EPF8820ABC225-3 - FLEX 8000 FPGA 672 LEs 8K Gates BGA-225 | Altera
부품 번호: EPF8820ABC225-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38 | $380.00 |
| 100 | $30 | $3,000.00 |
| 500 | $24 | $12,000.00 |
| 1,000 | $20 | $20,000.00 |
EPF8820ABC225-3 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. Unlike an application-specific integrated circuit (ASIC), an FPGA can be reconfigured after manufacturing, allowing engineers to implement custom digital logic without incurring NRE mask costs. The FLEX 8000 family sits in the taxonomy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> fine-grained register-rich architecture, optimized for high register count and wide datapath designs.
Key features of the EPF8820ABC225-3 include a maximum internal clock frequency of approximately 125 MHz (per published family datasheet), 3.3V or 5V configurable I/O support, JTAG-based boundary-scan testing, and a 4-input look-up table (LUT) based logic element architecture. The 225-ball BGA package provides high I/O density for memory bus, address bus, and datapath designs that demand high pin count.
Typical applications include telecommunications line cards, industrial control and glue logic, legacy data acquisition backplanes, prototyping of ASIC designs, and bus interface bridges. The EPF8820ABC225-3 was widely adopted in the late 1990s for high-density register-rich designs including FIFO controllers, peripheral bridges, and protocol converters.
When designing with this device, ensure proper decoupling on every VCC pin and use the dedicated JTAG chain for in-system programming. Note that the FLEX 8000 family has been NRND for many years and is now considered obsolete; modern alternatives like Cyclone IV/V offer substantially higher logic density at lower power.
드롭인 대체품: EPF8820ABC225-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8820ABC225-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Usable Gates, Configuration Method, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8820AQC208-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$18.95 / 개
데이터시트 보기 →EPF8820AQC160-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPF8636AQC208-3
✅ 드롭인✓ 재고 있음
$28 / 개
데이터시트 보기 →EPF8636ARC208-3
✅ 드롭인✓ 재고 있음
$19.95 / 개
데이터시트 보기 →EPF8452AQC160-3
✅ 드롭인✓ 재고 있음
$13.85 / 개
데이터시트 보기 →EPF8820ABC225-3 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Logic Elements | 672 |
| Usable Gates | 8,000 (up to 16,000 maximum) |
| Registers | 1,500 |
| Maximum Internal Frequency | 125 MHz |
| 최대 클록 주파수 | 385 MHz (per Microchip USA listing) |
| Process Technology | 0.42 micron CMOS |
| 공급 전압 | 5 V (core); 3.3 V or 5 V I/O |
| Speed Grade | -3 |
| 패키지 | 225-Ball BGA |
| 실장 유형 | Surface Mount |
| Configuration Method | In-Circuit Reconfigurability (ICR) via external devices or intelligent controllers |
| Boundary Scan | JTAG IEEE 1149.1 compliant |
EPF8820ABC225-3 225-ball bga 핀 구성 가이드
EPF8820ABC225-3(225-ball bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF8820ABC225-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF8820ABC225-3 적합 용도: 6 애플리케이션s: Legacy Telecommunications Line Cards, Industrial Control and Glue Logic, ASIC Prototyping and Emulation, Data Acquisition Backplanes, FIFO Controllers and Memory Bridges, Protocol Converter and Bus Bridge.
Legacy Telecommunications Line Cards
The EPF8820ABC225-3 fits legacy telecom line card designs where the high register count (1,500 flip-flops) and 672 logic elements handle wide datapath operations like TDM bus multiplexing and framing. With 125 MHz internal frequency and 5V tolerant I/O, it bridges 5V TTL peripherals to lower-voltage backplanes. The 225-BGA footprint supports the high pin count required for parallel bus interfaces and protocol glue logic in central-office equipment. Power consumption at 5V is approximately 1-2W typical, acceptable for telecom chassis with forced-air cooling.
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Industrial Control and Glue Logic
The EPF8820ABC225-3 excels as glue logic in industrial control systems where it interfaces disparate bus standards (ISA, VME, PC/104) and implements custom state machines for motor control loops. Its in-circuit reconfigurability enables field firmware updates via JTAG without board removal, critical for installed industrial equipment. The 5V core supply is compatible with legacy industrial sensors and actuators, eliminating level-shifters. With 8K usable gates, a single EPF8820ABC225-3 can replace dozens of 74-series TTL chips, simplifying BOM and PCB layout.
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ASIC Prototyping and Emulation
The EPF8820ABC225-3 was widely used as an ASIC prototype and emulator in the late 1990s, where designers mapped gate-level netlists onto the 672 logic elements before committing to silicon. With 8K usable gates and 1,500 registers, it can emulate medium-complexity ASICs including peripheral controllers, custom microsequencers, and DSP datapaths. The in-circuit reconfigurability enables rapid design iteration cycles. Engineers targeting FLEX 8000 for prototyping today should consider Cyclone IV or Cyclone 10 LP for new emulations due to better tool support and 100x higher logic density per dollar.
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Data Acquisition Backplanes
The EPF8820ABC225-3 serves as a timing controller and bus arbiter in legacy data acquisition backplanes where it generates sample clocks, controls multiplexer switching, and buffers high-speed ADC/DAC data. Its 125 MHz internal frequency and configurable 3.3V/5V I/O support direct interface to parallel ADC/DAC converters without external glue logic. The 225-BGA package provides ample I/O for 16-32 channel simultaneous sampling systems. Combined with on-chip JTAG, the device enables production test via boundary scan for backplane testability.
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FIFO Controllers and Memory Bridges
The EPF8820ABC225-3 implements high-performance FIFO controllers and memory bridge logic between disparate bus widths and clock domains. The 1,500 registers provide ample storage for deep FIFO implementations (typically 256-1024 words deep), while 672 logic elements handle pointer arithmetic and flag generation. With dual-port RAM inference capability, the device can implement true dual-clock FIFOs without external SRAM. The 5V tolerant I/O directly interfaces SRAM and DRAM memories common in 1990s-era designs.
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Protocol Converter and Bus Bridge
The EPF8820ABC225-3 was the de-facto choice for protocol converter and bus bridge designs in the 1990s, where it implemented bridges between PCI, VME, ISA, and proprietary backplanes. With 8K usable gates and 5V I/O tolerance, the device handles bus arbitration, address decoding, and data path switching in a single chip. Engineers designing modern protocol bridges should target Cyclone IV or Cyclone 10 LP with their integrated transceivers and hard IP for PCI Express, but the EPF8820ABC225-3 remains relevant for legacy bus bridging in industrial and military systems.
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추천 제품 요약
엔지니어링 참조 데이터: EPF8820ABC225-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8820AQC208-3 | EPF8820AQC160-3 | EPF8636AQC208-3 | EPF8636ARC208-3 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | BGA-225 | PQFP-208 | PQFP-160 | PQFP-208 | PQFP-208 | PQFP-160 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Logic Elements | 672 | 672 | 672 | 144 | 144 | 336 |
| Usable Gates | 8,000 | 8,000 | 8,000 | 2,000 | 2,000 | 4,000 |
| Speed Grade | -3 | -3 | -3 | -3 | -3 | -3 |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Higher logic density than lower-tier FLEX 8000 variants (vs EPF8636AQC208-3)
- BGA-225 package offers highest I/O count in FLEX 8000 family (vs EPF8820AQC208-3)
- More than twice the registers of mid-density FLEX 8000 (vs EPF8452AQC160-3)
설계 노트
Estimated: The EPF8820ABC225-3 at 5V core and typical 50% toggle rate dissipates approximately 1.5W. The 225-BGA package theta_JA is approximately 15 C/W with a standard 4-layer JEDEC test board, giving a junction-to-ambient rise of 22C. Forced-air cooling (200 LFM) reduces theta_JA to ~8 C/W. For enclosed industrial chassis without airflow, derate by 30% and ensure ambient stays below 70C. The thermal pad of the 225-BGA must be soldered to the PCB thermal land for proper heat spreading.
Decouple every VCC pin with a 0.1uF ceramic capacitor placed within 3mm of the ball, plus a single 10uF tantalum bulk capacitor near the package. The 225-BGA requires a 1.27mm pitch land pattern with non-solder-mask-defined (NSMD) pads for reliable assembly per IPC-7351. For JTAG programming, route TMS, TDI, TDO, TCK as a 4-wire chain with 10K pull-ups on TMS and TDI to VCC. Add a 4.7K series resistor on TCK near the FPGA to dampen reflections.
Critical: The EPF8820ABC225-3 uses 5V core supply - connecting 3.3V peripherals directly to its I/O without level shifters is fine (input is 5V tolerant), but DO NOT apply 5V output to a 3.3V-only device. Configuration memory is volatile SRAM - the device must be configured on every power-up via the EPC configuration ROM or JTAG. For in-circuit reconfigurability, connect MSEL pins correctly for the chosen configuration mode (AS, AP, PS, JTAG). Leave nCONFIG, nSTATUS, and CONF_DONE unbypassed.
Route all clock signals on inner layers with continuous ground reference and length-match within 100 mils across the bus. Use 50 ohm characteristic impedance for high-speed clocks exceeding 50 MHz. The 225-BGA fanout should escape on at least 4 routing layers to break out the inner balls - signal layers should alternate with ground planes to maintain controlled impedance. Place the EPC configuration EPROM within 50mm of the FPGA for reliable PS configuration mode.
규정 준수 정보
EPF8820ABC225-3 is a legacy mid-1990s Altera FLEX 8000 part. RoHS/REACH compliance status not stated in Verified Web Data; pre-RoHS-era parts typically use SnPb solder. AEC-Q100 not applicable (FPGA logic device, not automotive-qualified). Customers requiring RoHS compliance should request RoHS-convertible variants from secondary distributors.
