EP3SL50F484C4L - Stratix III L FPGA, 47.5K LE, 484-FCBGA | Altera
부품 번호: EP3SL50F484C4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $834.93 | $834.93 |
| 10 | $801.54 | $8,015.40 |
| 100 | $759.79 | $75,979.00 |
| 500 | $701.74 | $350,870.00 |
| 1,000 | $651.25 | $651,250.00 |
EP3SL50F484C4L 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) connected by programmable interconnect and surrounded by programmable I/O cells. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs: they offer hardware-level parallelism and re-programmability, allowing engineers to implement custom datapaths, DSP pipelines, memory controllers, and high-speed serial interfaces without mask costs. The Stratix III family specifically targets high-end DSP, communications infrastructure, and high-throughput signal-processing designs.
Key features of the EP3SL50F484C4L include up to 2,184,192 bits of embedded memory (≈2.7 Mbit), integrated DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers on related package options, and Altera's adaptive logic module (ALM) architecture for fine-grained resource utilization. The low-power (L) variant reduces static and dynamic power relative to the standard Stratix III family while preserving fabric speed. Hardened IP blocks such as PCI Express endpoints, memory controllers (DDR/DDR2/DDR3), and SERDES channels reduce soft-logic footprint.
Architecturally, the device employs eight-input ALMs that can be partitioned into smaller LUT configurations, providing up to 2.7× the logic capacity of the previous Stratix II generation per LAB. Combined with the 65 nm low-power process, this allows the device to sustain high DSP throughput (GMACS / GFLOPS) at reduced thermal envelope, making it suitable for fanless embedded applications.
Typical applications include telecom baseband processing, software-defined radio (SDR) platforms, high-end video broadcast and image processing, ASIC prototyping, radar and sonar signal processing, and high-speed data acquisition systems. The 296 user I/Os at the package level support multiple parallel interface standards (LVDS, LVTTL, SSTL, HSTL) for direct connection to DDR memories, ADCs, and DACs.
When designing with this device, plan the power tree carefully: Stratix III L devices require multiple voltage rails (VCCINT core, VCCPD I/O pre-driver, VCCIO I/O banks, VCCA_PLL/VCCP auxiliary) with strict sequencing and decoupling per the device handbook. Use Altera's Quartus II design suite for synthesis, place-and-route, and power analysis. Verify thermal margins using the PowerPlay Early Power Estimator before PCB layout.
This page synthesizes distributor pricing from DigiKey and Mouser, lists drop-in same-package variants from the Site MPN list, and provides application-specific design notes that go beyond what appears in the standalone device datasheet.
드롭인 대체품: EP3SL50F484C4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F484C4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$364.63 / 개
데이터시트 보기 →EP3SL50F484C4G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$122.1 / 개
데이터시트 보기 →EP3SL50F484C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$458 / 개
데이터시트 보기 →EP3SL50F484C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SL50F484C2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$478.8 / 개
데이터시트 보기 →EP3SL50F484C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$175 / 개
데이터시트 보기 →EP3SL50F484C4L 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| User I/O Count | 296 |
| Total RAM Bits | 2,184,192 |
| Core Voltage | 0.9 V |
| Process Technology | 65 nm CMOS |
| 동작 온도 범위 | 0°C to 85°C (commercial) |
| 패키지 | 484-ball FBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Design Software | Quartus II |
| Architecture | Adaptive Logic Module (ALM) |
EP3SL50F484C4L 484-ball fbga (fineline bga) 핀 구성 가이드
EP3SL50F484C4L(484-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F484C4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F484C4L 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, Software-Defined Radio (SDR) Platforms, High-End Video Broadcast Processing, ASIC Prototyping, Radar and Sonar Signal Processing, High-Speed Data Acquisition Systems.
Telecom Baseband Processing
The EP3SL50F484C4L fits telecom baseband processing where 47,500 logic elements, 2.18 Mbit of embedded RAM, and dedicated DSP blocks provide the parallelism needed for channel coding, modulation/demodulation, and FFT pipelines. The Stratix III L architecture delivers DSP throughput suitable for multi-carrier LTE base stations at low static power, while the 484-ball FBGA routes 296 user I/Os to external DDR memory and high-speed ADC/DAC data buses. Designers use hardened memory controller IP to drive DDR2/DDR3 directly. Trade-off: the Stratix III L family is obsolete as of 2026-09-09, so new baseband designs should consider Cyclone IV GX or Stratix IV/V equivalents for long-term supply. Source: Stratix III Device Handbook (stx3_siii51001).
추천
Software-Defined Radio (SDR) Platforms
Software-defined radio platforms benefit from the EP3SL50F484C4L's combination of 47.5K LE for digital down-conversion (DDC) and up-conversion (DUC) chains, plus embedded RAM for sample buffering and DSP blocks for FIR filtering. The 484-ball FBGA exposes 296 I/Os to interface with high-speed ADCs and DACs commonly used in SDR front-ends, and the 0.9 V core helps meet thermal envelopes in chassis-mounted SDR modules. Quartus II DSP Builder accelerates MATLAB/Simulink-to-FPGA workflows for rapid waveform prototyping. Note: for new SDR programs needing active lifecycle support, migrate to Cyclone V or Stratix 10 families. Source: Stratix III Device Handbook DSP chapter.
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High-End Video Broadcast Processing
Broadcast video processing (e.g., 3G-SDI routing, video format conversion, real-time overlay composition) fits the EP3SL50F484C4L because of its 2.18 Mbit embedded RAM for line buffers and its abundant logic elements for multi-stream video pipelines. The 296 user I/Os support multiple LVDS video interfaces, and the Stratix III L architecture handles up to 717 MHz fabric operation. Hardened memory controller IP enables direct DDR3 frame buffering at low latency. For 4K/UHD broadcast designs, however, the 47.5K LE may be tight; consider migrating to Stratix V or Stratix 10 for higher logic density. Source: Stratix III Device Handbook memory and I/O chapters.
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ASIC Prototyping
ASIC prototyping with the EP3SL50F484C4L leverages its 47.5K LE and 484-ball FBGA to map RTL designs for functional verification before tape-out. Multiple EP3SL50F484C4L devices can be cascaded via dedicated I/O banks for very large ASICs, and Quartus II's incremental compilation supports team-based prototyping workflows. Embedded RAM and DSP blocks closely match common ASIC functions such as FIFOs and MAC units. Caveat: the 0.9 V core requires careful PCB power tree design with multiple decoupling capacitors; follow the Stratix III pin connection guidelines for signal integrity. Source: Stratix III Device Handbook configuration and pin connection chapters.
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Radar and Sonar Signal Processing
Radar and sonar signal processing designs use the EP3SL50F484C4L's DSP blocks for pulse compression, MTD filtering, and beamforming computations. With 47.5K LE, designers can implement multi-channel processing pipelines and FFT engines directly in fabric, while 2.18 Mbit embedded RAM serves as sample and coefficient memory. The 484-ball FBGA and 296 I/Os route high-speed ADC data into the FPGA from RF front-ends. The Stratix III L low-power variant helps meet thermal envelopes in marine and airborne platforms. For long-lifecycle military/aerospace programs, verify obsolescence risk and source through authorized brokers. Source: Stratix III Device Handbook DSP chapter.
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High-Speed Data Acquisition Systems
High-speed data acquisition cards use the EP3SL50F484C4L to capture and process data streams from parallel ADC arrays. The 296 user I/Os support LVDS source-synchronous ADC interfaces (e.g., 14-/16-bit ADCs at 250+ MSPS), and the embedded RAM acts as a deep FIFO for transient capture. DSP blocks implement real-time digital filtering, decimation, and threshold detection before the data is DMA-transferred to a host via PCIe (using a hard PCIe endpoint IP block). Quartus II SignalTap II logic analyzer assists bring-up and verification. Source: Stratix III Device Handbook transceiver and memory interface chapters.
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추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F484C4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484C4 | EP3SL50F484C4G | EP3SL50F484C3N | EP3SL50F484C3 | EP3SL50F484C2 | EP3SL50F484C2N |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 47,500 | 47,500 - same | 47,500 - same | 47,500 - same | 47,500 - same | 47,500 - same | 47,500 - same |
| Speed Grade | C4 (fastest) | C4 - same | C4 - same | C3 (-1 grade) | C3 (-1 grade) | C2 (-2 grades) | C2 (-2 grades) |
| Lead Finish | Pb-free (L) | Non-L (leaded) | RoHS/Green Pb-free | Non-L (leaded) | Non-L (leaded) | Non-L (leaded) | Non-L (leaded) |
| User I/O Count | 296 | 296 - same | 296 - same | 296 - same | 296 - same | 296 - same | 296 - same |
| Total RAM Bits | 2,184,192 | 2,184,192 - same | 2,184,192 - same | 2,184,192 - same | 2,184,192 - same | 2,184,192 - same | 2,184,192 - same |
| Core Voltage | 0.9 V | 0.9 V - same | 0.9 V - same | 0.9 V - same | 0.9 V - same | 0.9 V - same | 0.9 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- 47,500 logic elements with 2.18 Mbit embedded RAM in 484-ball FBGA (vs EP3SL50F484C4)
- C4 speed grade (fastest in Stratix III L family) (vs EP3SL50F484C3N)
- Pb-free lead finish explicitly designated by 'L' suffix (vs EP3SL50F484C4)
설계 노트
Estimated: The Stratix III L EP3SL50F484C4L requires multiple independent voltage rails. Per the Stratix III Device Handbook: VCCINT (0.9 V core) supplies the logic fabric and DSP blocks; VCCPD powers the I/O pre-drivers and must be 2.5 V / 3.0 V depending on bank; VCCIO is per-bank (1.2 V to 3.0 V) for LVDS/LVTTL/SSTL I/O standards; VCCA_PLL and VCCP supply PLLs and need filtered, low-noise rails. Power sequencing must follow the device handbook: VCCINT must reach 0.9 V before VCCPD and VCCIO, with monotonic ramp rates. Add bulk decoupling (>= 220 µF) at each regulator and 0.1 µF + 10 µF ceramic pairs near each power pin. Use the PowerPlay Early Power Estimator before layout to budget rails. Estimated quiescent current for VCCINT at room temperature is approximately 0.5-1.0 A depending on utilization; dynamic current scales with toggle rate.
Estimated: The 484-ball FBGA has a theta_JA of approximately 12-15 C/W with a standard 4-layer JEDEC test board. At 47.5K LE utilization near 80% and a 200 MHz clock, expect 3-5 W dynamic power plus ~0.5 W static, totaling ~3.5-5.5 W. Junction temperature rise above ambient is then 42-83 C. With a 70 C max ambient commercial spec, this leaves adequate thermal margin without a heatsink, but sustained 100% utilization designs should use thermal vias under the package center and 4+ layer PCB stack-up with a continuous ground plane beneath the device to spread heat. Monitor case temperature in prototype builds and add a heatsink if Tj approaches 85 C.
The 484-ball FineLine BGA has 1.0 mm ball pitch. PCB design requires laser-drilled or 0.4 mm mechanically-drilled microvias with via-in-pad construction for reliable assembly. Use an 8- or 10-layer stack-up to route 296 user I/Os out from the BGA perimeter. Route length-matched differential pairs (LVDS) within ±50 mil tolerance for source-synchronous interfaces. Decoupling: place 0402-size 0.1 µF X7R ceramics on the bottom side directly under each power-ball group, with 0603-size 4.7 µF X5R ceramics adjacent. Match impedance for 50 Ω single-ended and 100 Ω differential traces. Refer to Altera's Stratix III board design guidelines (AN 514) for full stack-up recommendations.
Common pitfalls when designing with EP3SL50F484C4L: (1) Violating power-up sequencing by allowing VCCIO to rise before VCCINT causes latch-up or logic corruption - always follow the Stratix III handbook sequence. (2) Forgetting configuration mode pin pull-ups (MSEL pins) - the device will not configure without proper MSEL settings. (3) Driving configuration pins (nCONFIG, nSTATUS, CONF_DONE) with active signals before power-up can prevent configuration - leave them open or pulled via recommended values. (4) Using JTAG without a 1 kΩ pull-up on TCK per IEEE 1149.1 - causes boundary scan failures. (5) Operating outside the 0-85 C commercial junction range in non-I grade parts reduces MTBF. (6) The part is obsolete as of 2026-09-09 - do not use it for new designs without an explicit last-time-buy plan.
규정 준수 정보
RoHS compliant by 'L' suffix designation. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Halogen-free status not declared in available data - set unknown. Conflict-minerals compliant per Intel standard CMRT reporting.