EP3SL50F484C4G - 47.5K LE Stratix III L FPGA | Intel / Altera
부품 번호: EP3SL50F484C4G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $181.6 | $181.60 |
| 10 | $165.5 | $1,655.00 |
| 100 | $148.2 | $14,820.00 |
| 500 | $135.4 | $67,700.00 |
| 1,000 | $122.1 | $122,100.00 |
EP3SL50F484C4G 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic (PLD) and, by extension, digital ICs and semiconductors. Compared to fixed-function ASICs, FPGAs offer fast time-to-market, in-system reprogrammability, and parallel hardware acceleration, while consuming more power per function. The Stratix III L series was Altera's low-power complement to the Stratix III family, intended for ASIC prototyping, signal processing, and high-throughput datapath applications.
Key features of the EP3SL50F484C4G include 19,000 Adaptive Logic Modules (ALMs), 2.08 Mbit of embedded memory distributed across M9K and M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and the Altera Quartus II design flow with Qsys system integration. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on the same package, enabling direct interfacing with DDR/DDR2/DDR3 memory devices without external level shifters.
The 484-pin FC-FBGA FineLine BGA package provides high pin density in a 23 mm x 23 mm body suitable for space-constrained designs. The C4 speed grade designates the slowest (most timing-margin-friendly) member of the Stratix III L family, making this part the preferred choice when the design's highest internal clock frequency is moderate (under ~300 MHz for general logic) but BOM cost is sensitive. Pricing for this part begins around $181.59 unit at LCSC and scales upward on long-lead-time distributors as the part is now in mature lifecycle status.
Typical applications include ASIC prototyping, telecom line-card datapath processing, software-defined radio (SDR) baseband, video broadcast infrastructure, and test & measurement instrumentation. Designers typically pair the EP3SL50F484C4G with DDR2 or DDR3 SDRAM, clock generators such as CDCE62005 or ICS8442, and high-speed ADCs / DACs from the ADS62P or DAC5688 families.
When designing with this FPGA, plan power-rail sequencing for the 1.1 V core and the I/O bank supplies independently, and place 100 uF + 10 uF + 100 nF decoupling stacks adjacent to each bank to meet simultaneous-switching-noise margins. Quartus II software version 11.0 or later (or Intel Quartus Prime with legacy support) is required for design compilation.
This page synthesizes distributor pricing, same-package drop-in alternatives within the Stratix III L family, and practical design notes not found on a single manufacturer datasheet page.
드롭인 대체품: EP3SL50F484C4G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F484C4G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484C4N
✅ 드롭인✓ 재고 있음
$325 / 개
데이터시트 보기 →EP3SL50F484C4
✅ 드롭인✓ 재고 있음
$364.63 / 개
데이터시트 보기 →EP3SL50F484C3G
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP3SL50F484C3N
✅ 드롭인✓ 재고 있음
$458 / 개
데이터시트 보기 →EP3SL50F484C3
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SL50F484C2G
✅ 드롭인✓ 재고 있음
$335 / 개
데이터시트 보기 →EP3SL50F484C2N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP3SL50F484C2
✅ 드롭인✓ 재고 있음
$478.8 / 개
데이터시트 보기 →EP3SL50F484C4G 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 2,184,192 bits (2.08 Mbit) |
| User I/Os | 296 I/O |
| Process Technology | 65 nm |
| Operating Frequency | up to 450 MHz (datasheet typical) |
| Core Supply Voltage | 1.1 V |
| Speed Grade | C4 |
| 패키지 | 484-ball FC-FBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Design Tool | Altera Quartus II / Intel Quartus Prime (legacy support) |
| Lead-Free / RoHS | Lead-free (suffix G); RoHS-compliant |
EP3SL50F484C4G 484-ball fc-fbga (fineline bga) 핀 구성 가이드
EP3SL50F484C4G(484-ball fc-fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F484C4G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F484C4G 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Line-Card Datapath Processing, Software-Defined Radio Baseband, Video Broadcast Infrastructure, Test & Measurement Instrumentation, Industrial Machine Vision.
ASIC Prototyping and Emulation
The EP3SL50F484C4G's 47,500 logic elements, 2.08 Mbit of embedded memory, and 296 user I/Os in a 484-ball FC-FBGA package make it well-suited for ASIC prototyping and logic emulation. With the C4 speed grade supporting internal clocks up to ~300 MHz and dedicated M9K/M144K memory blocks, designers can map mid-complexity ASICs (typical gate counts up to 1 million gates when accounting for LUT compression) and validate RTL before committing to mask costs. Quartus II synthesis and incremental place-and-route shorten iteration cycles, and the Stratix III Device Handbook provides reference designs for typical emulation platforms. Compared with newer Cyclone IV GX devices, the Stratix III L offers higher logic density per dollar for the same prototyping workload, though it consumes slightly more static power.
추천
Telecom Line-Card Datapath Processing
Telecom line cards that require packet classification, traffic shaping, and protocol encapsulation benefit from the EP3SL50F484C4G's high logic density and embedded memory bandwidth. The 296 I/Os support multiple SGMII/SerDes interfaces to PHY devices, while the 2.08 Mbit embedded RAM holds packet headers, lookup tables, and queue descriptors on-chip, reducing external memory accesses. The device's 1.1 V core operates within standard telecom power budgets, and Quartus II IP for Ethernet MAC, POS-PHY Level 3, and Interlaken accelerates integration. Compared with ASIC implementations, the Stratix III L allows late-bound feature upgrades via in-system reconfiguration, a key advantage for evolving telecom standards such as MPLS-TP and segment routing.
추천
Software-Defined Radio Baseband
The EP3SL50F484C4G is commonly deployed in SDR baseband platforms where DSP blocks perform FFT, channelization, and demodulation on wideband IF signals sampled by high-speed ADCs. The Stratix III L's dedicated DSP blocks deliver up to ~136 18x18 multipliers at 250 MHz, sufficient for LTE and basic WCDMA channel processing, while the 2.08 Mbit embedded memory buffers FFT working sets between ADC bursts. The 484-ball FC-FBGA package supports the high I/O count needed to interface simultaneously with an ADC (LVDS), a DAC (LVDS), and a host processor (EMIF). Compared with DSP processors such as the TMS320C6678, the FPGA's parallel datapath excels at multi-channel narrowband processing at lower power per operation.
추천
Video Broadcast Infrastructure
Video broadcast equipment (encoders, decoders, format converters) uses the EP3SL50F484C4G for SDI de/serialization, chroma resampling, and MPEG-2/H.264 preprocessing at SDI data rates up to 3 Gbps. The 296 user I/Os enable direct interfacing with multiple SDI receivers and transmitters (e.g., LMH0340, LMH0307) and a host CPU bus, while the 2.08 Mbit embedded RAM holds line and frame buffers for deinterlacing and scaling. Quartus II Video and Image Processing Suite IP blocks (Scaler, Deinterlacer, Color Space Converter) accelerate development. Compared with dedicated ASSPs such as the GS2971, the FPGA provides greater flexibility for proprietary broadcast formats and last-minute feature additions without silicon respin.
추천
Test & Measurement Instrumentation
Test & measurement instruments such as logic analyzers, protocol analyzers, and arbitrary waveform generators use the EP3SL50F484C4G to manage state machines, capture buffers, and trigger logic at hundreds of MHz. The 47.5K LE capacity supports multi-channel state sequencing, while the 2.08 Mbit embedded memory holds capture traces and trigger templates on-chip for fast pattern matching. The 296 I/Os interface to high-speed probe front-ends, display controllers, and host USB/Ethernet links. Quartus II SignalTap II embedded logic analyzer provides non-intrusive internal signal capture for in-system debug. Compared with MCU + FPGA combos, the single-chip Stratix III L implementation reduces BOM count and simplifies PCB layout for portable instrumentation.
추천
Industrial Machine Vision
Industrial machine vision systems for inspection, robotics, and quality control use the EP3SL50F484C4G to receive Camera Link or LVDS image streams from line-scan or area-scan cameras, perform preprocessing (tap balance, color interpolation, gamma correction), and forward processed frames to a host CPU or display. The 296 user I/Os support multi-tap Camera Link configurations at up to 85 MHz pixel clock, while the 2.08 Mbit embedded memory holds line buffers and lookup tables for real-time Bayer demosaicing. Quartus II IP for Camera Link, LVDS, and DDR2 controllers accelerates integration. Compared with general-purpose CPUs, the Stratix III L achieves deterministic low-latency image processing essential for high-speed conveyor and pick-and-place applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F484C4G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484C4N | EP3SL50F484C4 | EP3SL50F484C3G | EP3SL50F484C2G |
|---|---|---|---|---|---|
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE |
| Embedded Memory | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit |
| Speed Grade | C4 (slowest) | C4 | C4 | C3 (~10-15% faster Fmax) | C2 (~20-30% faster Fmax) |
| Lead Finish | Lead-free (G suffix, RoHS) | Non-RoHS lead finish | Not specified | Lead-free (G suffix, RoHS) | Lead-free (G suffix, RoHS) |
| User I/Os | 296 I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Lead-free / RoHS-compliant orderable part for new designs (vs EP3SL50F484C4N)
- Slowest speed grade (C4) for lowest cost and best timing margin (vs EP3SL50F484C2G)
- 47.5K LE capacity with 2.08 Mbit embedded memory in 484-ball FC-FBGA (vs EP3SE50F484C4G (Stratix III E non-L variant))
설계 노트
The EP3SL50F484C4G requires at minimum four separate power rails: 1.1 V core (VCC), 1.1 V analog PLL (VCCA_PLL), 2.5 V auxiliary (VCCAUX), and per-bank VCCIO (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V depending on the I/O standard). Per the Stratix III Device Handbook pin connection guidelines, all VCC pins must be connected and decoupled with 100 uF bulk + 10 uF + 100 nF stacks. Power-rail sequencing requires VCC and VCCAUX to rise before or simultaneously with VCCIO to prevent I/O latch-up; many designers use a sequencer IC such as the TPS3808 to enforce this. Estimated static current at room temperature is approximately 600 mA on VCC and 30 mA on VCCAUX for a typical 47.5K-LE utilization.
In the 484-ball FC-FBGA package, the exposed die beneath the BGA is the primary heat path; the part must be soldered to a PCB thermal pad with at least 8 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an internal copper plane. Per the Stratix III Device Handbook thermal management chapter, a 4-layer FR-4 board with the recommended thermal via array delivers theta-JA of approximately 12 C/W (estimated, with 1 oz copper and still air). For designs that fully utilize all 47.5K LE running at 50% toggle rate and 250 MHz, designers should plan for at least 3-4 W of dissipation; in such cases forced-air cooling is recommended to keep the junction below 85C.
The 484-ball FC-FBGA package has a 1.0 mm ball pitch requiring microvia or laser-drilled PCB stackup. Per the Stratix III Device Handbook PCB design guidelines, the recommended stackup is a 6-8 layer board with sequential lamination for the BGA breakout layer. Use 50-ohm controlled-impedance traces for high-speed LVDS pairs (typical 100-ohm differential), and match the differential pair lengths within 50 mils to meet the LVDS data-eye specification. All configuration and JTAG signals should be routed on inner layers to avoid crosstalk from adjacent high-speed signals.
Common pitfalls when designing with the EP3SL50F484C4G include: (1) failing to connect all GND balls to the PCB ground plane, which causes return-path discontinuities and SI issues; (2) using a configuration mode that is incompatible with the chosen EPCS configuration flash (e.g., FPP x32 vs AS), which can brick the device; (3) overlooking the requirement to drive the nCONFIG pin high before applying configuration data; (4) selecting the wrong I/O standard for the bank's VCCIO voltage, which causes the output drivers to fail at power-up; (5) not using the Quartus II pin planner to assign differential pairs and PLL clock inputs before layout, which forces costly ECO iterations. Always verify pin assignments with the Quartus II Fitter report before PCB fabrication.
규정 준수 정보
RoHS compliance inferred from G suffix per Altera ordering information; AEC-Q100 not applicable (FPGA is industrial/commercial, not automotive grade); halogen-free status not documented in retrieved web data.