M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
부품 번호: M1AFS1500-2FG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $502.92 | $502.92 |
| 10 | $478 | $4,780.00 |
| 100 | $452 | $45,200.00 |
| 500 | $428 | $214,000.00 |
| 1,000 | $405 | $405,000.00 |
M1AFS1500-2FG676I 개요
A flash-based FPGA (Field-Programmable Gate Array) is a reconfigurable logic device that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM. Unlike SRAM-based FPGAs, flash FPGAs are instant-on at power-up, do not require a boot device, and are inherently more resistant to configuration upset from radiation or single-event effects. Within the programmable-logic hierarchy, the Fusion family sits under Microsemi's (now Microchip Technology's) nonvolatile FPGA portfolio, alongside the ProASIC3 and Igloo families.
The defining differentiator of the Fusion family is integration of mixed-signal functionality: analog peripherals such as an on-chip ADC, clock conditioning circuits (CCC), and power-on-reset/reset supervision are integrated onto the same die as the digital fabric, allowing the device to replace a discrete microcontroller-plus-supervisory-logic cluster in power-management and monitoring applications. Fabric routing is supported by embedded flash-basedVersaTiles, and the device supports single-chip operation with no external configuration flash.
Architecturally, the 130nm CMOS flash process yields low static power and high configuration retention. The fabric is organized around the VersaTile, a three-input configurable logic block usable as logic or as RAM/registered logic, and embedded SRAM blocks provide on-chip buffering. Jotrin Electronics lists the device as FPGA Fusion Family, 1.5M gates, 130nm technology, 1.5V, 676-pin FBGA, supplied in trays.
Typical applications include industrial power-supply supervision and sequencing, smart-energy and utility metering, motor-control interface logic, aerospace and defense subsystems requiring instant-on secure operation, and medical instrumentation where a single mixed-signal device replaces MCU plus discrete analog supervisory circuitry.
A key design consideration is compliance: distributor data indicates this M1-prefixed (leaded) variant is RoHS non-compliant and contains lead, so it should be specified only for exemptions or legacy builds; the RoHS-compliant FGG equivalent is recommended for new designs.
This page synthesizes distributor pricing, stock availability, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: M1AFS1500-2FG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-2FG676I (동일 폼 팩터 및 풋프린트) — 차이점: Family, Process Technology, Package, System Gates, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
AFS1500-2FG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS1500-1FGG676I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-2FGG484I
✅ 드롭인✓ 재고 있음
$201.11 / 개
데이터시트 보기 →M1AFS1500-1FGG484
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-2FG676I 최대 정격 & 전기적 특성
| Family | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1.5 M |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | 2 |
| 패키지 | 676-ball FBGA (FG676) |
| 실장 유형 | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| 동작 온도 범위 | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | Not required |
| RoHS 상태 | RoHS Non-Compliant (contains lead) |
| Lead Free Status | Contains Lead |
| Packaging Method | Tray |
M1AFS1500-2FG676I 676-ball fbga (fg676) 핀 구성 가이드
M1AFS1500-2FG676I(676-ball fbga (fg676) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-2FG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-2FG676I 적합 용도: 6 애플리케이션s: Industrial Power-Supply Supervision, Smart Energy and Utility Metering, Motor Control Interface Logic, Aerospace and Defense Subsystems, Medical Instrumentation Control, Secure Industrial Networking Nodes.
Industrial Power-Supply Supervision
The M1AFS1500-2FG676I is well suited to power-supply supervision because the Fusion family uniquely integrates analog monitoring with digital logic on one die: the on-chip ADC samples multiple voltage and temperature channels, while power-on-reset and clock-conditioning circuitry provide deterministic startup. With 1.5M gates of instant-on flash fabric, the device implements sequencing, voltage-margining, and fault-logging state machines live within microseconds of power application - no external configuration flash boot delay exists. In a typical telecom rectifier or backplane power shelf, the FPGA reads ADC channels at the 1.5V-referenced analog front end, asserts enable signals to DC-DC converters, and shuts down rails on out-of-range conditions. Compared to an MCU-plus-supervisor cluster, the single-chip approach reduces BOM count and eliminates firmware timing races during brownout.
추천
Smart Energy and Utility Metering
Utility metering demands long service life, secure configuration, and analog acquisition - all Fusion strengths. The flash-based M1AFS1500-2FG676I retains its bitstream for the product lifetime without battery-backed configuration, and its on-chip ADC digitizes current-transformer and voltage-divider inputs for energy calculation in the 1.5M-gate fabric. The industrial temperature grade covers outdoor meter enclosures, and the 676-ball FBGA provides enough I/O for tariff display, communication (RS-485, PLC modem interface), and tamper-detection switches. Because configuration data is stored on-chip, the metering algorithm is not exposed on an external boot bus, hardening the device against code extraction. Instant-on behavior also ensures the meter is functional the moment line power appears, meeting regulatory wakeup requirements for tariff switching and load-control relays.
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Motor Control Interface Logic
In industrial drives and motion systems, the M1AFS1500-2FG676I bridges a host controller to gate drivers and feedback sensors. The 130nm flash fabric implements PWM generation, dead-time insertion, quadrature-encoder decoding, and safety interlocks, while the integrated ADC channel supports bus-voltage and heatsink-temperature monitoring without a separate supervisor IC. Speed grade 2 timing supports PWM carrier frequencies typical of industrial inverters, and the industrial temperature rating tolerates drive-cabinet environments. The instant-on flash configuration ensures safety interlocks are enforced from the first microseconds of power-up, an important consideration under functional-safety review. Using the 676-ball FBGA, designers can dedicate generous I/O banks to incremental encoders, absolute SSI feedback, and multiple PWM output phases in a single package on a single PCB footprint.
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Aerospace and Defense Subsystems
Microsemi programmable logic is widely deployed in defense and aerospace platforms, and the flash-based Fusion architecture addresses two key concerns: configuration upset resilience and instant-on operation. Because the M1AFS1500-2FG676I stores configuration in non-volatile on-chip flash, it does not lose function or present an unconfigured bus state after disturbance events the way SRAM FPGAs can, and there is no external bitstream load to intercept. The 1.5M-gate capacity suits interface bridging, telemetry formatting, and bus-protocol conversion (MIL-STD-1553-adjacent glue logic, UART/SPI arbitration) around a mission processor. Designers must verify the specific program-level qualification requirements, as this leaded commercial-grade variant is typically used in ground-based and lab systems rather than flight hardware, where RTAX-series antifuse devices are preferred.
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Medical Instrumentation Control
Diagnostic and laboratory instruments benefit from the M1AFS1500-2FG676I's combination of analog monitoring and digital glue logic on a single instant-on die. The integrated ADC reads front-end supply rails and detector temperatures, while the flash fabric implements sensor-interface sequencing, actuator control, and communication interfaces to the main compute platform. Non-volatile on-chip configuration simplifies compliance documentation because there is no removable or reprogrammable boot device whose contents could vary between units. The industrial temperature range comfortably covers clinical environments, and the fine-pitch FBGA supports the compact, low-profile PCB form factors typical of benchtop analyzers and handheld diagnostic bases. Instant-on behavior means the instrument's interlocks and rail monitors are active before any higher-voltage subsystem is energized, supporting patient-safety design reviews.
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Secure Industrial Networking Nodes
Field-deployed network and edge nodes require logic that is available immediately at power-up and resistant to configuration tampering. The M1AFS1500-2FG676I delivers both: on-chip flash configuration means the switch fabric, backhaul interface logic, or sensor-aggregation state machine is operational within microseconds, and the bitstream never appears on an external bus where it could be cloned. With 1.5M gates, the fabric implements multiple UART/SPI/I2C bridges, packet framing, watchdog supervision, and environmental monitoring via the on-chip ADC. The 676-ball FBGA supplies the I/O count needed for multi-port designs, and the industrial temperature grade supports unconditioned cabinets and roadside enclosures. The leaded package finish should be checked against the end-market RoHS profile, with FGG variants substituted where full compliance is mandatory.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-2FG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AFS1500-2FG676I | M1AFS1500-1FGG676I | M1AFS1500-2FGG484I | M1AFS1500-1FGG484 |
|---|---|---|---|---|---|
| Package | FBGA-676 (FG676) | FBGA-676 - same | FBGA-676 (FGG) - same footprint | FBGA-484 - smaller | FBGA-484 - smaller |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Speed Grade | 2 (fastest) | 2 | 1 (slower) | 2 | 1 (slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm | 130 nm | 130 nm | 130 nm |
| Temperature Range | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial/Industrial per suffix |
| Configuration | On-chip flash, instant-on | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Fastest speed grade within the same 676-ball footprint (vs M1AFS1500-1FGG676I)
- Maximum I/O count variant of the AFS1500 die (vs M1AFS1500-2FGG484I)
- Mixed-signal integration vs pure digital FPGAs (vs AFS1500-2FG676I)
설계 노트
Compliance first: distributor data (DigChip) marks this M1-prefixed part as RoHS non-compliant and lead-containing. Do not design it into EU-market consumer/industrial equipment unless an exemption applies. For new designs, select the FGG green variant of the same die (e.g., M1AFS1500-1FGG676I), which is pin-compatible in the same 676-ball footprint and eliminates the compliance exposure while requiring only a speed-grade timing recheck in the place-and-route timing report.
Power the Fusion device in the sequence documented in the Fusion datasheet power-supply section: core (1.5V), then analog, then I/O banks. Although the flash fabric is instant-on from the user's perspective, sequencing prevents I/O latch-up during ramp. Because the on-chip ADC and CCC share the analog supply rail, filter that rail with a ferrite bead plus bulk capacitance separate from the digital core supply to keep ADC noise low. Estimated: at 1.5M gates, static core current is typically in the tens-of-milliamps range on 130nm flash process; verify against the datasheet power calculator (Estimate - confirm with Microchip power estimator).
The FBGA-676 is a fine-pitch ball grid array requiring careful fan-out and stackup. Use a minimum 6-layer stackup with dedicated ground planes adjacent to signal layers; escape ball pitches with via-in-pad or dog-bone fan-out and keep equivalent series inductance short on ADC analog input balls. Reflow profiles must follow the leaded-solder profile for this M1 (Pb-containing) part - do not run an SAC305 lead-free profile over leaded balls, as wetting and joint reliability will suffer. Post-reflow, use X-ray inspection to verify ball collapse under the die area.
규정 준수 정보
Per DigChip datasheet summary: Lead Free Status - Contains Lead; RoHS Status - RoHS Non-Compliant. The M1 prefix denotes leaded package finish. REACH, halogen-free, and conflict-minerals status not stated in provided data.
