EP3SL50F484C4LN - Stratix III L FPGA, 47.5K LE, 484-FBGA | Intel
부품 번호: EP3SL50F484C4LN ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $225 | $225,000.00 |
EP3SL50F484C4LN 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that engineers can reconfigure after manufacturing. Stratix III L FPGAs sit within Intel's high-performance FPGA portfolio, targeted at signal processing, communications infrastructure, and ASIC prototyping workloads. The 'L' suffix denotes the lower-power variant of the Stratix III family, offering a reduced static power profile compared to the standard Stratix III devices while retaining most of the same logic and transceiver resources.
Key features of the EP3SL50F484C4LN include 1,900 Logic Array Blocks (LABs), integrated transceiver support for high-speed serial protocols, dedicated DSP blocks for high-throughput arithmetic operations, and on-chip memory supporting both single-port and dual-port modes. The 484-pin FBGA package provides a compact footprint suitable for dense PCB layouts, and the -4 speed grade balances timing margin and operating frequency for mainstream applications.
From an architectural standpoint, the device integrates 8-input adaptive logic modules (ALMs), embedded multipliers for DSP pipelines, and a hierarchical clock network supporting multiple PLLs. The transceiver interface supports multi-gigabit serial data rates, making the device well-suited for high-bandwidth signal processing applications.
Typical applications include wireless baseband processing, software-defined radio (SDR), ASIC prototyping, high-speed data acquisition systems, and industrial control platforms. Engineers often select the EP3SL50F484C4LN for projects that require substantial logic density and memory bandwidth within a single low-power FPGA.
When designing with this device, ensure the PCB footprint and ball pattern match the 484-ball FBGA specification exactly, and follow Intel's recommended power-sequencing and decoupling guidelines in the Stratix III L datasheet. Thermal management is essential at full transceiver utilization - plan copper pours and thermal vias accordingly.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP3SL50F484C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F484C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484C4LG
✅ 드롭인✓ 재고 있음
$245 / 개
데이터시트 보기 →EP3SL50F484C4L
✅ 드롭인✓ 재고 있음
$651.25 / 개
데이터시트 보기 →EP3SL50F484C4G
✅ 드롭인✓ 재고 있음
$122.1 / 개
데이터시트 보기 →EP3SL50F484C4
✅ 드롭인✓ 재고 있음
$364.63 / 개
데이터시트 보기 →EP3SL50F484C3N
✅ 드롭인✓ 재고 있음
$458 / 개
데이터시트 보기 →EP3SL50F484C2N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP3SL50F484C4LN 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory | 2,184,192 bits |
| User I/O Pins | 296 |
| 패키지 | 484-ball FBGA (FCBGA) |
| Speed Grade | -4 |
| Temperature Grade | Commercial (0C to +85C) |
| Process Node | 65 nm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EP3SL50F484C4LN 484-ball fbga (fcbga) 핀 구성 가이드
EP3SL50F484C4LN(484-ball fbga (fcbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F484C4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F484C4LN 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Software Defined Radio (SDR), ASIC Prototyping, High-Speed Data Acquisition, Industrial Control Systems, Communications Infrastructure.
Wireless Baseband Processing
The EP3SL50F484C4LN's 47,500 logic elements and integrated transceiver support make it well-suited for wireless baseband processing. The device delivers substantial DSP throughput via its dedicated multiplier blocks, allowing engineers to implement channelization, FFTs, and modulation/demodulation pipelines on-chip. The Stratix III L architecture balances logic density with low static power, which is critical for thermally constrained base station designs. Placed on the baseband card between the RF front end and the network interface, this FPGA enables real-time signal processing at multi-gigabit serial rates. Compared with a discrete DSP+ASIC approach, the EP3SL50F484C4LN offers design flexibility for evolving wireless standards like LTE and 5G NR.
추천
Software Defined Radio (SDR)
The EP3SL50F484C4LN is widely used in SDR platforms where flexible digital signal processing is required. Its 1,900 LABs and embedded memory bandwidth support wideband sample-rate conversion, digital down-conversion, and adaptive filtering across multiple channels simultaneously. The 484-ball FBGA package allows dense PCB integration alongside high-speed ADC/DAC converters, while the 296 user I/O pins provide ample connectivity for parallel data buses. Engineers typically instantiate this FPGA between the analog front end and a host processor, achieving real-time baseband processing for protocols from HF to millimeter-wave.
추천
ASIC Prototyping
The EP3SL50F484C4LN serves as a high-fidelity ASIC prototyping vehicle, allowing engineers to validate RTL designs before committing to mask sets. With 47,500 logic elements and 2.18 Mbits of embedded memory, it accommodates complex ASIC blocks including processor subsystems, peripherals, and custom logic. The -4 speed grade provides sufficient timing margin for real-world operating frequencies, and the Quartus II toolchain supports rapid design iteration. For ASIC prototypes, this FPGA is typically used on validation boards with external memory and standard I/O connectors, enabling pre-silicon software development and system-level verification.
추천
High-Speed Data Acquisition
The EP3SL50F484C4LN is well matched to high-speed data acquisition systems that digitize analog signals at multi-hundred-MSPS rates. Its 296 user I/O pins provide LVDS connectivity to high-speed ADCs, while internal memory and DSP blocks enable real-time preprocessing such as decimation, triggering, and channel aggregation. The 484-ball FBGA package supports clean signal routing for parallel LVDS buses, and the transceiver resources handle high-speed serial links to downstream processors. In oscilloscope and digitizer designs, this FPGA typically buffers and processes ADC samples before transferring them to host memory over PCIe or Ethernet.
추천
Industrial Control Systems
The EP3SL50F484C4LN finds application in industrial controllers where programmable logic interfaces with sensors, actuators, and fieldbus networks. Its logic capacity supports real-time control loops, motion control algorithms, and HMI logic, while the embedded memory buffers data for deterministic processing. The commercial temperature range (0C to +85C) is adequate for most factory-floor environments when paired with proper enclosure design. Engineers use this FPGA in PLC-style platforms where custom protocol stacks and high-speed I/O handling are required, particularly for deterministic EtherCAT, PROFINET, or custom backplane implementations.
추천
Communications Infrastructure
The EP3SL50F484C4LN supports communications infrastructure equipment including line cards, protocol bridges, and baseband aggregation units. Its transceiver resources enable multi-gigabit serial connectivity for backplane and fronthaul links, while the logic density accommodates packet processing, encryption acceleration, and traffic management functions. The low-power Stratix III L variant is particularly valuable for densely populated line cards where thermal and power budgets are constrained. Placed on the data plane, this FPGA typically bridges between PHY devices and network processors, implementing custom protocols and QoS functions.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F484C4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484C4LG | EP3SL50F484C4L | EP3SL50F484C4G | EP3SL50F484C3N | EP3SL50F484C2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | -4 | -4 | -4 | -4 | -3 | -2 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Lead-Free Finish | Yes (N suffix) | Dual finish | No | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Estimated Unit Price (qty 1) | $320.00 | $310.00 | $295.00 | $305.00 | $280.00 | $260.00 |
주요 차별점
- Lead-free Pb-free termination for RoHS compliance (vs EP3SL50F484C4L)
- Highest speed grade (-4) in the family for maximum Fmax (vs EP3SL50F484C3N)
- Lowest-power Stratix III family variant (vs EP3SE50F484C4N)
설계 노트
The 484-ball FBGA package requires careful thermal management, especially when the transceiver and DSP blocks are heavily utilized. Designers should implement a continuous ground plane beneath the device, thermal vias connecting the BGA balls to internal copper layers, and adequate airflow or heatsink attachment. At full transceiver utilization with all channels active, the Stratix III L device can dissipate in the 5-10W range, requiring PCB thermal design per Intel's Stratix III device handbook guidelines.
The EP3SL50F484C4LN requires multiple supply rails including VCCINT (core voltage), VCCIO (I/O voltage per bank), VCCA (PLL analog), and transceiver supplies. Power sequencing must follow Intel's specified order to prevent latch-up. Decoupling capacitors must be placed adjacent to each power pin with short traces to the nearest ground via, using a mix of bulk, mid-range, and high-frequency ceramics per the reference design.
The 484-ball FBGA uses a 1.0 mm ball pitch, which requires HDI PCB fabrication with microvias for breakout routing. Designers should plan a 4-6 layer stackup with dedicated ground and power planes beneath the device. Differential pair routing for transceiver channels must maintain 100 ohm differential impedance with matched lengths within the tolerance specified by the protocol standard (PCIe, XAUI, etc.).
Configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) require specific external pull-up or pull-down resistors per Intel's guidelines. Failing to configure these correctly can prevent the FPGA from initializing. Additionally, JTAG chain integrity is critical - ensure TDI/TDO have proper pull-ups and the chain length does not exceed specifications when multiple devices share the JTAG bus.
규정 준수 정보
RoHS compliant per Intel product page. Lead-free finish indicated by 'N' suffix. REACH, halogen-free, and conflict minerals declarations not present in the verified web data.
