

추천

EP3SL150F1152I3N · Intel EP3SE80F1152I4N · Intel

🏭

Industrial Machine Vision Systems

The EP3SL340F1517I4LN's combination of high logic density, 384 dedicated 18x18 multipliers for convolution operations, and large embedded memory for frame buffering suits multi-camera industrial inspection lines. The industrial -40C to +100C temperature grade covers factory-floor deployments without additional cooling. The 976 I/O count accommodates Camera Link, CoaXPress, or GigE Vision interfaces for 4-8 simultaneous cameras. Designers implement defect detection, dimensional measurement, and OCR pipelines in the ALM fabric, with the L-variant low-power process variant reducing cabinet cooling requirements.

추천

EP3SL110F1152C4N · Intel EP3SL200F1517I4LN · Intel

추천 제품 요약

EP3SL200F1517I4N Intel 사용처: ASIC Prototyping and Emulation EP4SL340F1517C4N Stratix IV L upgrade path with same logic density and same package 사용처: ASIC Prototyping and Emulation EP3SL150F1152I3N Intel 사용처: Telecom Baseband Processing, High-Speed Serial Protocol Bridging EP3SL110F1152C4N Intel 사용처: Telecom Baseband Processing, Industrial Machine Vision Systems EP3SL200F1517I4LN Intel 사용처: Broadcast Video Processing, Industrial Machine Vision Systems EP3SE260F1517I4N Intel 사용처: Broadcast Video Processing EP3SE110F780I4N Intel 사용처: Military Radar and Signal Processing EP3SL200H780I4N Intel 사용처: Military Radar and Signal Processing EP3SE80F1152I4N Intel 사용처: High-Speed Serial Protocol Bridging

What is the logic element count of EP3SL340F1517I4LN?

The EP3SL340F1517I4LN contains 337,500 logic elements according to Intel (Altera) Stratix III device family documentation. This positions it in the high-density segment of the Stratix III L family, which targets applications requiring both high logic capacity and the lower static-power envelope of the L-variant process variant. Verified at FindIC and DigiKey product listings.

What package does EP3SL340F1517I4LN use and how many balls does it have?

The EP3SL340F1517I4LN is packaged in a 1517-ball Flip-Chip BGA (1517-FCBGA) with 1.0 mm ball pitch and a 40x40 mm body. The package supports 976 user I/O pins and is part of the FC-FBGA family specified for high-pin-count Stratix III devices. According to the package equivalence code BGA1517,39X39,40 found at Partstack, the ball array is 39x39 with 40-mm body.

Is EP3SL340F1517I4LN still in production or is it discontinued?

The EP3SL340F1517I4LN is classified as NRND (Not Recommended for New Designs) per Intel's product lifecycle policy. The Stratix III family was superseded by Stratix IV (2010) and Stratix V (2011), and Quartus II design support is now legacy. Existing designs continue to receive limited support through Intel FPGA support channels and authorized distributors.

What is the price of EP3SL340F1517I4LN and is it in stock?

Heisener lists the EP3SL340F1517I4LN at approximately $19,701.2454 per unit as of 2026-09-09. Octopart aggregates pricing from 8-16 distributors for stock comparison. Given the NRND status, expect limited availability on the open market with prices driven by remaining inventory rather than production economics.

Where can I download the EP3SL340F1517I4LN datasheet PDF?

The official Altera/Intel datasheet for the EP3SL340F1517I4LN is hosted at https://pdf.datasheet.live/9f49ee86/altera.com/EP3SL340F1517I4LN.pdf and on datasheets.globalspec.com. The full Stratix III Device Handbook is on Intel's legacy support site at altera.com/literature/lit-stx3.jsp, covering the entire Stratix III family including this 1517-FCBGA variant.

What is the difference between EP3SL340F1517I4LN and EP3SL340F1517I4L?

The EP3SL340F1517I4L (without the trailing N) is the older non-N lead-free part, while the EP3SL340F1517I4LN adds the N suffix indicating lead-free / RoHS compliance per Altera ordering code conventions. Both parts share the same silicon die, package (1517-FCBGA), speed grade (I4), and -40C to +100C industrial temperature range, making them electrically drop-in compatible.

What is the core voltage and process technology of EP3SL340F1517I4LN?

The EP3SL340F1517I4LN uses a 0.9 V core supply fabricated on TSMC's 65 nm process node, per the Stratix III family datasheet. The L (low power) variant includes power-optimized ALMs and programmable power technology that allows unused logic and routing to enter a low-static-power state, reducing idle power versus the standard Stratix III.

How much embedded memory does EP3SL340F1517I4LN have?

The EP3SL340F1517I4LN includes 18,821,144 bits (approximately 18.8 Mbits) of embedded SRAM organized in M512, M4K, and M-RAM block types per the Stratix III architecture. The 1517-FCBGA variant typically contains the full memory complement for the EP3SL340 device, supporting high-bandwidth on-chip buffering for DSP and video pipeline applications.

What is the best drop-in replacement for EP3SL340F1517I4LN?

The best drop-in replacement is the EP3SL340F1517I4L (older non-RoHS revision) or EP3SL340F1517I3N (slightly slower I3 speed grade in the same package), all sharing the 1517-FCBGA footprint. For new designs, the EP4SE680F1517C4N (Stratix IV E) or EP4SL340F1517C4N (Stratix IV L, similar density) are recommended as functional upgrades, though they require re-compilation in Quartus.

Can EP3SL340F1517I4LN be replaced with a Stratix IV or Stratix V device?

The EP3SL340F1517I4LN cannot be replaced with Stratix IV/V on the same PCB because those generations use different packages and ballouts even at the same pin count. The closest pin-compatible upgrade within the same 1517-FCBGA package family is the EP4SL340F1517C4N (Stratix IV L, 340K LE equivalent), though a Quartus re-compile is required. New designs should target Cyclone V or Arria 10 for current support.

What software do I need to program EP3SL340F1517I4LN?

The EP3SL340F1517I4LN requires Altera Quartus II design software (versions 9.1 through 13.1 supported this device). Quartus Prime 16.0 and earlier maintained legacy support for Stratix III; current Quartus Prime versions (21.x+) have dropped full Stratix III support. For new code targeting Stratix III, use Quartus II 13.1 or the legacy support download from Intel FPGA.

What is the I4 speed grade and how does it compare to I3 and C4?

The I4 speed grade in EP3SL340F1517I4LN denotes the fastest industrial-temperature speed bin for Stratix III. C4 is the commercial-temperature equivalent (-0C to +85C) with similar timing, while I3 is one speed bin slower than I4. Higher speed grades (lower numbers) give better Fmax at the cost of higher dynamic power; C4 and I4 are typically interchangeable for timing closure.

How many user I/O pins does EP3SL340F1517I4LN have?

The EP3SL340F1517I4LN provides 976 user I/O pins across 16 I/O banks per the Stratix III device handbook. The 1517-FCBGA package has 1517 balls total; the remainder are power, ground, and configuration pins. Each bank supports a mix of LVDS, LVCMOS, SSTL, HSTL, and differential I/O standards up to 1.6 Gbps per LVDS channel.

Is EP3SL340F1517I4LN RoHS compliant?

The N suffix in EP3SL340F1517I4LN denotes lead-free / RoHS compliant packaging per Altera's ordering code convention. The part uses a lead-free BGA solder ball composition and is compatible with RoHS-compliant PCB assembly processes. The older EP3SL340F1517I4L without the N suffix contains lead-based solder balls and is not RoHS compliant.

What is the operating temperature range of EP3SL340F1517I4LN?

The EP3SL340F1517I4LN operates from -40C to +100C junction temperature as indicated by the I4 industrial speed grade. The 100C ceiling is consistent with Altera's industrial-grade Stratix III offerings. For extended military temperature range (-55C to +125C), designers must select the military temperature variant suffix, which is not the I4 part.

What are typical applications for EP3SL340F1517I4LN?

The EP3SL340F1517I4LN is typically used in high-performance DSP systems, telecom baseband processing, ASIC prototyping, broadcast video processing, military radar/signal processing, and high-speed serial protocol bridging. Its 337K LE density supports large system-on-chip designs with embedded processors (Nios II), custom peripherals, and multiple high-speed interfaces.

엔지니어링 참조 데이터: EP3SL340F1517I4LN — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP3SL340F1517I4LN when you need the highest-Fmax industrial-grade variant of the 337K-LE Stratix III L family in the 1517-FCBGA package with full RoHS compliance. This is the preferred ordering code for new commercial/industrial designs needing both maximum clock rate and lead-free assembly. Choose EP3SL340F1517I4L if your manufacturing process still uses lead-based solder (legacy defense or aerospace programs). Choose EP3SL340F1517I3N if your design can close timing at a 10-15% lower Fmax to gain minor cost/availability benefits. Choose EP3SL340F1517C4N if your operating range fits within 0-85C commercial temperature and RoHS is required. For new designs targeting current production, consider migrating to Stratix IV (EP4SL340F1517C4N) or Cyclone V families instead, as Quartus II support for Stratix III is now legacy.

대체품과의 비교

파라미터	이 제품	EP3SL340F1517I4L	EP3SL340F1517I3N	EP3SL340F1517C4N	EP3SL340F1517C3N	EP3SL340F1517C4
Package	1517-FCBGA	1517-FCBGA	1517-FCBGA	1517-FCBGA	1517-FCBGA	1517-FCBGA
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel	Intel
Logic Elements	337,500	337,500	337,500	337,500	337,500	337,500
Speed Grade	I4 (industrial, fastest)	I4	I3 (-1 bin)	C4 (commercial)	C3 (commercial, -1 bin)	C4 (commercial, non-RoHS)
Temperature Grade	-40C to +100C (industrial)	-40C to +100C	-40C to +100C	0C to +85C	0C to +85C	0C to +85C
RoHS / Lead-Free	Yes (N suffix)	No (non-RoHS)	Yes	Yes	Yes	No
Embedded Memory	18.8 Mbits	18.8 Mbits	18.8 Mbits	18.8 Mbits	18.8 Mbits	18.8 Mbits
User I/Os	976	976	976	976	976	976

주요 차별점

Highest industrial speed grade (I4) in the Stratix III L 337K-LE family (vs EP3SL340F1517I3N)
Lead-free / RoHS compliant (N suffix) industrial-grade variant (vs EP3SL340F1517I4L (no N suffix))
Industrial temperature grade (-40C to +100C) for harsh environments (vs EP3SL340F1517C4N (commercial 0-85C))

설계 노트

The 1517-FCBGA package uses 1.0 mm ball pitch and requires a high-density PCB stack-up with laser-drilled microvias (typically 4-6 layer stack-up with 1 oz copper). Escape routing must use via-in-pad or dog-bone fan-out patterns per Altera AN-532 (now Intel FPGA AN-532). Thermal vias under the center die area are mandatory, with at least a 6x6 thermal via array at 0.3 mm drill on 0.6 mm pitch to conduct 5-15W dissipation to internal copper planes. Estimate: junction-to-ambient theta_JA is approximately 12-15 C/W with 100 sq cm of inner copper plane.

The Stratix III L family uses a multi-rail power architecture requiring VCC (0.9 V core), VCC_PLL (0.9-1.1 V), VCCIO (1.2-3.0 V per bank), and VCCA (2.5 V). Power sequencing must follow Intel AN-571: VCC before VCCIO before VCCA. Estimated power for a 70% utilization EP3SL340 with 50% toggle rate at 300 MHz: ~8-12 W core + I/O. Use the PowerPlay Early Power Estimator spreadsheet (free download) before final board design. Decoupling requires 200+ 0402 ceramic capacitors distributed across the bottom-side of the BGA footprint.

Common pitfalls when designing with EP3SL340F1517I4LN: (1) DO NOT use the Stratix III configuration scheme with a Stratix IV/V bitstream - the families are bitstream-incompatible; (2) Configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0:4]) must be pulled to correct logic levels via 4.7 kohm resistors; (3) JTAG chain ordering matters when daisy-chaining with other devices - consult AN-370; (4) The 1517-FCBGA requires nitrogen reflow with controlled ramp rates below 2 C/sec to prevent BGA non-wet opens. Estimated reflow profile: 150C preheat to 245C peak with 60-90 sec TAL.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Yes

분쟁 광물

Compliant

RoHS compliant per N suffix in ordering code. AEC-Q100 not applicable (FPGA, not automotive discrete). REACH compliance assumed per Intel product environmental statements. Halogen-free per package marking.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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