EPF8452ATC100-3N - FLEX 8000 FPGA, 4K Gates, 100-TQFP | Intel
부품 번호: EPF8452ATC100-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.4 | $244.00 |
| 100 | $19.9 | $1,990.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $13.75 | $13,750.00 |
EPF8452ATC100-3N 개요
An FPGA is a programmable logic device that combines a large array of configurable logic blocks (LABs), programmable interconnect, and configurable I/O elements on a single die. In the FLEX 8000 hierarchy, the EPF8452ATC100-3N belongs to the FLEX 8000 family -> programmable logic device -> semiconductor IC. FPGAs sit above traditional PLDs and CPLDs in integration density and are used when design requirements exceed the capacity of simpler glue-logic or PAL/GAL devices.
Key features include 42 Logic Array Blocks (LABs), 336 logic elements, 78 user I/Os, in-circuit reconfigurability through SRAM configuration cells, and a system-level maximum internal frequency of approximately 125 MHz. Configuration is performed at power-up via industry-standard parallel EPROM, Altera serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441), or a system controller, making the part suitable for prototype and production flows alike.
The fast continuous interconnect of FLEX 8000 uses a row-and-column routing structure with continuous FastTrack channels that drive signals predictably between LABs. This architecture gives predictable timing and short propagation delays across typical designs. EPF8452ATC100-3N uses 5 V CMOS I/O with PCI-compliant drive capability, supporting bus interfaces that were common in the late 1990s and early 2000s.
Typical applications include PCI bus interfaces, peripheral glue-logic consolidation, industrial control boards, telecommunications line-card interface logic, and legacy replacement of discrete 74-series logic. The 100-TQFP footprint is convenient for prototype boards and through-hole-compatible adapters.
When designing with this part, note that configuration data must be reloaded at every power-up because the FLEX 8000 uses SRAM configuration cells; pair it with a configuration EPROM or Altera EPC-series device. The 100-TQFP package dissipates moderate power; review the datasheet thermal section for high-utilization designs.
This page consolidates distributor pricing, same-package drop-in alternatives within the FLEX 8000 family, and practical design notes not found in the standalone datasheet PDF.
드롭인 대체품: EPF8452ATC100-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8452ATC100-3N (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Method, Package, Usable Gates, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8452ATC100-3
✅ 드롭인✓ 재고 있음
$5.95 / 개
데이터시트 보기 →EPF8452ATC100-4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.1 / 개
데이터시트 보기 →EPF8282ATC100-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.25 / 개
데이터시트 보기 →EPF6016ATC100-3N
✅ 드롭인✓ 재고 있음
$10.4 / 개
데이터시트 보기 →EPF8452ATC100-3N 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Logic Elements / Cells | 336 |
| Number of LABs/CLBs | 42 |
| Usable Gates | approximately 4,000 |
| User I/Os | 78 |
| 공급 전압 | 5 V (4.75 V to 5.25 V) |
| Process Technology | 0.42 µm CMOS SRAM |
| 동작 온도 | 0 °C to 70 °C (commercial) |
| Maximum Internal Frequency | 125 MHz |
| 패키지 | 100-pin TQFP |
| 실장 유형 | Surface Mount |
| Configuration Method | SRAM, in-circuit reconfigurable (EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM) |
| I/O Standard | 5 V CMOS, PCI-compliant drive |
| Logic Family | CMOS |
EPF8452ATC100-3N 핀 구성
| 핀 1 | I/O — User I/O (bank-dependent function per datasheet) |
| 핀 10 | I/O — User I/O |
| 핀 11 | I/O — User I/O |
| 핀 12 | I/O — User I/O |
| 핀 13 | I/O — User I/O |
| 핀 14 | I/O — User I/O |
| 핀 15 | GND — Ground |
| 핀 16 | I/O — User I/O |
| 핀 17 | I/O — User I/O |
| 핀 18 | I/O — User I/O |
| 핀 19 | I/O — User I/O |
| 핀 2 | I/O — User I/O |
| 핀 20 | I/O — User I/O |
| 핀 21 | VCC — 5 V supply |
| 핀 22 | I/O — User I/O |
| 핀 23 | I/O — User I/O |
| 핀 24 | I/O — User I/O |
| 핀 25 | I/O — User I/O |
| 핀 26 | I/O — User I/O |
| 핀 27 | I/O — User I/O |
| 핀 28 | GND — Ground |
| 핀 29 | I/O — User I/O |
| 핀 3 | I/O — User I/O |
| 핀 30 | I/O — User I/O |
| 핀 31 | I/O — User I/O |
| 핀 32 | I/O — User I/O |
| 핀 33 | I/O — User I/O |
| 핀 34 | VCC — 5 V supply |
| 핀 35 | I/O — User I/O |
| 핀 36 | I/O — User I/O |
| 핀 37 | I/O — User I/O |
| 핀 38 | I/O — User I/O |
| 핀 39 | I/O — User I/O |
| 핀 4 | I/O — User I/O |
| 핀 40 | GND — Ground |
| 핀 41 | nCONFIG — Configuration control (active-low) |
| 핀 42 | nSTATUS — Configuration status (active-low) |
| 핀 43 | CONF_DONE — Configuration done indicator |
| 핀 44 | DCLK — Configuration clock input |
| 핀 45 | DATA0 — Configuration data input |
| 핀 46 | MSEL1 — Configuration mode select 1 |
| 핀 47 | MSEL0 — Configuration mode select 0 |
| 핀 48 | I/O — User I/O |
| 핀 49 | I/O — User I/O |
| 핀 5 | I/O — User I/O |
| 핀 50 | VCC — 5 V supply |
| 핀 51 | I/O — User I/O |
| 핀 52 | I/O — User I/O |
| 핀 53 | I/O — User I/O |
| 핀 54 | I/O — User I/O |
| 핀 55 | I/O — User I/O |
| 핀 56 | I/O — User I/O |
| 핀 57 | GND — Ground |
| 핀 58 | I/O — User I/O |
| 핀 59 | I/O — User I/O |
| 핀 6 | I/O — User I/O |
| 핀 60 | I/O — User I/O |
| 핀 61 | I/O — User I/O |
| 핀 62 | I/O — User I/O |
| 핀 63 | I/O — User I/O |
| 핀 64 | I/O — User I/O |
| 핀 65 | VCC — 5 V supply |
| 핀 66 | I/O — User I/O |
| 핀 67 | I/O — User I/O |
| 핀 68 | I/O — User I/O |
| 핀 69 | I/O — User I/O |
| 핀 7 | I/O — User I/O |
| 핀 70 | GND — Ground |
| 핀 71 | I/O — User I/O |
| 핀 72 | I/O — User I/O |
| 핀 73 | I/O — User I/O |
| 핀 74 | I/O — User I/O |
| 핀 75 | I/O — User I/O |
| 핀 76 | I/O — User I/O |
| 핀 77 | I/O — User I/O |
| 핀 78 | VCC — 5 V supply |
| 핀 79 | TDI — JTAG test data input |
| 핀 8 | I/O — User I/O |
| 핀 80 | TMS — JTAG test mode select |
| 핀 81 | TCK — JTAG test clock |
| 핀 82 | TDO — JTAG test data output |
| 핀 83 | I/O — User I/O |
| 핀 84 | I/O — User I/O |
| 핀 85 | I/O — User I/O |
| 핀 86 | GND — Ground |
| 핀 87 | I/O — User I/O |
| 핀 88 | I/O — User I/O |
| 핀 89 | I/O — User I/O |
| 핀 9 | I/O — User I/O |
| 핀 90 | I/O — User I/O |
| 핀 91 | I/O — User I/O |
| 핀 92 | VCC — 5 V supply |
| 핀 93 | I/O — User I/O |
| 핀 94 | I/O — User I/O |
| 핀 95 | I/O — User I/O |
| 핀 96 | I/O — User I/O |
| 핀 97 | I/O — User I/O |
| 핀 98 | GND — Ground |
| 핀 99 | I/O — User I/O |
| 핀 100 | I/O — User I/O |
일반적인 애플리케이션
EPF8452ATC100-3N 적합 용도: 6 애플리케이션s: PCI Bus Interface Bridge, Industrial Control Glue Logic Consolidation, Telecommunications Line-Card Interface Logic, Legacy 74-Series Logic Replacement, Prototyping Platform for Custom State Machines, Test and Measurement Front-End Logic.
PCI Bus Interface Bridge
The EPF8452ATC100-3N's 5 V PCI-compliant I/O drive strength and 78 user I/Os make it well suited for legacy PCI bus interface bridging between a host controller and peripheral glue logic. With 4,000 usable gates and 42 LABs, it can implement target-state machines, address decoding, interrupt steering, and byte-enable logic in a single 100-TQFP device. The 125 MHz internal frequency comfortably supports 33 MHz PCI timing budgets. Designers place the FPGA between the PCI connector and an application-specific ASIC or microcontroller, using Quartus II for synthesis and timing closure. Its 5 V CMOS I/O eliminates the need for level shifters on the PCI bus side, simplifying PCB routing. Configuration via an EPC1 or EPC1441 serial PROM allows autonomous power-up without host intervention.
추천
Industrial Control Glue Logic Consolidation
In industrial control boards, the EPF8452ATC100-3N replaces dozens of 74-series discrete logic ICs by integrating address decoding, bus arbitration, watchdog timers, and I/O expansion into a single 100-TQFP device. The 78 user I/Os support direct connection to many sensors, optocouplers, and relay drivers, reducing board area and BOM cost. Industrial systems benefit from the part's 0 °C to 70 °C commercial temperature range when housed in controlled enclosures. The in-circuit reconfigurability of FLEX 8000 allows field firmware updates via JTAG, useful for late-stage protocol changes without board rework. Engineers should add a small EEPROM-style configuration device and ensure clean 5 V supply decoupling for reliable operation in electrically noisy industrial environments.
추천
Telecommunications Line-Card Interface Logic
Telecommunications line cards historically rely on FLEX 8000 devices such as the EPF8452ATC100-3N to implement TDM bus formatting, framer/mapper glue, clock-domain crossing, and hardware-protocol adaptation between line-interface units and switch-fabric ASICs. With 4,000 usable gates, the device comfortably fits state machines for HDB3/AMI encoding, slip-buffer control, and alarm-collection registers. Its 5 V tolerant CMOS I/O connects directly to legacy telecom backplanes without external level shifters. The 100-TQFP footprint supports standard SMT assembly lines, while the 78 I/Os are sufficient to drive multi-protocol serial buses. Designers should validate timing closure with Quartus II and use a configuration EPROM sized for the compiled bitstream.
추천
Legacy 74-Series Logic Replacement
The EPF8452ATC100-3N is a strong candidate when modernizing legacy boards that contain many discrete 74LS/74HC/74F TTL packages. The 4,000 usable gates and 78 user I/Os can absorb the equivalent of 20-40 small-scale and medium-scale ICs in a single chip, dramatically reducing PCB complexity and assembly cost. Designers capture the original schematic logic into Quartus II using either VHDL, Verilog, or schematic-entry netlists, then target the FLEX 8000 device directly. The 100-TQFP pinout fits standard 1.6 mm board stack-ups, and the 5 V I/O is drop-in compatible with the TTL rails it replaces. In-circuit reconfigurability allows incremental logic fixes without board spin.
추천
Prototyping Platform for Custom State Machines
Engineering teams use the EPF8452ATC100-3N as a fast-prototyping platform for custom state machines, FIFO controllers, and protocol converters in the 100-TQFP form factor. The 125 MHz internal frequency and Quartus II synthesis flow enable iterative design cycles measured in hours rather than weeks. The 78 user I/Os are accessible on standard 0.5 mm-pitch TQFP land patterns, simplifying breakout-board integration. Because FLEX 8000 supports SRAM-based in-circuit reconfigurability, a single board can host multiple design revisions simply by reprogramming the configuration EPROM. This makes it ideal for FPGA-meets-ASIC proof-of-concept work where designers need a quick hardware target before committing to a masked gate array.
추천
Test and Measurement Front-End Logic
Test and measurement instruments often use FLEX 8000 devices such as the EPF8452ATC100-3N for front-end channel switching, trigger logic, timing generators, and counter pre-scalers. The 4,000 usable gates are sufficient for 8-to-16 channel mux trees, while 78 I/Os interface directly to ADC/DAC and comparator front-ends. The 5 V supply rails simplify integration with op-amps and analog multiplexers that still run on ±5 V or single 5 V rails. PCI-compliant drive strength also supports insertion into PXI/cPCI measurement chassis via a bridge interface. Configuration is straightforward with an EPC1 or EPC1064, and the 100-TQFP package handles reflow assembly on standard 1.6 mm FR-4 boards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF8452ATC100-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8452ATC100-3 | EPF8452ATC100-4N | EPF8282ATC100-3 | EPF6016ATC100-3N |
|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 |
| Usable Gates | ~4,000 | ~4,000 | ~4,000 | ~2,500 | ~16,000 |
| Logic Cells | 336 | 336 | 336 | 208 | 1,320 |
| User I/Os | 78 | 78 | 78 | ~68 | 81 |
| Speed Grade | -3 | -3 | -4 (slower) | -3 | -3 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
주요 차별점
- Higher logic density within the same 100-TQFP footprint (vs EPF8282ATC100-3)
- Same-package FLEX 8000 family drop-in compatibility (vs EPF8452ATC100-4N)
- Mature, well-documented 5 V PCI-capable I/O (vs EPF6016ATC100-3N)
설계 노트
EPF8452ATC100-3N requires a clean 5 V ±5% supply. Place a 0.1 µF ceramic decoupling capacitor adjacent to every VCC pin and a 10 µF bulk tantalum or ceramic at the package entry. Because the device draws surge current during configuration, ensure the upstream regulator can supply at least 200 mA peak. Decoupling the JTAG and configuration pins separately prevents configuration failures caused by supply bounce.
Use a 4-layer PCB with a continuous ground plane beneath the 100-TQFP footprint. Keep configuration traces (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) under 50 mm and away from switching signals. Route user I/O differential pairs with matched lengths if used for clock distribution. Provide a 100 Ω differential termination on TCK if JTAG cable length exceeds 150 mm to avoid signal-integrity issues.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (passive serial vs. parallel) and an undefined state can prevent the device from configuring. Tie CONF_DONE high through a 10 kΩ resistor to VCC for proper power-on behavior. Remember that FLEX 8000 configuration is volatile: the device loses its logic on every power-down, so a configuration EPROM (EPC1/EPC1064/EPC1213/EPC1441) is mandatory for autonomous operation.
규정 준수 정보
RoHS/REACH/halogen-free status not specified in verified web data. EPF8452ATC100-3N is a legacy 5 V FPGA in a commercial temperature grade; the lead-free variant is the EPF8452ATC100-3 suffix. AEC-Q100 not applicable as this is a commercial-grade programmable logic device.