EP3SL50F484C4N - 47.5K Logic Elements Stratix III L FPGA | Intel
부품 번호: EP3SL50F484C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $471.91 | $471.91 |
| 10 | $445 | $4,450.00 |
| 100 | $405 | $40,500.00 |
| 500 | $365 | $182,500.00 |
| 1,000 | $325 | $325,000.00 |
EP3SL50F484C4N 개요
An FPGA is a semiconductor device whose digital logic functionality is defined after manufacturing via configuration bitstream loading rather than being fixed at the fab. Stratix III L belongs to Altera's (now Intel) high-performance, low-power FPGA family, sitting in the system hierarchy as: FPGA -> programmable logic device -> logic IC -> integrated circuit. Designers choose FPGAs when they need parallel processing, custom I/O timing, or hardware-accelerated DSP beyond what a microcontroller or fixed-function ASIC can deliver.
Key differentiating features of this part include 47,500 Logic Elements, 2,184,192 bits of embedded RAM, 296 maximum user I/Os, a 484-ball FC-FBGA package suitable for high-density board layouts, and Stratix III L architecture that combines logic, memory, and DSP blocks. The 484-ball FC-FBGA package provides a robust flip-chip interconnect supporting gigabit transceiver rates and high signal-integrity I/O.
The Stratix III L architecture integrates MultiTrack interconnect, TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and high-speed transceivers. Compared to the Stratix II generation, Stratix III L reduces dynamic power through programmable power technology while retaining register-rich fabric and rich memory/DSP ratios for DSP-heavy designs.
Typical applications include telecom and networking line cards, ASIC prototyping, digital signal processing, military and aerospace signal processing, and high-performance computing accelerators. Its 47.5K LE and 2.18 Mbit memory make it well suited for mid-complexity parallel data-path implementations.
When designing with this device, allocate sufficient PCB area for the 484-ball BGA escape routing and provide multiple decoupling capacitors near each power rail. Configuration mode (AS, PS, JTAG) must be selected at board level; designers should also budget for a configuration memory device such as EPCS or a supported flash, as Stratix III does not retain configuration after power-down.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical Stratix III design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: EP3SL50F484C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F484C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484C4LN
✅ 드롭인✓ 재고 있음
$225 / 개
데이터시트 보기 →EP3SL50F484C4L
✅ 드롭인✓ 재고 있음
$651.25 / 개
데이터시트 보기 →EP3SL50F484C4
✅ 드롭인✓ 재고 있음
$364.63 / 개
데이터시트 보기 →EP3SL50F484C4G
✅ 드롭인✓ 재고 있음
$122.1 / 개
데이터시트 보기 →EP3SL50F484C4LG
✅ 드롭인✓ 재고 있음
$245 / 개
데이터시트 보기 →EP3SL50F484C3N
✅ 드롭인✓ 재고 있음
$458 / 개
데이터시트 보기 →EP3SE50F484C4N
✅ 드롭인✓ 재고 있음
$468.11 / 개
데이터시트 보기 →EP3SE50F484C4LN
✅ 드롭인✓ 재고 있음
$772.12 / 개
데이터시트 보기 →EP3SL50F484C4N 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Altera/Intel Stratix III |
| Logic Elements | 47,500 |
| Embedded Memory (bits) | 2,184,192 |
| Maximum User I/Os | 296 |
| Total RAM Bits | 2,184,192 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Internal Operating Frequency | up to 717 MHz |
| Speed Grade | C4 |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| Package Type | 484-ball FC-FBGA (FBGA-484) |
| Lead-Free Status | Yes (Pb-free) |
| Configuration Mode | AS / PS / JTAG |
| RoHS 상태 | Compliant |
EP3SL50F484C4N 484-ball fc-fbga (fbga-484) 핀 구성 가이드
EP3SL50F484C4N(484-ball fc-fbga (fbga-484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F484C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F484C4N 적합 용도: 6 애플리케이션s: Telecom Line Cards, ASIC Prototyping, Digital Signal Processing (DSP), Industrial Control and Machine Vision, Test and Measurement Instrumentation, High-Performance Computing Accelerators.
Telecom Line Cards
The EP3SL50F484C4N fits telecom line card designs where mid-density logic, embedded RAM, and high I/O count are required. The 47,500 logic elements and 2,184,192 bits of embedded memory provide capacity for cell buffering, packet processing, and SERDES glue logic, while 296 user I/Os support multiple SFP/QSFP interfaces. The Stratix III L low-power architecture reduces dynamic power in densely populated line cards where thermal budget is constrained. Performance considerations include careful logic placement to balance critical-path delays against power savings from programmable power technology, and reserve M9K/M144K blocks for header and payload buffers.
추천
ASIC Prototyping
The EP3SL50F484C4N serves well as an ASIC prototyping vehicle for mid-complexity ASICs. With 47,500 logic elements and rich TriMatrix memory blocks, it accommodates 1-2 million ASIC gates depending on utilization. Designers benefit from Stratix III's register-rich fabric that maps efficiently to ASIC register transfer level (RTL) code. The 484-pin FC-FBGA package provides high I/O count for ASIC boundary signals, while the C4 speed grade supports timing-accurate ASIC verification. Performance trade-offs include partition complexity and the gap between FPGA LUT-based and ASIC standard-cell-based timing models.
추천
Digital Signal Processing (DSP)
The EP3SL50F484C4N supports DSP applications including software-defined radio, video processing, and baseband signal chains. Its DSP blocks combined with 47,500 logic elements enable multiply-accumulate pipelines and FFT accelerators at sample rates from tens to hundreds of MHz. The 2,184,192 bits of embedded RAM provide coefficient storage and sample buffering close to the DSP fabric, reducing routing congestion. The C4 speed grade supports aggressive pipeline depths, while the Stratix III L architecture minimizes dynamic power during idle DSP cycles.
추천
Industrial Control and Machine Vision
The EP3SL50F484C4N fits industrial machine vision controllers where multiple camera interfaces, image processing pipelines, and real-time control coexist on one device. The 296 user I/Os connect to Camera Link, LVDS, or GigE Vision interfaces, while DSP blocks accelerate image filtering, edge detection, and pattern recognition. The Stratix III L low-power architecture is advantageous in sealed industrial enclosures where cooling is passive. Designers should use hardware FFT convolution rather than software equivalents to meet real-time frame-rate targets.
추천
Test and Measurement Instrumentation
The EP3SL50F484C4N enables high-end test and measurement equipment such as protocol analyzers, logic analyzers, and signal generators. Its logic and memory capacity support deep capture buffers, real-time protocol decoding, and waveform synthesis at sample rates exceeding 1 GS/s with external ADC/DAC companion chips. The 484-ball FC-FBGA package routes high-speed LVDS data to companion converters while the C4 speed grade meets tight timing margins. Trade-offs include careful PCB signal-integrity design for sub-nanosecond edge rates at the FPGA-converter interface.
추천
High-Performance Computing Accelerators
The EP3SL50F484C4N functions as a coprocessor in HPC and data-center acceleration cards, offloading compute kernels such as encryption, compression, and bioinformatics from the host CPU. With 47,500 logic elements and DSP blocks, multiple parallel pipelines can be instantiated to process data in parallel, achieving 10-100x speedups versus CPU implementations for fixed algorithms. The 296 user I/Os support PCIe and memory interfaces through external PHYs. Power-performance trade-offs favor Stratix III L over Stratix III E in fan-cooled accelerator cards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F484C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484C4LN | EP3SL50F484C4L | EP3SL50F484C4 | EP3SL50F484C3N | EP3SE50F484C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C4 | C4 | C4 | C4 | C3 (slower) | C4 |
| Power Profile | Low-power (L) | Low-power (L) | Low-power (L) | Low-power (L) | Low-power (L) | Enhanced (E, higher power) |
주요 차별점
- Identical die with lead-free packaging variant (vs EP3SL50F484C4LN)
- Lower-power architecture vs E variant (vs EP3SE50F484C4N)
- Faster C4 speed grade vs C3 (vs EP3SL50F484C3N)
설계 노트
Estimated: the 484-ball FC-FBGA package uses a 1.0 mm ball pitch and requires a 4-6 layer PCB with microvia (laser-drilled) stack-up for fan-out escape routing. Allocate a minimum 23x23 mm land pattern with full-array depopulation in the corners. Use 50 ohm controlled impedance for high-speed I/O banks; pair each differential pair with a continuous reference plane to suppress return-path discontinuities. Add at least 8-10 low-ESL ceramic decoupling capacitors (0.1 µF and 1 µF) within 5 mm of each power pin group, plus bulk electrolytic or polymer capacitors near the FPGA voltage regulator outputs.
Estimated: the EP3SL50F484C4N requires separate 1.1 V core, 2.5 V auxiliary, and per-bank I/O voltages. Designers should use a multi-rail power supply with a minimum 5 A rating on the 1.1 V rail at full utilization. Stratix III's programmable power technology allows turning off unused logic via Quartus configuration to reduce dynamic power by 30-70 percent. Verify worst-case power with the Quartus Early Power Estimator before finalizing the regulator design.
Stratix III FPGAs require a configuration memory device (EPCS/EPCQ flash) for active serial (AS) mode, or an external controller for passive serial (PS) mode. The device does not retain configuration after power-down. Designers commonly overlook MSEL pin strapping for configuration mode selection - incorrect MSEL setting causes configuration failures at first power-up. Also verify JTAG chain integrity before mass production; broken TDO/TDI connections are the most common board bring-up failure.
Estimated: separate digital ground and analog/dirty ground regions only if integrating on-board ADCs/DACs. For FPGA-only designs, use a single ground plane with cutouts only beneath BGA balls as needed for escape. Place all decoupling capacitors on the opposite side of the BGA, with via-in-pad or short microvia to the capacitor pad. Maintain continuous reference planes under all high-speed SERDES and LVDS traces; never route a high-speed trace across a plane split. Reserve the top layer primarily for FPGA fan-out, and route slower signals on inner layers.
규정 준수 정보
Lead-free (Pb-free) per N suffix in MPN. RoHS compliant per Intel/Altera product documentation. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.
