IRF7779L2TRPBF - 150V 67A HEXFET N-Channel MOSFET | Infineon
부품 번호: IRF7779L2TRPBF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.52 | $4.52 |
| 10 | $4.07 | $40.70 |
| 100 | $3.62 | $362.00 |
| 500 | $3.26 | $1,630.00 |
| 1,000 | $2.9 | $2,900.00 |
IRF7779L2TRPBF 개요
A power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is a voltage-controlled three-terminal switch used for power conversion and switching. Within the device taxonomy, the IRF7779L2 sits in the N-channel enhancement-mode MOSFET family, which is the dominant topology for low-side and synchronous-rectifier switching in modern SMPS designs because N-channel carriers offer ~2-3x lower RDS(on) per unit silicon area than equivalent P-channel parts.
Key features include a 150 V drain-to-source breakdown voltage, 67 A continuous drain current (Tc) and 11 nC total gate charge. Power dissipation is rated 3.3 W at TA=25C and 125 W at Tc=25C, supporting both thermally-limited PCB designs and large-conduction heatsink-based layouts. The DirectFET L8 case is dual-side cooled via metal can construction, removing the need for an external thermal pad and reducing package parasitic inductance versus D2PAK/TO-220.
The device uses Infineon's fifth-generation HEXFET trench process, achieving low figure-of-merit (FOM = RDS(on) x Qg) for high-frequency isolated-converter primary-side switching. Optimized for hard-switched topologies up to several hundred kHz, it is also suited for OR-ing and hot-swap roles where low conduction loss matters more than switching speed.
Typical applications include isolated DC-DC converter primary switches in telecom bricks, server and datacom 48 V intermediate bus converters, motor-drive H-bridges (low-side position), hot-swap / eFuse circuits, and battery protection FETs in 96-100 V lithium packs. The 150 V rating gives comfortable margin below the 100 V telecom bus.
When designing with this part, follow DirectFET land-pattern guidelines exactly - the metal can doubles as the drain terminal and requires precise stencil apertures for the side-cooling vias. VGS(th) is in the 2-4 V range, so a 10 V gate drive is mandatory for full RDS(on) and lowest conduction loss.
This page consolidates distributor pricing, same-footprint DirectFET alternatives, and DirectFET-specific design notes not found on stock catalog pages.
드롭인 대체품: IRF7779L2TRPBF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: IRF7779L2TRPBF (동일 폼 팩터 및 풋프린트) — 차이점: RDS(on) max at VGS=10V.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
IRF7779L2TR1PBF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
IRF7749L2TRPBF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AUIRF7759L2TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
IRF7799L2TRPBF
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
IRF7779L2TRPBF
✅ 드롭인✓ 재고 있음
$2.9 / 개
데이터시트 보기 →IRF7779L2TRPBF 최대 정격 & 전기적 특성
| Drain-to-Source Voltage (VDS) | 150 V |
| Continuous Drain Current (ID) at Tc=25C | 67 A |
| RDS(on) max at VGS=10V | 11 mOhm |
| RDS(on) typical at VGS=10V | 7.7 mOhm |
| Gate-to-Source Voltage (VGS) max | 20 V |
| Total Gate Charge (Qg) | 11 nC |
| Power Dissipation (PD) at Tc=25C | 125 W |
| Power Dissipation (PD) at TA=25C | 3.3 W |
| 동작 접합 온도 | -55C to +175C |
| Technology | HEXFET (IR MOSFET) |
| 패키지 | DirectFET Isometric L8 |
| Profile Height | 0.7 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
IRF7779L2TRPBF 핀 구성
| 핀 1 | Source — Source terminal (top metal can side via castellations) |
| 핀 2 | Source — Source terminal |
| 핀 3 | Gate — Gate drive input |
| 핀 4 | Source — Source terminal |
| 핀 5 | Source — Source terminal |
| 핀 6 | Source — Source terminal |
| 핀 7 | Drain — Drain terminal (bottom metal can) |
| 핀 8 | Drain — Drain terminal (top metal can) |
안전 동작 영역 (DC)
일반적인 애플리케이션
IRF7779L2TRPBF 적합 용도: 6 애플리케이션s: 48V Telecom Isolated DC-DC Primary Switch, Server & Datacom 48V Intermediate Bus Converter, Hot-Swap and eFuse Power Path Control, Industrial Brushless DC Motor Drive, Lithium Battery Pack Discharge and Protection FET, Solar Inverter DC-Boost Stage.
48V Telecom Isolated DC-DC Primary Switch
The IRF7779L2TRPBF serves as the primary-side MOSFET in 48 V telecom brick converters and intermediate bus architectures. Its 150 V VDS rating provides 3x margin over the 100 V telecom bus transient envelope, while 11 mOhm RDS(on) at VGS=10 V limits conduction loss to roughly 5 W at 20 A primary current. The DirectFET L8's dual-side cooling removes heat through both PCB copper and the top metal can, allowing sustained operation at 67 A with appropriate thermal design. The 11 nC total gate charge keeps gate-drive loss manageable at 200-300 kHz switching frequencies used in modern full-bridge and half-bridge topologies.
추천
Server & Datacom 48V Intermediate Bus Converter
In server and hyperscale datacom power shelves, the IRF7779L2TRPBF is well matched to 48 V to point-of-load bus converter primary stages. The 150 V breakdown withstands transient ringing caused by transformer leakage inductance and reflected load steps, while the 11 mOhm RDS(on) and 11 nC Qg combination yields a low figure-of-merit suitable for 200-500 kHz switching. DirectFET's metal-can drain terminal also reduces package parasitic inductance, limiting voltage overshoot and improving EMI margin in high-density server boards where layout area is constrained.
추천
Hot-Swap and eFuse Power Path Control
The IRF7779L2TRPBF acts as the in-line series MOSFET for -48 V telecom and 48 V datacom hot-swap controllers, where it must withstand sudden inrush currents without entering thermal runaway. The 11 mOhm RDS(on) drops only ~110 mV at 10 A continuous, well within typical hot-swap design budgets, while the 150 V VDS tolerates the doubled input voltage seen during load-dump transients. The 67 A continuous current rating supports 3-5x transient overload needed during board-capacitor charging, and the DirectFET L8 package's dual-side cooling simplifies thermal management in front-panel-board layouts.
추천
Industrial Brushless DC Motor Drive
In industrial BLDC motor drives operating on 48-100 V DC bus rails, the IRF7779L2TRPBF can serve as the low-side switch of a three-phase inverter. The 11 mOhm RDS(on) reduces conduction loss during the long low-side conduction interval of trapezoidal commutation, while the 67 A current rating covers multi-kW industrial servo applications. The DirectFET L8 package's 0.7 mm profile enables compact inverter modules, and the metal-can top contact allows direct attachment to an aluminum chassis heatsink for sustained high-current operation in industrial automation equipment.
추천
Lithium Battery Pack Discharge and Protection FET
The IRF7779L2TRPBF is well suited as the high-side or low-side discharge MOSFET in 48-96 V lithium-ion battery packs, where its 150 V VDS provides safety margin over nominal pack voltage and protects against back-EMF transients from regenerative loads. The 11 mOhm RDS(on) limits steady-state conduction loss during high-C discharge, and the 67 A continuous current supports sustained 2C-3C discharge rates common in e-mobility and industrial battery applications. DirectFET's mechanical robustness with no external leads also resists vibration and shock in mobile battery enclosures.
추천
Solar Inverter DC-Boost Stage
The IRF7779L2TRPBF can serve as the switching element in residential and small-commercial solar inverter DC-DC boost stages where the input DC bus ranges from 30-100 V. Its 150 V breakdown comfortably tolerates maximum-power-point transient overshoots, while the 11 mOhm RDS(on) reduces I^2R losses in continuous-current mode operation. The DirectFET L8's top-side thermal pad enables direct attachment to the inverter enclosure heatsink, supporting the long-term continuous conduction typical of solar MPPT operation in outdoor installations where ambient temperatures can reach 70C.
추천
추천 제품 요약
엔지니어링 참조 데이터: IRF7779L2TRPBF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | IRF7779L2TR1PBF | IRF7749L2TRPBF | AUIRF7759L2TR | IRF7799L2TRPBF |
|---|---|---|---|---|---|
| Package | DirectFET Isometric L8 | DirectFET Isometric L8 - same | DirectFET Isometric L8 - same | DirectFET Isometric L8 - same | DirectFET Isometric L8 - same |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| VDS max | 150 V | 150 V | 100 V | 40 V | 250 V |
| Automotive Grade (AEC-Q101) | No | No | No | Yes (AEC-Q101) | No |
주요 차별점
- Highest VDS rating in the DirectFET L8 family (vs IRF7749L2TRPBF)
- Only standard-grade (non-automotive) option above 100 V in DirectFET L8 (vs AUIRF7759L2TR)
- Identical silicon to the TR1 reel variant (vs IRF7779L2TR1PBF)
설계 노트
Estimated thermal analysis: at 67 A full load and VGS=10 V, conduction loss alone is I^2 x RDS(on) = 67^2 x 0.011 = 49 W using the maximum rating. With RthJC below 1 C/W, junction temperature rise above case is approximately 49C, putting Tj at 74C with Tc=25C - safe. However on a JEDEC EIA/JESD51 4-layer PCB without top-side heatsink, the practical continuous current is limited by the 3.3 W TA=25C power rating and a 45-55 C/W RthJA. Use a top-side heatsink clamped to the metal can to extract additional 30-50 W.
DirectFET L8 requires a precise land pattern with castellations acting as source connections. Use the Infineon recommended land pattern from the datasheet, not a D2PAK footprint - the metal can itself is the drain and must be soldered to a top-side copper pour. Side-cooling via thermal vias under the drain pad should be filled and plated for best thermal transfer. Do NOT route signals under the metal can - the drain floats at switching-node potential and couples capacitively into the layers below.
VGS(th) for HEXFET generation-5 silicon is typically 2-4 V, so a 5 V gate drive may not fully enhance the device - always use a 10 V gate-drive rail for the rated 11 mOhm RDS(on). Also ensure VGS never exceeds +/-20 V absolute maximum - gate-source ESD strikes are a common failure mode in hot-swap circuits. Add a 10 kOhm gate-source resistor to prevent floating-gate turn-on during high dV/dt transitions.
Minimize the high-side gate-drive loop area to limit parasitic inductance that can cause VGS ringing and shoot-through. Place the gate-drive IC within 5 mm of the gate pin, use a 10-22 Ohm gate resistor to dampen ringing, and route the gate return directly to the source castellations, NOT through a long ground path. For switching frequencies above 200 kHz, consider a kelvin-source connection via an extra source pin.
규정 준수 정보
Pb-free (PBF suffix) and RoHS compliant per Infineon product page. The 'AU' prefix variant (AUIRF7759L2TR) carries AEC-Q101 automotive qualification; the standard IRF7779L2TRPBF is industrial grade. DirectFET packages contain no exposed plastic leads, simplifying halogen-free compliance.
