H5CG44MEBDX014 - 16Gb DDR5-4800 x4 SDRAM | SK hynix
부품 번호: H5CG44MEBDX014 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.64 | $1,820.00 |
| 1,000 | $3.12 | $3,120.00 |
H5CG44MEBDX014 개요
DDR5 SDRAM (Double Data Rate 5 synchronous dynamic random-access memory) is the fifth-generation JEDEC DDR memory standard and the successor to DDR4 in the volatile memory hierarchy: SDRAM -> DDR SDRAM -> DDR5 SDRAM -> main-memory class DRAM. DDR5 doubles the bank-group count per device versus DDR4, moves power management onto the DIMM (PMIC), and lowers per-bit operating voltage to 1.1V, enabling higher densities and better bandwidth-per-watt for servers, workstations, and high-performance client platforms.
Key features of this device include the 4Gx4 (x4) organization, which is preferred in error-protected server configurations where chip-kill and ECC schemes benefit from narrow-wide bus architectures; the DDR5-4800 data rate, corresponding to a 2400 MHz clock and 38.4 GB/s of peak bandwidth per 64-bit channel; and the industry-standard 78-ball FBGA footprint that provides mechanical compatibility across the DDR5 component ecosystem.
Architecturally, DDR5 components integrate an on-die ECC engine (link ECC), same-bank refresh improvements, and a decision-feedback equalization (DFE) capable DQ receiver path that sustains signal integrity at 4800 MT/s. Bank-group architecture increases effective parallelism, while the reduced VDD of 1.1 V lowers dynamic power relative to DDR4 at comparable data rates.
Typical applications include server DIMMs (RDIMM/LRDIMM), embedded computing and storage controllers, industrial compute modules, networking equipment line cards, and replacement sourcing for DDR5-based BOMs.
A key design consideration is that DDR5 SDRAM requires a 1.1 V supply rail with tight tolerance and typically relies on a companion register/PMIC ecosystem on registered modules; signal-integrity closure at 4800 MT/s requires controlled-impedance routing, fly-by command/address topology, and reference-design-validated termination.
This page synthesizes distributor availability data, drop-in family alternatives, and practical design notes not found in the raw manufacturer datasheet listings.
드롭인 대체품: H5CG44MEBDX014 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5CG44MEBDX014 (동일 폼 팩터 및 풋프린트) — 차이점: Organization, Data Rate, Interface Type, Package, Density.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5CG44MEBDX014N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →H5CG46MEBDX015N
✅ 드롭인✓ 재고 있음
$3.65 / 개
데이터시트 보기 →H5CG46MEBDX017N
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →H5CG48MEBDX014N
✅ 드롭인✓ 재고 있음
$41.68 / 개
데이터시트 보기 →H5CG48MEBDX018N
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →H5CG44MEBDX014 사양
| 메모리 유형 | DDR5 SDRAM |
| 메모리 크기 | 16 Gb |
| 메모리 구성 | 4G x 4 |
| 데이터 속도 | 4800 MT/s (DDR5-4800) |
| Clock Frequency | 2400 MHz |
| Supply Voltage (VDD) | 1.1 V |
| 패키지 | 78-ball FBGA |
| 실장 유형 | Surface Mount |
| Process Node / Die | 1st-generation M-die (1z-class) |
| 인터페이스 유형 | Parallel, DDR5 |
| Memory Configuration | DRAM component (not module) |
| On-Die ECC | Yes (DDR5 standard feature) |
| Applications | Server, client, embedded, industrial computing |
H5CG44MEBDX014 78-ball fbga 핀 구성 가이드
H5CG44MEBDX014(78-ball fbga 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: H5CG44MEBDX014.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5CG44MEBDX014 적합 용도: 6 애플리케이션s: Server Main Memory (RDIMM/LRDIMM), Embedded Computing Modules, Storage Controllers and SSDs, Networking Line Cards, Replacement / BOM Sourcing, High-Performance Client / Workstation Memory.
Server Main Memory (RDIMM/LRDIMM)
The H5CG44MEBDX014's 16Gb 4Gx4 organization is the canonical building block for server registered DIMMs, where chip-kill class ECC protection depends on narrow x4 devices so a multi-bit failure inside one chip remains correctable. At DDR5-4800, eight devices populate one 64-bit sub-channel per JEDEC DDR5 RDIMM topology, delivering 38.4 GB/s peak bandwidth per channel at a 1.1 V core supply. On the module, the component pairs with a register clock driver, SPD hub, and PMIC. Its first-generation M-die maturity means silicon has wide production history, easing vendor qualification for data-center BOMs where supply continuity and long-tail sourcing matter more than leading-edge speed bins.
추천
Embedded Computing Modules
Embedded COM Express and SMARC compute modules frequently solder down DDR5 components directly on the carrier board, and the 78-ball FBGA footprint of H5CG44MEBDX014 supports that attach style without sockets. The x4 organization doubles the ECC granularity available to on-SoC memory controllers, valuable in industrial controllers that must run for years without uncorrectable memory errors. At DDR5-4800 the device supports the bandwidth headroom that modern SoCs (for example Intel Altera FPGA SoC platforms pairing with DDR5 controllers) expect, while 1.1 V operation reduces rail power versus DDR4 solutions at similar throughput, easing thermal design in fanless enclosures. Soldered-down memory also removes connector reliability concerns in vibration-prone environments such as transportation and factory automation.
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Storage Controllers and SSDs
Enterprise SSD controllers use DDR5-class DRAM as metadata and FTL (flash translation layer) working memory, and H5CG44MEBDX014 fits this role with 16 Gb per device and DDR5-4800 bandwidth that keeps mapping-table lookups off the NAND bottleneck. The x4 organization lets controller vendors scale bus width in 4-bit increments, precisely matching controller PHY port counts, and on-die ECC adds a layer of protection for cached metadata. Operation at 1.1 V keeps DRAM power a small fraction of total SSD draw, important for power-capped data-center storage. Because SSD platforms run memory at fixed conservative clocks, the 014 speed bin is typically sufficient, and the M-die's production maturity supports the multi-year lifecycles storage OEMs require.
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Networking Line Cards
Switch, router, and firewall line cards buffer packets in deep DRAM queues, and H5CG44MEBDX014's DDR5-4800 data rate provides the random-access bandwidth that queue management and deep-packet-inspection engines demand. Narrow x4 devices allow flexible width assembly against network-processor or FPGA memory controllers, and the 78-ball FBGA package supports the dense, soldered-down memory arrays typical of telecom hardware. The 1.1 V rail aligns with the low-voltage power trees of modern NEBS-compliant cards, and first-generation M-die availability across independent distributors simplifies spares provisioning for carrier networks with decade-long service commitments. Thermal design should account for sustained back-to-back refresh plus traffic patterns in 1U airflow-limited cards.
추천
Replacement / BOM Sourcing
GlobalSpec and distributor listings position H5CG44MEBDX014 explicitly as a replacement-sourcing component: when an original DDR5 16Gb x4 line item is on allocation or EOL, this M-die part offers a functionally equivalent drop onto the same 78-ball FBGA land pattern within the SK hynix family. Independent distributors such as Pacific Component Xchange and Win Source stock or broker the part for RFQ, making it a practical second source for contract manufacturers maintaining legacy DDR5 builds. When qualifying the substitution, verify the ball map and speed-grade registers against the official datasheet, update SPD or controller configuration if the speed bin differs, and confirm compliance certificates (RoHS/REACH) for regulated shipments. Family parts H5CG46/H5CG48 cover density-width variations of the same platform.
추천
High-Performance Client / Workstation Memory
Desktop workstations and mini-PCs with soldered-down DDR5 use 16Gb components such as H5CG44MEBDX014 to reach 8-32 GB capacities with a minimal device count. The x4 organization, while server-oriented, is also used in client LPDDR-adjacent designs where controllers expose x4 PHY ports; at DDR5-4800 it sustains the 38.4 GB/s class bandwidth that integrated GPUs need for shared-memory graphics. The 1.1 V supply suits battery-powered and passively cooled client platforms, and the 78-ball FBGA's roughly square body fits tightly spaced clusters around the SoC. Board designers should follow fly-by CA routing and keep DQ length skew within reference-design tolerances; first-generation M-die cost positioning also benefits price-sensitive client BOMs versus newer die generations.
추천
추천 제품 요약
엔지니어링 참조 데이터: H5CG44MEBDX014 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5CG44MEBDX014N | H5CG46MEBDX015N | H5CG46MEBDX017N | H5CG48MEBDX014N | H5CG48MEBDX018N |
|---|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | 4G x 4 | 4G x 4 | 4G x 4 | 4G x 4 | 2G x 8 | 2G x 8 |
| Data Rate Class | DDR5-4800 | DDR5-4800 | Higher speed bin (suffix 015) | Higher speed bin (suffix 017) | DDR5-4800 | Higher speed bin (suffix 018) |
| Die Generation | 1st-gen M-die | 1st-gen M-die | M-die | M-die | M-die | M-die |
| Core Supply (VDD) | 1.1 V (DDR5 standard) | 1.1 V (DDR5 standard) | 1.1 V (DDR5 standard) | 1.1 V (DDR5 standard) | 1.1 V (DDR5 standard) | 1.1 V (DDR5 standard) |
| Best-Fit Use Case | Server ECC main memory / replacement sourcing | Identical - authorized channel variant | Higher-bandwidth server platforms | High-speed server/client platforms | Cost-optimized client 64-bit buses | Higher-speed client x8 platforms |
주요 차별점
- Chip-kill-ready x4 organization (vs H5CG48MEBDX014N)
- Mature first-generation M-die sourcing (vs H5CG46AGBDX015 (A-die family))
- Cost-optimized speed bin (vs H5CG46MEBDX017N)
설계 노트
At DDR5-4800 (2400 MHz clock), DQ eye margins depend heavily on layout. Route each byte lane with matched lengths, maintain a continuous reference plane under DQS/DQ pairs, and avoid stub topologies entirely. Use fly-by routing for command/address/clock to control skew across devices, and set ODT values per the SK hynix datasheet drive/ODT tables. Validate with eye diagrams at both temperature extremes; the device's DFE receivers recover marginal eyes but should not substitute for sound layout. Estimated: a typical server DIMM reference design allocates within +/-25 mil intra-byte-lane skew at this speed.
DDR5 components operate from a nominal 1.1 V core supply; provide tight-tolerance rails with local bulk and high-frequency ceramic decoupling at the FBGA balls. Estimated: at roughly 300-500 mA peak per device under burst traffic (typical class behavior, confirm in datasheet IDD tables), a 16-device RDIMM can transient-load the 1.1 V rail by several amperes, so place bulk capacitance near the PMIC and per-device 0.1 uF ceramics at each VDD ball pair. Follow the SK hynix datasheet IDD/IDDQ tables and module PMIC reference designs for exact budgeting.
Do not substitute x4 and x8 organizations blindly: H5CG44 (x4) and H5CG48 (x8) share the 78-ball FBGA footprint but differ in DQ ball assignments and address maps, so a swap changes controller configuration and possibly the land-pattern net mapping. Speed-grade suffixes (014/015/017/018) also matter - replacing a faster bin with the 014 part requires verifying the controller runs at 4800 MT/s or below and updating SPD or training registers. Always re-run memory training after any component change.
규정 준수 정보
Compliance data not stated in sourced data. As modern DDR5 SDRAM, RoHS-compliant versions are industry-standard, but official material declarations must be obtained from SK hynix or distributor certificates before regulatory filings.