EP3SL340H1152I4 - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
부품 번호: EP3SL340H1152I4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17269.01 | $17,269.01 |
| 10 | $17050 | $170,500.00 |
| 100 | $16500 | $1,650,000.00 |
| 500 | $15800 | $7,900,000.00 |
| 1,000 | $15100 | $15,100,000.00 |
EP3SL340H1152I4 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs) connected via programmable interconnect and surrounded by I/O blocks; modern high-end FPGAs like the Stratix III L family also embed hardened memory controllers, transceivers, DSP blocks, and PLLs to enable complete system-on-chip designs without external ASICs. FPGAs sit hierarchically within the broader taxonomy: programmable logic device -> programmable logic IC -> digital IC -> semiconductor -> integrated circuit.
Key features of the EP3SL340H1152I4 include 744 user I/O pins, embedded multiplier blocks (18x18), high-speed LVDS pairs, dedicated DDR/DDR2/DDR3 memory controllers with hard PHY, and up to 12 embedded transceivers depending on configuration. The 1152-ball HBGA package uses Intel's flip-chip BGA technology for low inductance power distribution and high signal integrity at multi-hundred-MHz fabric speeds.
The Stratix III L variant specifically targets lower static power compared to the standard Stratix III family while preserving high-performance fabric features such as adaptive logic modules (ALMs), M9K and M144K memory blocks, and DSP blocks with hardware multipliers and accumulators. This positions the EP3SL340H1152I4 for power-sensitive applications that still demand hundreds of thousands of logic elements.
Typical applications include high-end wireline telecom line cards, software-defined radio (SDR) baseband processing, military radar signal processing, ASIC prototyping and emulation platforms, high-performance DSP pipelines, broadcast video processing, and medical imaging accelerators. The 337.5K LE capacity supports complete protocol stacks plus parallel processing dataplanes on a single device.
Designers should provide a multi-rail power system (typically 1.1 V core, 2.5 V/3.3 V aux, and dedicated PLL analog supplies) with bulk decoupling and high-frequency ceramic bypass near the BGA balls. Thermal management is critical because the flip-chip BGA dissipates up to 25-30 W at full fabric utilization, often requiring a heatsink and controlled airflow. Signal integrity must be considered for the high-speed LVDS and transceiver channels.
This page synthesizes distributor pricing, parametric alternatives, and PCB thermal/layout notes not consolidated in the manufacturer datasheet. Pricing references distributor stock data as of 2026-09-09.
드롭인 대체품: EP3SL340H1152I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340H1152I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Operating Temperature Grade, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL340H1152I3
✅ 드롭인✓ 재고 있음
$13234.64 / 개
데이터시트 보기 →EP3SL340H1152I3N
✅ 드롭인✓ 재고 있음
$14250 / 개
데이터시트 보기 →EP3SL340H1152C4N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP3SL340H1152C4
✅ 드롭인✓ 재고 있음
$11000 / 개
데이터시트 보기 →EP3SL340H1152C3
✅ 드롭인✓ 재고 있음
$2550 / 개
데이터시트 보기 →EP3SL340H1152C2N
✅ 드롭인✓ 재고 있음
$3400 / 개
데이터시트 보기 →EP3SL340H1152C2
✅ 드롭인✓ 재고 있음
$15800 / 개
데이터시트 보기 →EP3SL340H1152I4 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Logic Elements (LE) | 337,500 |
| Embedded Memory | 18,821,440 bits |
| User I/O Pins | 744 |
| Logic Array Blocks (LABs) | 13,500 |
| Operating Frequency | 717 MHz (max fabric speed) |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| 패키지 | 1152-ball FCBGA / HBGA |
| 실장 유형 | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I4: -40C to +100C junction) |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, LVTTL |
| Memory Interface Hard IP | DDR / DDR2 / DDR3 SDRAM controllers with PHY |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP3SL340H1152I4 1152-ball fcbga / hbga 핀 구성 가이드
EP3SL340H1152I4(1152-ball fcbga / hbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL340H1152I4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL340H1152I4 적합 용도: 7 애플리케이션s: Wireline Telecom Line Cards, Software-Defined Radio (SDR) Baseband, Military Radar Signal Processing, ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Broadcast Video Processing, High-Speed Industrial Test & Measurement.
Wireline Telecom Line Cards
The EP3SL340H1152I4's 337,500 logic elements and 18.8 Mbit embedded memory make it a strong fit for high-density wireline telecom line cards such as OTN cross-connects, carrier Ethernet switches, and multi-port packet processors. Its hard DDR3 memory controllers support high-bandwidth look-up tables and packet buffers at line rate. The 744 user I/Os accommodate multiple 10G/40G SerDes interfaces plus parallel fabric connections to NPUs. The Stratix III L variant's lower static power is critical in central-office chassis where dozens of FPGAs share a backplane with constrained cooling budgets. The I4 industrial temperature grade (-40C to +100C junction) supports outdoor cabinet deployments in addition to climate-controlled CO environments.
추천
Software-Defined Radio (SDR) Baseband
The EP3SL340H1152I4's combination of DSP blocks, embedded multipliers (18x18 hardware multipliers), and 18.8 Mbit block RAM is well-suited to multi-channel SDR baseband processing for LTE, 5G NR, and military waveforms. The 717 MHz fabric speed enables sample-rate processing in the hundreds of MSPS range with parallel channelization. Its high I/O count supports multi-antenna MIMO configurations, and the industrial temperature grade allows deployment in outdoor base-station enclosures. The Stratix III L family was widely adopted in 4G base-station baseband designs and continues to serve 5G small-cell deployments where the fabric density matches the channel count. Engineers pair the FPGA with high-speed ADC/DAC front-ends and use the DDR3 hard controllers for ADC buffer capture.
추천
Military Radar Signal Processing
Military phased-array radar systems require FPGA-based beamforming and pulse-Doppler processing that demands hundreds of thousands of logic elements with deterministic latency. The EP3SL340H1152I4's 337,500 LEs and high fabric clock rate are well-matched to radar pulse processing and FFT pipelines operating on multi-hundred-MSPS data streams. The industrial temperature grade and flip-chip BGA package suit ruggedized military housings subject to thermal cycling. The Stratix III family's embedded memory supports range-Doppler map storage on-chip, reducing external memory traffic. Additionally, the device's high I/O count accommodates multiple optical or copper links to RF front-ends. The L variant's lower static power is valued in unmanned and battery-backed radar installations.
추천
ASIC Prototyping and Emulation
The EP3SL340H1152I4 is a workhorse for ASIC prototyping and emulation platforms, where its 337,500 logic elements can map portions of a multi-million-gate ASIC design. Multiple EP3SL340H1152I4 devices are typically combined on a logic-emulation motherboard to provide 1-2 MLE of capacity per chassis. The flip-chip BGA package supports high-speed board-to-board interconnect via LVDS, enabling fast FPGA-to-FPGA pin mapping. The DDR3 hard memory controllers simplify ASIC memory-subsystem modeling. Engineers can partition ASIC RTL into Stratix III L FPGAs and verify full-chip operation at near-real-time clock speeds, dramatically reducing silicon re-spins.
추천
High-Performance DSP Pipelines
Medical imaging (CT, MRI, ultrasound), seismic processing, and broadcast video codecs use the EP3SL340H1152I4 to implement massively parallel DSP pipelines that exceed CPU/GPU performance per watt. The Stratix III L family provides dedicated DSP blocks with hardware multipliers and accumulators that achieve hundreds of GMACS of DSP throughput at 717 MHz. The 18.8 Mbit embedded memory supports sliding-window and FFT intermediate buffers on-chip, avoiding external memory bottlenecks. The high I/O count interfaces to high-speed ADC front-ends and DDR3 sample buffers. For ultrasound beamforming specifically, the fabric's deterministic latency is essential for coherent summation across array channels.
추천
Broadcast Video Processing
Broadcast video switchers, multi-viewers, and 4K/8K video processing engines leverage the EP3SL340H1152I4's logic density to implement color-space conversion, scaling, deinterlacing, and overlay composition in real time. The fabric can drive multiple HDMI/DisplayPort/SDI output channels simultaneously with very low latency. DDR3 hard memory controllers support frame-buffer storage for pipelined video processing at 60-120 Hz refresh rates. The industrial temperature grade suits OB (outside broadcast) vans and field production trucks subject to wide temperature swings. The 744 user I/Os handle multiple parallel video data buses plus auxiliary audio and control channels without external muxing.
추천
High-Speed Industrial Test & Measurement
ATE (Automated Test Equipment) and high-speed oscilloscope/pattern-generator designs use the EP3SL340H1152I4 for waveform synthesis, timing calibration, and protocol-aware pattern generation across hundreds of test channels. The device's parallel I/O and DDR3 controllers drive pattern memory plus capture buffers at multi-Gbps rates. The fabric density supports per-channel DSP for eye-diagram analysis, jitter decomposition, and equalization. The flip-chip BGA package and high pin count accommodate dense probe-card interconnect. The industrial temperature grade suits factory-floor ATE racks with variable cooling. Engineers pair the FPGA with high-speed DAC/ADC and use the fabric to implement per-pin parametric measurement units.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL340H1152I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL340H1152I3 | EP3SL340H1152I3N | EP3SL340H1152C4N | EP3SL340H1152C4 | EP3SL340H1152C3 |
|---|---|---|---|---|---|---|
| Package | 1152-ball HBGA (FCBGA) | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 337,500 | 337,500 - same | 337,500 - same | 337,500 - same | 337,500 - same | 337,500 - same |
| Speed Grade | I4 (industrial, fastest) | I3 (industrial, ~5-10% slower) | I3 Pb-free (industrial) | C4 (commercial, similar to I4) | C4 (commercial) | C3 (commercial, slower) |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O | 744 | 744 - same | 744 - same | 744 - same | 744 - same | 744 - same |
| Embedded Memory | 18,821,440 bits | 18,821,440 bits - same | 18,821,440 bits - same | 18,821,440 bits - same | 18,821,440 bits - same | 18,821,440 bits - same |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same |
주요 차별점
- Highest speed bin (I4) for industrial temperature operation (vs EP3SL340H1152I3)
- Industrial temperature grade (-40C to +100C junction) (vs EP3SL340H1152C4)
- Same die and footprint as lower-cost speed grades (vs EP3SL340H1152C3)
- 337,500 LE fabric matches the largest Stratix III L density (vs EP3SL200H780I4)
설계 노트
Estimated: The EP3SL340H1152I4 in the 1152-ball HBGA flip-chip package can dissipate 10-30 W depending on fabric utilization and clocking. The flip-chip BGA attaches directly to the PCB land pattern, so primary thermal path is through the PCB BGA pads into internal copper planes and the board's heatsink stack. For full-power operation (above ~10 W), a heatsink with thermal interface material is recommended, and chassis airflow should maintain case temperature below 85C. Estimating with theta_JA of ~10 C/W (with 4-layer PCB and minimal airflow) at 15 W yields a 150C junction rise above ambient - clearly inadequate. The I4 industrial junction rating (-40C to +100C) requires careful thermal budgeting; in practice designers use heatsinks plus 1-2 m/s airflow.
The Stratix III L family requires a multi-rail power system: 1.1 V core (typically 15-25 A peak, depending on toggle rate), 2.5 V or 3.0 V analog supply for PLLs, 3.3 V (or 2.5 V) I/O supply, and dedicated configuration/sense pins. Bulk decoupling (220 uF polymer or multiple 22 uF ceramics per rail) plus high-frequency 0.1 uF/1 nF bypass near each BGA power pin cluster is required. Power sequencing must ensure the 1.1 V core is monotonic and does not exceed 1.1 V during ramp; failure to control ramp can stress gate oxide. Use a dedicated Power Management Unit (PMU) such as the LTM4644 or EN6337QI for multi-rail generation.
The 1152-ball HBGA uses 0.8 mm ball pitch, requiring a PCB with high-density interconnect (HDI) build-up. Use microvias (laser-drilled) to escape the BGA balls to inner layers, and ensure the BGA land pattern follows the IPC-7351 BGA guidelines. PCB stackup should include at least 6 layers with dedicated ground and 1.1 V planes on adjacent layers to minimize inductance in the core power delivery network. Differential pair routing for LVDS (100 ohm differential) and high-speed transceiver channels must control impedance to 85-100 ohm differential with matched lengths within 5 ps. Avoid signal vias in the BGA footprint area to maintain reference-plane continuity for the core supply.
Common pitfalls when designing with EP3SL340H1152I4: (1) Using commercial-grade (C-grade) parts in industrial-temperature applications - the speed and temperature drift outside spec; (2) Skipping the JTAG programming header - all Stratix III devices require the JTAG chain (TCK/TMS/TDO/TDI plus VCCIO) for programming, even if using the AS configuration mode; (3) Omitting the configuration device - the EP3SL340 requires an external configuration memory (EPCS64 or compatible) on the PCB; (4) Underestimating transceiver reference clock jitter - the GXB/PLL reference clock must be < 1 ps RMS jitter for multi-gigabit operation; (5) Driving the configuration DONE pin from an external source - this pin is open-drain and must be pulled up to VCCIO with a 5 kohm resistor.
규정 준수 정보
RoHS compliant per Intel product page; lead-free finish standard for HBGA-1152 package. AEC-Q100 not applicable for FPGAs (automotive qualification is not standard for Stratix III L; Cyclone IV/V families target AEC-Q100). Conflict minerals compliance per Intel's published Conflict-Free Smelter Program disclosure.
