EP4SGX360FF35C3 - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
부품 번호: EP4SGX360FF35C3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2420 | $1,210,000.00 |
| 1,000 | $2285 | $2,285,000.00 |
EP4SGX360FF35C3 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that allows designers to implement custom digital logic, memory, and high-speed serial interfaces in silicon after fabrication. Stratix IV GX sits in the hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. The GX family integrates multi-gigabit transceivers alongside programmable fabric, enabling high-bandwidth connectivity for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G, which is the primary differentiator versus the logic-only Stratix IV E and Stratix IV GT (memory-rich) variants.
Key features of the EP4SGX360FF35C3 include 564 user I/O pins, integrated transceivers, dedicated DSP blocks for high-throughput fixed-point and floating-point arithmetic, embedded TriMatrix memory, and hard memory controllers for DDR/DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II. The FF35 package offers the highest pin count available in the Stratix IV GX lineup, making it suitable for high-density, transceiver-rich system designs where board space is less constrained than in compact modules.
Typical applications include high-end wireline telecom line cards, military/aerospace signal processing, ASIC prototyping, test and measurement equipment, broadcast video processing, and high-performance computing accelerators. Designers select this part when their design requires maximum logic capacity combined with embedded multi-gigabit serial links on a single die.
Design considerations for the EP4SGX230/360 family emphasize multi-rail power sequencing (core 0.9 V, transceiver PLLs, I/O banks), thermal management of the 35x35 mm FC-FBGA, and PCB layout for transceiver signal integrity. Use the Quartus II design software (now Intel Quartus Prime) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4SGX360FF35C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360FF35C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360FF35C2X
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP4SGX360FF35C4
✅ 드롭인✓ 재고 있음
$5189.41 / 개
데이터시트 보기 →EP4SGX360FF35I3
✅ 드롭인✓ 재고 있음
$1695 / 개
데이터시트 보기 →EP4SGX360FF35I3N
✅ 드롭인✓ 재고 있음
$9100 / 개
데이터시트 보기 →EP4SGX360FF35C2XN
✅ 드롭인✓ 재고 있음
$2600 / 개
데이터시트 보기 →EP4SGX360FF35C2X
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP4SGX360FF35C3 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Family | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 |
| Logic Array Blocks (LAB) | 14,144 |
| Embedded Memory | 23,105,536 bits |
| User I/O Pins | 564 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) |
| 동작 접합 온도 | 0 C to 85 C |
| Grade | Commercial |
| 패키지 | 1152-FBGA (35x35 mm), FCBGA |
| 실장 유형 | Surface Mount |
| Speed/Package Grade | FF35 |
| 메모리 유형 | TriMatrix (MLAB + M9K + M144K blocks) |
| DSP Blocks | Yes (dedicated) |
| Hard Memory Controller | DDR/DDR2/DDR3, QDRII+, RLDRAM II |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP4SGX360FF35C3 ff35 핀 구성 가이드
EP4SGX360FF35C3(ff35 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360FF35C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360FF35C3 적합 용도: 6 애플리케이션s: High-Speed Wireline Telecom Line Card, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Test and Measurement Equipment, Broadcast Video Processing, High-Performance Computing Accelerator.
High-Speed Wireline Telecom Line Card
The EP4SGX360FF35C3's 353,600 logic elements, integrated multi-gigabit transceivers (up to 8.5 Gbps), and 564 user I/Os make it well-suited for carrier-grade line cards. According to Intel's Stratix IV GX positioning, this device supports protocols such as Serial RapidIO, XAUI, Interlaken, and PCI Express Gen2, enabling aggregation switch fabrics and OTN framer implementations. Its hard memory controllers handle DDR3/QDRII+ line-buffer storage. Compared with Stratix IV E, the GX integrated transceivers reduce BOM cost by eliminating external SERDES, while the FF35 1152-FBGA package supports dense, multi-lane front-panel designs with sufficient I/O for backplane interconnect and front-panel optical cages.
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ASIC Prototyping and Emulation
With 353,600 logic elements and abundant interconnect, the EP4SGX360FF35C3 functions as a multi-FPGA ASIC prototyping platform for pre-silicon verification. Its 564 user I/Os accommodate deep-chip-to-chip partitioning across multiple FPGAs using LVDS or sub-LVDS bridging. Quartus II synthesis supports incremental compilation flows that map large ASIC RTL onto multiple Stratix IV GX devices with timing-accurate multi-FPGA partitioning. The FF35 35x35 mm package provides sufficient pin count for parallel interconnect between partitioned prototypes. Engineers targeting PCIe Gen2 and DDR3 interfaces benefit from hard IP cores, reducing the logic overhead versus soft implementations and improving prototype bring-up speed.
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Military and Aerospace Signal Processing
The EP4SGX360FF35C3's combination of logic density, dedicated DSP blocks, and integrated transceivers supports radar, electronic warfare, and secure communications payloads. The commercial C3 grade covers 0 C to 85 C; military programs migrate to the I3N industrial variant (-40 C to 100 C) for thermal margin. Its MIL-STD-1553, ARINC 429, and SpaceWire interfaces are typically implemented in IP cores supported by Quartus II. The 1152-FBGA package, while large, simplifies thermal dissipation in conduction-cooled VPX enclosures, and the FPGA's high logic capacity enables multi-channel beamforming and adaptive signal processing without external DSP clusters.
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Test and Measurement Equipment
High-end oscilloscopes, logic analyzers, and protocol testers leverage the EP4SGX360FF35C3's logic density for deep acquisition memory, on-chip signal processing, and multi-protocol trigger engines. The integrated transceivers deliver real-time serial bus decode for PCIe, SATA, USB 3.0, and 10GbE, while 564 user I/Os accommodate high-channel-count probe front ends. Hard memory controllers pair with external QDRII+ SRAM and DDR3 SDRAM for waveform capture buffers exceeding 2 GB. Designers choose this device over smaller Cyclone V or Arria 10 parts when channel count and DSP throughput exceed those families' capabilities, and over Stratix V for legacy Quartus II tool flow continuity.
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Broadcast Video Processing
Broadcast video routers, format converters, and 4K/8K image processing engines benefit from the EP4SGX360FF35C3's 353,600 LEs and high I/O count. The device handles SDI (SMPTE 424M, 425M) aggregation, scaling, color-space conversion, and frame-rate conversion in real time, with integrated transceivers supporting HDMI 2.0, DisplayPort 1.2, and 12G-SDI. According to Intel's Stratix IV GX handbook, the transceiver-rich architecture and dedicated DSP blocks enable 4K60 4:4:4 processing on a single chip. The FF35 1152-FBGA package supports dense front-panel connectivity, and Quartus II Video and Image Processing (VIP) suites accelerate development of video pipelines.
추천
High-Performance Computing Accelerator
The EP4SGX360FF35C3 enables custom HPC and FPGA-accelerated compute platforms where its 353,600 LEs deliver massive parallel arithmetic, integrated transceivers provide low-latency inter-FPGA and host links (PCIe Gen2, QPI), and dedicated DSP blocks accelerate IEEE 754 floating-point and fixed-point kernels. Hard memory controllers interface to DDR3 banks for streaming workloads in financial analytics, genomics, and machine learning inference. Compared to GPU accelerators, FPGAs in this density class offer deterministic latency and lower power per FLOP for streaming workloads. The FF35 1152-FBGA package suits PCIe-form-factor add-in cards and Open Compute Platform sled designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360FF35C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360FF35C2 | EP4SGX360FF35C4 | EP4SGX360FF35I3 | EP4SGX360FF35I3N | EP4SGX360FF35C2XN | EP4SGX360FF35C2X |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (FF35) 35x35 mm | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | C3 (commercial) | C2 (slower) | C4 (slower) | I3 (industrial) | I3N (industrial Pb-free) | C2X N (slower, Pb-free) | C2X (slower, Pb-free) |
| Temperature Grade | Commercial (0 C to 85 C) | Commercial | Commercial | Industrial (-40 C to 100 C) | Industrial (-40 C to 100 C) | Commercial | Commercial |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 | 564 | 564 | 564 |
주요 차별점
- Highest speed grade in FF35 package (C3 bin) (vs EP4SGX360FF35C4)
- Commercial temperature grade suits cost-sensitive designs (vs EP4SGX360FF35I3N)
- Stratix IV GX integrates multi-gigabit transceivers on-die (vs EP4SGX360HF35C3 (hypothetical E variant))
설계 노트
The Stratix IV GX EP4SGX360FF35C3 requires multi-rail power sequencing: VCC (0.9 V core), VCCPD (1.5 V to 3.0 V pre-driver), VCCPT (1.5 V phase-locked), and VCCA_PLL/VCCR_PLL for transceiver PLLs. According to Intel's Stratix IV GX power design guidelines, power-on must follow the documented sequence to prevent latch-up and high in-rush current. Use the Altera/Intel Enhanced Configuration Device (EPCQ) or a discrete sequencing controller. Estimated: at 100% logic utilization the device can draw 8-15 A from the 0.9 V rail, requiring a high-current buck regulator with at least 30 A capacity.
The 35x35 mm FC-FBGA package has a typical junction-to-ambient theta_JA in the range of 8-12 C/W with proper board thermal design. Per Intel thermal modeling, a minimum 4-layer PCB with 2 oz copper on outer layers, plus thermal vias under the exposed-die region, is required to keep the 0 C to 85 C junction envelope. For chassis designs exceeding 50 W, attach a heatsink with thermal interface material (TIM). Estimated: at full transceiver utilization, total power may approach 25-30 W, demanding forced-air or conduction cooling.
Multi-gigabit transceiver channels require controlled-impedance differential routing (100 ohm differential) with maximum length matched within 0.127 mm (5 mil) per the Stratix IV GX PCB guidelines. Use a high-performance PCB stack-up (Megtron 6, FR408HR) with low-loss dielectric. Place decoupling capacitors within 1 mm of every power pin, including 0402/0201 0.1 uF and 10 uF bulk capacitors. JTAG and configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) must be guarded against noise and routed with 50 ohm controlled impedance. All configuration modes (AS, AP, FPP, PS) require a dedicated configuration clock.
규정 준수 정보
RoHS and lead-free compliance per Intel/Altera product page; AEC-Q100 not applicable (FPGA not an automotive-qualified part per industry convention; specific automotive-grade part numbers would carry Q suffix).
