EP3SL70F484C4L - Stratix III L FPGA, 67.5K LE, 484-FCBGA | Intel
부품 번호: EP3SL70F484C4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1320 | $13,200.00 |
| 100 | $1190 | $119,000.00 |
| 500 | $1080 | $540,000.00 |
| 1,000 | $985 | $985,000.00 |
EP3SL70F484C4L 개요
An FPGA (Field Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) → programmable logic → semiconductor IC, and offer parallel processing capability that microcontrollers and DSPs cannot match. The Stratix III L series targets ASIC prototyping, high-performance DSP, and communication infrastructure workloads where deterministic, parallel hardware acceleration is required.
Key features of the EP3SL70F484C4L include 67,500 logic elements, 2,699,264 bits of embedded memory, 2,700 LABs, 296 user I/Os, 375 MHz maximum operating frequency, 0.9 V core supply, and a 484-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. The Stratix III L family is engineered for low static and dynamic power consumption relative to the original Stratix III, making it suitable for thermally constrained embedded systems.
The device integrates programmable logic fabric with rich on-chip memory and DSP blocks, enabling designers to implement custom parallel datapaths, complex state machines, and high-throughput signal-processing pipelines. Configuration is stored in SRAM cells that can be re-loaded at power-up from an external flash or configuration device, supporting in-field design upgrades and multi-bitstream workflows.
Typical applications include ASIC prototyping and emulation, high-performance DSP pipelines, wireline communication infrastructure, military and aerospace signal processing, and test and measurement equipment. The 484-FCBGA package offers a compact footprint for high I/O count designs while supporting the power-delivery requirements of high-utilization workloads.
When designing with the EP3SL70F484C4L, ensure the PCB has sufficient decoupling capacitors placed close to each power pin, and that the 484-ball BGA footprint is laid out with manufacturer-recommended escape routing. Designers should also note that the Stratix III family is approaching end-of-life (NRND/last-time-buy status), so long-production programs should plan second-source or migration strategies.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP3SL70F484C4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F484C4L (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Family, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F484C4
✅ 드롭인✓ 재고 있음
$780 / 개
데이터시트 보기 →EP3SL70F484C4G
✅ 드롭인✓ 재고 있음
$1485 / 개
데이터시트 보기 →EP3SL70F484C3G
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP3SL70F484C3
✅ 드롭인✓ 재고 있음
$810 / 개
데이터시트 보기 →EP3SL70F484C2G
✅ 드롭인✓ 재고 있음
$240 / 개
데이터시트 보기 →EP3SL70F484C2
✅ 드롭인✓ 재고 있음
$980 / 개
데이터시트 보기 →EP3SL50F484C4L
✅ 드롭인✓ 재고 있음
$651.25 / 개
데이터시트 보기 →EP3SL70F484C4L 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements (LE) | 67,500 |
| Embedded Memory (Bits) | 2,699,264 |
| Logic Array Blocks (LABs) | 2,700 |
| User I/O Count | 296 |
| Operating Frequency (Max) | 375 MHz |
| Core Voltage | 0.9 V |
| Process Technology | 65 nm |
| 패키지 | 484-ball FC-FBGA (FBGA-484) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
| Configuration Memory | SRAM-based |
| Operating Temperature Grade | Commercial (C4) |
| Lead-Free | Yes |
| Shipping Form | Tray |
EP3SL70F484C4L 484-ball fc-fbga (fbga-484) 핀 구성 가이드
EP3SL70F484C4L(484-ball fc-fbga (fbga-484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL70F484C4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL70F484C4L 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Wireline Communication Infrastructure, Military and Aerospace Signal Processing, Test and Measurement Equipment, Industrial Control and High-Speed I/O Aggregation.
ASIC Prototyping and Emulation
The EP3SL70F484C4L fits ASIC prototyping and emulation workloads where designers must validate a register-transfer level (RTL) design before committing to mask sets. The 67,500 logic elements and 2,699,264 bits of embedded memory (approximately 338 KB) allow partitioning of large ASIC designs into a single FPGA, reducing bring-up time and enabling in-lab debug before tape-out. The 296 user I/Os in the 484-ball FBGA package support the high pin-count that ASIC netlists typically require, while SRAM-based configuration enables rapid design-iteration cycles - designers simply re-load a new bitstream from external flash without re-soldering. Compared to ASIC builds that cost millions and take months, prototyping on the EP3SL70F484C4L cuts iteration time from weeks to days.
추천
High-Performance DSP Pipelines
The EP3SL70F484C4L serves DSP pipeline applications including radar baseband processing, software-defined radio (SDR), and multi-channel video processing. The on-chip DSP blocks paired with 67,500 LEs can implement hundreds of multiply-accumulate (MAC) operations per clock cycle, and 2,699,264 bits of block RAM provide deep sample buffers for FIR filters and FFT engines. At a 375 MHz fabric speed, real-time baseband processing for narrowband signals is achievable without external co-processors. The 484-ball FBGA supports the high I/O bandwidth required for parallel ADC/DAC interfaces, allowing direct connection to high-speed converters. Compared to discrete DSP chips, the FPGA delivers superior parallel throughput at similar power.
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Wireline Communication Infrastructure
The EP3SL70F484C4L targets wireline communication infrastructure including Ethernet switches, OTN (Optical Transport Network) framer/mapper devices, and packet processors. Its 67,500 logic elements can implement full protocol stacks including MAC, PCS, and higher-layer processing for 10G/40G line cards, while 2,699,264 bits of embedded memory buffer packet headers and statistics counters. The 296 user I/Os accommodate multiple SFP+/QSFP interfaces and backplane serial links. With Stratix III L's low-power architecture, the part suits fan-cooled line cards where thermal budget is tight. Compared to ASIC solutions, the FPGA enables late-binding feature upgrades and multi-protocol support on the same hardware.
추천
Military and Aerospace Signal Processing
The EP3SL70F484C4L fits military and aerospace signal-processing platforms where deterministic, parallel hardware is essential. With 67,500 LEs, the device can implement complete radar pulse-compression, beamforming, and electronic-countermeasure (ECM) algorithms on a single chip. The 484-ball FC-FBGA package's fine-pitch BGA geometry is qualified for high-reliability PCB assemblies, and the Stratix III L family's low-power profile helps meet conduction-cooled envelope budgets. SRAM-based configuration supports secure bitstream loading and field reprogramming across long program lifecycles. Compared to processor-based implementations, FPGA parallelism delivers deterministic latency for real-time EW applications.
추천
Test and Measurement Equipment
The EP3SL70F484C4L fits test and measurement (T&M) equipment such as protocol analyzers, arbitrary waveform generators, and bit-error-rate testers. The 67,500 logic elements and 2,699,264 bits of block RAM enable deep capture buffers for protocol analysis (e.g., PCIe, SATA, USB), while 296 user I/Os support high-speed parallel probe interfaces. The 375 MHz fabric enables real-time protocol decoding and stimulus generation without offloading to a host PC. Compared to fixed-function T&M ASICs, FPGA-based instrumentation allows field-upgradeable support for new protocols and customer-specific test patterns.
추천
Industrial Control and High-Speed I/O Aggregation
The EP3SL70F484C4L is well suited for industrial-control platforms that aggregate high-speed I/O and perform deterministic real-time processing. With 67,500 LEs, it can implement multiple industrial protocols (EtherCAT, PROFINET, EtherNet/IP) in parallel, plus motion-control loops with sub-microsecond cycle times. The 296 user I/Os in the 484-ball FBGA package support multi-axis encoder interfaces, high-speed digital I/O, and multiple Ethernet PHYs. SRAM-based configuration enables factory-floor firmware updates over industrial Ethernet. Compared to microcontroller-based PLCs, the FPGA delivers deterministic latency and parallel protocol handling that microcontrollers cannot match.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F484C4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F484C4 | EP3SL70F484C4G | EP3SL70F484C3G | EP3SL70F484C3 | EP3SL50F484C4L |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) |
| Logic Elements | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | 50,000 LE |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C4 | C4 | C4 | C3 (slower fMAX) | C3 (slower fMAX) | C4 |
| Pb-Free / RoHS | Yes (L-suffix typically Pb-free) | Standard commercial grade | Yes (Pb-free G-suffix) | Yes (Pb-free G-suffix) | Standard commercial grade | Yes (L-suffix Pb-free) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Low-power Stratix III L variant with reduced static and dynamic power vs standard Stratix III (vs EP3SL50F484C4L)
- Higher logic capacity in the same 484-ball FBGA footprint vs Stratix III E family (vs EP3SE50F484C4L)
- Pin-compatible speed-grade variants for cost vs performance trade-offs (vs EP3SL70F484C3G)
설계 노트
The 484-ball FC-FBGA package requires careful PCB escape routing. Place a minimum of one decoupling capacitor (typically 100 nF X7R + 10 uF bulk) adjacent to each power pin, and use a 4-layer stack-up with continuous ground and power planes directly beneath the BGA. For signal escape, use via-in-pad or microvia technology to break out the 1.0 mm pitch BGA ball array without violating design-for-manufacturability (DFM) rules.
The 0.9 V core supply must be sequenced AFTER the I/O bank supplies to prevent latch-up and to meet Intel's power-on-reset requirements. Use a dedicated power-supply sequencer IC or a simple RC delay network on the PWRGOOD signal of the core regulator. Estimate: at 67,500-LE utilization with full logic activity, core current draw can reach 3-5 A; verify with the Quartus PowerPlay analyzer during design compilation for the actual workload.
Stratix III devices are NRND - do not start new production designs on this family. New projects should evaluate Stratix IV/V or Cyclone V/10 families with the Quartus Prime design toolchain. For existing Stratix III L designs, plan last-time-buy orders with Intel representatives before the part becomes obsolete. Verify lead times at qty-1, qty-100, and qty-1000 before committing to production schedules.
The 296 user I/Os in the 484-ball FBGA span multiple I/O banks with independently programmable voltage standards. For high-speed interfaces (LVDS, DDR2/3, etc.), enforce the I/O bank's VCCIO supply, slew-rate, and termination settings per the Stratix III Device Handbook. Estimate: differential-pair matching tolerance is +/- 25 mil on the PCB, and unmatched pairs above 500 Mbps will fail timing closure.
규정 준수 정보
RoHS compliance per Altera/Intel product page. Halogen-free status not explicitly stated in the verified data - set to 'unknown'. AEC-Q100 not applicable for FPGAs in commercial-grade configurations. Stratix III L family is NRND; consult Intel representative for last-time-buy dates.
